Abstract: In one or more embodiments, a fan circuit may be configured with an input of a first amplifier coupled to a revolution indicator associated with a fan; an output of the first amplifier coupled to an input of a second amplifier; and a power supply input of the second amplifier coupled to a first contact of a first connector. In one or more embodiments, the first contact of the first connector may be coupled to a first contact of a second connector to drive a resistive load coupled to the first contact of the second connector; a second contact of the first connector may be coupled to a second contact of the second connector to provide a reference voltage to the second amplifier; and the second amplifier may provide amplified signals to the first contact of the first connector based at least on signals received from the revolution indicator.

Abstract: The present application provides a semiconductor device and the method of making the same. The method includes recessing a fin extending from a substrate, forming a base epitaxial feature on the recessed fin, forming a bar-like epitaxial feature on the base epitaxial feature, and forming a conformal epitaxial feature on the bar-like epitaxial feature. The forming of the bar-like epitaxial feature includes in-situ doping the bar-like epitaxial feature with an n-type dopant at a first doping concentration. The forming of the conformal epitaxial feature includes in-situ doping the conformal epitaxial feature with a second doping concentration greater than the first doping concentration.

Abstract: In one or more embodiments, a fan circuit may be configured with an input of a first amplifier coupled to a revolution indicator associated with a fan; an output of the first amplifier coupled to an input of a second amplifier; and a power supply input of the second amplifier coupled to a first contact of a first connector. In one or more embodiments, the first contact of the first connector may be coupled to a first contact of a second connector to drive a resistive load coupled to the first contact of the second connector; a second contact of the first connector may be coupled to a second contact of the second connector to provide a reference voltage to the second amplifier; and the second amplifier may provide amplified signals to the first contact of the first connector based at least on signals received from the revolution indicator.

Abstract: A data storage device carrier system includes a carrier configured to support one or more data storage devices, a backplane, including one or more coupling connector devices configured to electrically couple with a motherboard, and an interposer board operable to couple a plurality of the data storage devices supported by the carrier with the backplane. In an embodiment, the one or more coupling connector devices are operable to transfer communication signals and electrical power. The interposer board is operable to provide the electrical power from a single port on the backplane to each of the plurality of the data storage devices. The interposer board is also operable to pass communication signals between a primary port on the backplane to a first one of the plurality of the data storage devices, and to pass communication signals between a secondary port on the backplane to a second one of the plurality of the data storage devices.

Abstract: A data storage device carrier system includes a carrier configured to support one or more data storage devices, a backplane, including one or more coupling connector devices configured to electrically couple with a motherboard, and an interposer board operable to couple a plurality of the data storage devices supported by the carrier with the backplane. In an embodiment, the one or more coupling connector devices are operable to transfer communication signals and electrical power. The interposer board is operable to provide the electrical power from a single port on the backplane to each of the plurality of the data storage devices. The interposer board is also operable to pass communication signals between a primary port on the backplane to a first one of the plurality of the data storage devices, and to pass communication signals between a secondary port on the backplane to a second one of the plurality of the data storage devices.

Abstract: A data storage device carrier system includes a carrier configured to support one or more data storage devices, a backplane, including one or more coupling connector devices configured to electrically couple with a motherboard, and an interposer board operable to couple a plurality of the data storage devices supported by the carrier with the backplane. In an embodiment, the one or more coupling connector devices are operable to transfer communication signals and electrical power. The interposer board is operable to provide the electrical power from a single port on the backplane to each of the plurality of the data storage devices. The interposer board is also operable to pass communication signals between a primary port on the backplane to a first one of the plurality of the data storage devices, and to pass communication signals between a secondary port on the backplane to a second one of the plurality of the data storage devices.

Abstract: An white-light emitting device including a carrier, light emitting diode (LED) chips, and a wavelength converting material is provided. The LED chips are disposed on and electrically connected to the carrier. An equivalent wavelength of the first light emitted from the LED chips and divided into groups is ?. A variation of peak wavelengths of the LED chips in one group is smaller than 5 nm. ? meets an equation: ? = ? 1 n ? ( ? ? ? i × Ni × Ki ) ? 1 n ? Ni × Ki n is an integer equal to or larger than 2. ?i, Ni, and Ki are respectively an average peak wavelength, an quantity, and an average output efficiency of the LED chips in one group. The variation of ?i in different groups is ??i. 5 nm???i?30 nm. The wavelength converting material is excited by the first light to emit a second light. The first light and the second light are mixed to generate a white light.

Abstract: A data storage device carrier system includes a carrier configured to support one or more data storage devices, a backplane, including one or more coupling connector devices configured to electrically couple with a motherboard, and an interposer board operable to couple a plurality of the data storage devices supported by the carrier with the backplane. In an embodiment, the one or more coupling connector devices are operable to transfer communication signals and electrical power. The interposer board is operable to provide the electrical power from a single port on the backplane to each of the plurality of the data storage devices. The interposer board is also operable to pass communication signals between a primary port on the backplane to a first one of the plurality of the data storage devices, and to pass communication signals between a secondary port on the backplane to a second one of the plurality of the data storage devices.

Abstract: A bump layout on the active region of a driver IC for increasing overall bump count. The layout fits IC packages that have a narrow and long body profile. Bumps are positioned close to the long side and central regions of the active region so that low marking pressure on the shorter sides of the package during chip-glass bondage is avoided. Dummy bumps may also be positioned close to the shorter sides of the package so that pressure distribution is optimized during chip-glass bondage.

Abstract: A bump layout on the active region of a driver IC for increasing overall bump count. The layout fits IC packages that have a narrow and long body profile. Bumps are positioned close to the long side and central regions of the active region so that low marking pressure on the shorter sides of the package during chip-glass bondage is avoided. Dummy bumps may also be positioned close to the shorter sides of the package so that pressure distribution is optimized during chip-glass bondage.

Abstract: A LCD panel driving circuit, comprising a gate driver for outputting a scan signal, a data driver for outputting a video signal, a switch circuit, and a temperature sensor. The temperature sensor detects the operating temperature of the LCD panel to determine whether or not the detected temperature is over a switch temperature and produces a selection signal. The switch selects a 1-line dot inversion control signal or a 2-line dot inversion control signal according to the selection signal and outputs a polar control signal, thereby controlling the selection of the outputted video signal polarity.

Abstract: A bump layout on the active region of a driver IC for increasing overall bump count. The layout fits IC packages that have a narrow and long body profile. Bumps are positioned close to the long side and central regions of the active region so that low marking pressure on the shorter sides of the package during chip-glass bondage is avoided. Dummy bumps may also be positioned close to the shorter sides of the package so that pressure distribution is optimized during chip-glass bondage.

Abstract: A LCD panel driving circuit, comprising a gate driver for outputting a scan signal, a data driver for outputting a video signal, a switch circuit, and a temperature sensor. The temperature sensor detects the operating temperature of the LCD panel to determine whether or not the detected temperature is over a switch temperature and produces a selection signal. The switch selects a 1-line dot inversion control signal or a 2-line dot inversion control signal according to the selection signal and outputs a polar control signal, thereby controlling the selection of the outputted video signal polarity.