Abstract: Methods and systems are provided for detecting infectious pathogens in a saliva sample by using a Raman spectrometer to obtain Raman spectrum data of the saliva sample. A score is determined based on the Raman spectrum data using a machine learning, the score indicates whether an infectious pathogen is present in the saliva sample. In certain aspects, the methods and systems operate to determine if an individual is infected with COVID-19 based on Raman spectrum data of a saliva sample of the individual.

Abstract: Methods and systems are provided for detecting infectious pathogens in a saliva sample by using a Raman spectrometer to obtain Raman spectrum data of the saliva sample. A score is determined based on the Raman spectrum data using a machine learning, the score indicates whether an infectious pathogen is present in the saliva sample. In certain aspects, the methods and systems operate to determine if an individual is infected with COVID-19 based on Raman spectrum data of a saliva sample of the individual.

Abstract: A micro-cavity holder has an upper surface and a lower surface with a major recess in a generally cylindrical configuration. The major recess has an exterior periphery. The micro-cavity holder has a central aperture with a cylindrical central region and a lower region. A probe has a generally cylindrical configuration with an upper section and a lower section. The upper section has an exterior periphery removably received in the major recess to removably couple the probe and the micro-cavity holder. Cylindrical openings extend axially through the upper and lower sections of the probe and terminate above in a central recess. A transparent member is removably positioned in the central recess for receiving and supporting bodily fluids.

Abstract: An integrated plasma desmearing and plated-through-hole method to first plasma desmear a printed circuit board and then plate through the holes of the plated circuit board by sputtering. The method comprises serially transporting the printed circuit boards through a plurality of vacuum chambers serially interconnected together by means of a transport system. The transporting method comprises the steps of passing the printed circuit board from one vacuum chamber into the succeeding vacuum chamber in such a manner that the printed circuit board is progressively released from suspension by longitudinally transportable clips to span the distance to the aligned transport mechanism in the succeeding vacuum chamber to be progressively gripped by the clips thereof. Preferably, five vacuum chambers are provided including a loading chamber, a desmearing chamber, a plating preparation chamber, a plating chamber and an unloading chamber. Airtight isolation doors isolate each chamber from the others.

Abstract: An apparatus for laminating layers of a book composed of printed circuit layers and adhesive layers, the apparatus comprising a press having an upper and lower bolster plate positioned within a vacuum chamber. A platen assembly including a bookshelf and a chamber platen positioned apart from one another is positioned between the upper and lower bolster plates allowing the book to be placed on the bookshelf. Upon actuation of the press, the bookshelf and the chamber platen engage one another to compress the book positioned therebetween. The chamber platen may be heated or cooled.

Abstract: An integrated plasma desmearing and plated-through-hole apparatus for first plasma desmearing a printed circuit board and then plating through the holes of the plated circuit board by sputtering. The apparatus comprises a plurality of vacuum chambers serially interconnected together. Preferably, five vacuum chambers are provided including a loading chamber, a desmearing chamber, a plating preparation chamber, a plating chamber and an unloading chamber. Airtight isolation doors isolate each chamber from the others. A transport system is provided for serially transporting the printed circuit boards through the chambers.

Abstract: A lamination apparatus is disclosed which includes serially interconnected loading vacuum chamber, press vacuum chamber and an unloading vacuum chamber. An input transport system is positioned within the loading chamber to transport a printed circuit board book therefrom into the press chamber. An output transport system is likewise positioned in the unloading chamber to remove the printed circuit board book from within the press chamber into the unloading chamber for unloading. The loading and unloading vacuum chambers isolate the press positioned within the press chamber from atmospheric pressure as the printed circuit board books sequentially flow through the lamination apparatus.

Abstract: A method for laminating the layers of a printed circuit board book composed of printed circuit layers and adhesive layers, the method including loading the book between a pair of platens of a vacuum chamber, moving the platens together to a pre-specified distance apart, and allowing activation and curing of the adhesive layers at a pre-specified temperature and duration.

Abstract: A paired electrode for use in a plasma chamber. In one embodiment, the paired electrode comprises a plurality of angle members which are disposed parallel to one another. Pairs of the angle members are positioned facing one another, one functioning as a power electrode member and the other as a ground electrode member. All of the power electrode members are rigidly fastened to one another by means of a transverse power bus and all of the ground electrode members are rigidly fastened to one another by means of a transverse ground bus. The power bus and the ground bus are electrically connected to a power source, usually a RF power source and a ground of the plasma chamber, respectively. The plasma chamber contains a plurality of paired electrodes, and objects to be processed by plasma are placed between the paired electrodes.

Abstract: An apparatus and method for depositing a thin layer of material such as metal within the hole of an object such as a printed circuit board. The apparatus includes a gas diffusion chamber having a plurality of power electrodes with apertures positioned transversely therein. The objects to be treated, such as printed circuit boards, are positioned in the areas between the power electrodes. A supply of electrical energy is connected to the power electrodes and to the conductive layers of the printed circuit boards. The method of the invention comprises introducing desired gases into the chamber to flow transversely through the apertures in the power electrodes and the holes in the printed circuit boards such that the gases are excited to a plasma state to sputter a portion of the material constituting the power electrodes into the holes of the printed circuit boards.

Abstract: This invention is based on desmearing holes of multi-layered printed wiring boards by flowing plasma through the holes. Desmearing of plasma etching applies active gases to organic surfaces causing a cleaning reaction and removal of the smear.

Abstract: The present invention is directed to employing a rectilinear chamber for desmearing in which the two transitional ends are frustopyramidal in configuration. Each frustopyramidal diffusion chamber has a controlled exhaust valve which is piped to the vacuum pump. Gas can be introduced to the diffusion chamber at a point adjacent the exhaust valve and centrally therefrom. Ideally there are an odd number of electrode pairs spaced vertically which generate a primary field, and the further spaced apart pairs generating a secondary field therebetween. Because the chamber is rectilinear, it can be proportioned to accommodate vertically spaced MPWB's in the secondary chamber portions.