Abstract: A semiconductor structure is provided. The semiconductor structure includes a substrate containing a first active region in a first region of the substrate and a second active region in a second region of the substrate, a plurality of first gate structures over the first active region each including a first gate stack having a first high-k gate dielectric and a first gate electrode and first gate spacers surrounding the first gate stack, and a plurality of second gate structures over the second active region each including a second gate stack having a second high-k gate dielectric and a second gate electrode and second gate spacers surrounding the second gate stack. At least a portion of the second gate electrode comprises dopants.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: An apparatus includes a wafer stage and a particle removing assembly. The wafer stage includes a cup adjacent to a wafer chuck. The particle removing assembly is configured to remove contaminant particles from the cup. In some embodiments, the particle removing assembly comprises a flexible ejecting member that includes one or more elongated tubes, a front tip, and a cleaning tip adapter configured to attach the front tip to each of the one or more elongated tubes. The front tip includes front openings and lateral openings from which pressurized cleaning material are introduced onto an unreachable area of the cup to remove the contaminant particles from the cup.

Abstract: An electromagnetic interference shielding apparatus for a signal transceiver employs two folded-edge mechanisms coupled together and an adhesive. The electromagnetic interference shielding apparatus includes a metal cover, a chassis having a waveguide output hole, and an adhesive. A first combination portion having a first curved section is disposed on an edge of the metal cover. A second combination portion having a second curved section corresponding to the first combination portion is disposed on an edge of the chassis. The adhesive is used to combine the first combination portion and the second combination portion. The waveguide output hole outputs a signal transmitted by the signal transceiver. The first combination portion and the second combination portion form a curved space that is used with the adhesive to prevent leakage of the transmitted signal and the interference of external noises.