Abstract: An apparatus for the mounting of semiconductor chips comprises a bondhead with a pick-up tool with a longitudinal drill hole to which vacuum can be applied for the gripping and transport of a semiconductor chip. To detect whether the pick-up tool has gripped the semiconductor chip, a body with a reflecting surface is arranged in the longitudinal drill hole of the pick-up tool which, when passing over the light source on absence of the semiconductor chip deflects light shining from underneath into the longitudinal drill hole of the pick-up tool into a horizontal plane. The pick-up tool has locations which are pervious to the deflected light of the light source. At least one optical element is arranged on the bondhead which concentrates at least part of the deflected light emerging laterally from the pick-up tool onto a photosensor.

Abstract: The picking of a semiconductor chip from a foil takes place by means of a chip gripper which bears on a bondhead and can be deflected in a predetermined direction and with the aid of a needle. An inductive sensor serves the precise measurement of the deflection of the chip gripper with reference to the bondhead.

Abstract: With the mounting of a semiconductor chip onto a substrate having a portion of adhesive the bondhead is lowered to a predetermined height H above a support holding the substrate. At the same time, the pick-up tool is fixed in an upper limit position on the bondhead. As soon as the bondhead has reached the height H, the fixing of the pick-up tool is released so that the pick-up tool moves downwards from the upper limit position and presses the semiconductor chip onto the adhesive. After a predetermined time after releasing the fixing of the pick-up tool, the bondhead is raised and moved away. With a bondhead particularly suited for the method, the pick-up tool and the bondhead are connected by means of a chamber to which compressed air and/or vacuum can be applied so that, to a large extent, the movement of the pick-up tool can be controlled.

Abstract: An apparatus for the mounting of semiconductor chips comprises a bondhead with a pick-up tool with a longitudinal drill hole to which vacuum can be applied for the gripping and transport of a semiconductor chip. To detect whether the pick-up tool has gripped the semiconductor chip, a body with a reflecting surface is arranged in the longitudinal drill hole of the pick-up tool which, when passing over the light source on absence of the semiconductor chip deflects light shining from underneath into the longitudinal drill hole of the pick-up tool into a horizontal plane. The pick-up tool has locations which are pervious to the deflected light of the light source. At least one optical element is arranged on the bondhead which concentrates at least part of the deflected light emerging laterally from the pick-up tool onto a photosensor.

Abstract: With the mounting of a semiconductor chip onto a substrate having a portion of adhesive the bondhead is lowered to a predetermined height H above a support holding the substrate. At the same time, the pick-up tool is fixed in an upper limit position on the bondhead. As soon as the bondhead has reached the height H, the fixing of the pick-up tool is released so that the pick-up tool moves downwards from the upper limit position and presses the semiconductor chip onto the adhesive. After a predetermined time after releasing the fixing of the pick-up tool, the bondhead is raised and moved away.