Patents by Inventor Federico Pio Centola

Federico Pio Centola has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermal Optimizations for OSFP Optical Transceiver Modules
    Publication number: 20230244046
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Application
    Filed: April 6, 2023
    Publication date: August 3, 2023
    Inventors: William F. Edwards, JR., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Thermal optimizations for OSFP optical transceiver modules
    Patent number: 11650384
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Grant
    Filed: February 9, 2022
    Date of Patent: May 16, 2023
    Assignee: Google LLC
    Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Thermal Optimizations for OSFP Optical Transceiver Modules
    Publication number: 20220269019
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Application
    Filed: February 9, 2022
    Publication date: August 25, 2022
    Inventors: William F. Edwards, JR., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Thermal optimizations for OSFP optical transceiver modules
    Patent number: 11249264
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: February 15, 2022
    Assignee: Google LLC
    Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Thermal Optimizations For OSFP Optical Transceiver Modules
    Publication number: 20220003946
    Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.
    Type: Application
    Filed: December 15, 2020
    Publication date: January 6, 2022
    Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
  • Electromagnetic interference (“EMI”) sheet attenuators
    Patent number: 10905038
    Abstract: An electromagnetic interference (“EMI”) sheet attenuator includes a planar conductive layer, a first flexible substrate and a second flexible substrate. The first flexible substrate overlies the metal backing layer and including a conductive pattern on a surface of the first flexible substrate. The second flexible substrate overlies the first flexible substrate and also includes the conductive pattern. The conductive pattern on the second flexible substrate is aligned with the conductive pattern on the first flexible substrate.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: January 26, 2021
    Assignee: Google LLC
    Inventors: Federico Pio Centola, Zuowei Shen, Xu Gao, Shawn Emory Bender, Melanie Beauchemin, Mark Villegas, Gregory Sizikov, Chee Yee Chung