Patents by Inventor Fangliang YAN

Fangliang YAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OLED DISPLAY PANEL AND OLED DISPLAY DEVICE
    Publication number: 20220254838
    Abstract: Provided is an OLED display panel, the OLED display panel includes a touch layer, wherein the touch layer includes a via hole structure including: a first conductive layer, an interlayer insulating layer, and a second conductive layer that are sequentially arranged, wherein the interlayer insulating layer is provided with a via hole, the second conductive layer is overlapped with the first conductive layer by the via hole, and at least part of a surface, in contact with the second conductive layer, of the interlayer insulating layer is uneven; wherein the uneven surface has a roughness in a value range of 0.05d?r?0.19d, where r represents the roughness, and d represents a thickness of the interlayer insulating layer, the roughness of the uneven surface being a distance between a top of convex and a bottom of concave in the uneven surface.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 11, 2022
    Inventors: Lei Zhang, Daqing Sun, Wei Qiu, Fangliang Yan
  • Via hole structure, manufacturing method thereof, electronic device, and display device
    Patent number: 11335625
    Abstract: A via hole structure includes: a first conductive layer, an interlayer insulating layer, and a second conductive layer that are sequentially arranged, wherein the interlayer insulating layer is provided with a via hole, the second conductive layer is overlapped with the first conductive layer by the via hole, and at least part of a surface, in contact with the second conductive layer, of the interlayer insulating layer is uneven.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: May 17, 2022
    Assignees: Mianyang BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Lei Zhang, Daqing Sun, Wei Qiu, Fangliang Yan
  • VIA HOLE STRUCTURE, MANUFACTURING METHOD THEREOF, ELECTRONIC DEVICE, AND DISPLAY DEVICE
    Publication number: 20210225738
    Abstract: A via hole structure includes: a first conductive layer, an interlayer insulating layer, and a second conductive layer that are sequentially arranged, wherein the interlayer insulating layer is provided with a via hole, the second conductive layer is overlapped with the first conductive layer by the via hole, and at least part of a surface, in contact with the second conductive layer, of the interlayer insulating layer is uneven.
    Type: Application
    Filed: December 16, 2019
    Publication date: July 22, 2021
    Applicants: BOE Technology Group Co., Ltd., Mianyang BOE Optoelectronics Technology Co., Ltd.
    Inventors: Lei ZHANG, Daqing SUN, Wei QIU, Fangliang YAN