Patents by Inventor Fei Chi

Fei Chi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11916803
    Abstract: A method includes: mapping a to-be-transmitted service flow to a virtual connection based on a mapping relationship between an identifier of the to-be-transmitted service flow and an identifier of the virtual connection; mapping the to-be-transmitted service flow to a virtual bearer based on a mapping relationship between the identifier of the virtual connection and an identifier of the virtual bearer; and mapping the to-be-transmitted service flow to a virtual bearer queue based on a mapping relationship between a quality of service characteristic identifier of the to-be-transmitted service flow and an identifier of the virtual bearer queue in the virtual bearer, to transmit the to-be-transmitted service flow to an OLT.
    Type: Grant
    Filed: April 22, 2022
    Date of Patent: February 27, 2024
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Fei Chi, Xifeng Wan, Yiming Wang
  • Publication number: 20220247692
    Abstract: A method includes: mapping a to-be-transmitted service flow to a virtual connection based on a mapping relationship between an identifier of the to-be-transmitted service flow and an identifier of the virtual connection; mapping the to-be-transmitted service flow to a virtual bearer based on a mapping relationship between the identifier of the virtual connection and an identifier of the virtual bearer; and mapping the to-be-transmitted service flow to a virtual bearer queue based on a mapping relationship between a quality of service characteristic identifier of the to-be-transmitted service flow and an identifier of the virtual bearer queue in the virtual bearer, to transmit the to-be-transmitted service flow to an OLT.
    Type: Application
    Filed: April 22, 2022
    Publication date: August 4, 2022
    Inventors: Fei Chi, Xifeng Wan, Yiming Wang
  • Patent number: 6942080
    Abstract: An electrical appliance includes a housing, an electric unit mounted within the housing, a winding unit mounted within the housing and including a reel member, an electrical wire connected electrically to the electric unit and wound around the reel member, and a latch unit engaging releasably the reel member to prevent the reel member from rotation in a winding direction of the reel member. The electrical wire has one end provided with a plug portion. The housing has at least one insert hole proximate to the latch unit for extension of the plug portion therethrough so as to press and disengage the latch unit from the reel member, thereby permitting the winding unit to wind the electrical wire.
    Type: Grant
    Filed: December 4, 2003
    Date of Patent: September 13, 2005
    Assignee: Tsann Kuen Enterprise Co., Ltd.
    Inventor: Shang-Fei Chi
  • Publication number: 20050121276
    Abstract: An electrical appliance includes a housing, an electric unit mounted within the housing, a winding unit mounted within the housing and including a reel member, an electrical wire connected electrically to the electric unit and wound around the reel member, and a latch unit engaging releasably the reel member to prevent the reel member from rotation in a winding direction of the reel member. The electrical wire has one end provided with a plug portion. The housing has at least one insert hole proximate to the latch unit for extension of the plug portion there through so as to press and disengage the latch unit from the reel member, thereby permitting the winding unit to wind the electrical wire.
    Type: Application
    Filed: December 4, 2003
    Publication date: June 9, 2005
    Inventor: Shang-Fei Chi
  • Patent number: 5747365
    Abstract: An improved method for grinding a semiconductor chip to prepare it for scanning with SEM to view a defect includes the step of forming an electrically conductive coating on the top surface of the chip. The coating is made under a mask that produces a U shaped conductive pattern so that an electrical path is formed on the top surface of the chip between two corners of the pattern. An initial resistance measurement is made for this path and a known amount of the chip below the U shape is ground away and a second resistance measurement is made. From these measurements, a calculation is made that gives the resistance when the chip has been ground to a selected section line. The grinding operation then proceeds until this resistance is reached, and the usual practice of visually checking the chip during the grinding operation is avoided. The mask creates a point at the bottom of the U shape that points to the defect.
    Type: Grant
    Filed: August 1, 1996
    Date of Patent: May 5, 1998
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wonder D. Wang, Shean-Ren Horng, Fei-Chi Huang