Abstract: A photolithography tool and a method for compensating for surface deformation in a carrier of the photolithography tool are disclosed. In the photolithography tool, carrier surface deformation compensation elements are provided at the bottom of the carrier, which are capable of compensating for the surface deformation in the carrier. In the method, the surface deformation is detected by carrier surface deformation detection modules, and an automated closed-loop controller controls compensating forces exerted by the carrier surface deformation compensation elements based on the detected deformation. This allows more accurate compensation for the carrier surface deformation.

Abstract: A photolithography tool and a method for compensating for surface deformation in a carrier of the photolithography tool are disclosed. In the photolithography tool, carrier surface deformation compensation elements are provided at the bottom of the carrier, which are capable of compensating for the surface deformation in the carrier. In the method, the surface deformation is detected by carrier surface deformation detection modules, and an automated closed-loop controller controls compensating forces exerted by the carrier surface deformation compensation elements based on the detected deformation. This allows more accurate compensation for the carrier surface deformation.

Abstract: A fine-motion module for use in a wafer stage of a photolithography tool includes: a base (201); a fine-motion plate (210); a plurality of vertical motors (203), fixed between the base and the fine-motion plate; a plurality of gravity compensators (202), each having one end fixed on the base and the other end configured to support the fine-motion plate; a plurality of absolute-position sensors (205, 211), configured to measure an absolute position of the fine-motion plate and to adjust pressures in the gravity compensators based on the obtained absolute-position measurements such that the absolute position of the fine-motion plate is changed to a predetermined initial vertical position; and a plurality of relative-position sensors (204, 207), configured to measure a relative position of the fine-motion plate to the base and to control the fine-motion plate based on the obtained relative-position measurements, thereby moving the fine-motion plate to a relative zero position.

Abstract: A fine-motion module for use in a wafer stage of a photolithography tool includes: a base (201); a fine-motion plate (210); a plurality of vertical motors (203), fixed between the base and the fine-motion plate; a plurality of gravity compensators (202), each having one end fixed on the base and the other end configured to support the fine-motion plate; a plurality of absolute-position sensors (205, 211), configured to measure an absolute position of the fine-motion plate and to adjust pressures in the gravity compensators based on the obtained absolute-position measurements such that the absolute position of the fine-motion plate is changed to a predetermined initial vertical position; and a plurality of relative-position sensors (204, 207), configured to measure a relative position of the fine-motion plate to the base and to control the fine-motion plate based on the obtained relative-position measurements, thereby moving the fine-motion plate to a relative zero position.