Patents by Inventor Feng Dou

Feng Dou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942791
    Abstract: A self-powered wireless keyboard by modifying the structure of a traditional membrane keyboard having a volcanic crater structure. Not damaging the original membrane keyboard structure, a micro magnet core is installed inside a cylindrical protrusion block under the key cap as a mover of the induction power generation device, and an induction coil is wound in a key slot of the keyboard base as the stator of the induction power generation device. In this way, when each key is pressed, it will produce induction current. A layer of flexible solar cell can be laid on the upper surface of the key, which can generate electricity by collecting the light energy in the surrounding environment during the time of daily illumination.
    Type: Grant
    Filed: September 26, 2021
    Date of Patent: March 26, 2024
    Assignee: Beijing Institute of Technology
    Inventors: Fang Deng, Yanxin Ji, Xinyu Fan, Yeyun Cai, Chengwei Mi, Feng Gao, Jie Chen, Lihua Dou
  • Patent number: 10497791
    Abstract: The present disclosure relates to the technical field of semiconductors, and discloses a semiconductor device and a manufacturing method therefor. The manufacturing method includes: providing a semiconductor structure, where the semiconductor structure includes an active region and a gate structure located in the active region, the gate structure at least including a gate electrode, and the active region exposing an upper surface of the gate electrode; forming a surface insulator layer on the upper surface of the gate electrode; forming a patterned interlayer dielectric layer on the semiconductor structure, where the interlayer dielectric layer covers the surface insulator layer, and has a first through hole exposing a portion of the active region; and forming a conductive contact layer passing through the first through hole and contacting with the active region.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: December 3, 2019
    Assignees: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Xianming Zhang, Ling Tang, Leibin Yuan, Feng Dou, Feng Chen
  • Publication number: 20190252194
    Abstract: The present disclosure relates to the technical field of semiconductors, and discloses a semiconductor device and a manufacturing method therefor. The manufacturing method includes: providing a semiconductor structure, where the semiconductor structure includes an active region and a gate structure located in the active region, the gate structure at least including a gate electrode, and the active region exposing an upper surface of the gate electrode; forming a surface insulator layer on the upper surface of the gate electrode; forming a patterned interlayer dielectric layer on the semiconductor structure, where the interlayer dielectric layer covers the surface insulator layer, and has a first through hole exposing a portion of the active region; and forming a conductive contact layer passing through the first through hole and contacting with the active region.
    Type: Application
    Filed: April 23, 2019
    Publication date: August 15, 2019
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Xianming Zhang, Ling Tang, Leibin Yuan, Feng Dou, Feng Chen
  • Patent number: 10312093
    Abstract: The present disclosure relates to the technical field of semiconductors, and discloses a semiconductor device and a manufacturing method therefor. The manufacturing method includes: providing a semiconductor structure, where the semiconductor structure includes an active region and a gate structure located in the active region, the gate structure at least including a gate electrode, and the active region exposing an upper surface of the gate electrode; forming a surface insulator layer on the upper surface of the gate electrode; forming a patterned interlayer dielectric layer on the semiconductor structure, where the interlayer dielectric layer covers the surface insulator layer, and has a first through hole exposing a portion of the active region; and forming a conductive contact layer passing through the first through hole and contacting with the active region.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: June 4, 2019
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventors: Xianming Zhang, Ling Tang, Leibin Yuan, Feng Dou, Feng Chen
  • Publication number: 20180277644
    Abstract: The present disclosure relates to the technical field of semiconductors, and discloses a semiconductor device and a manufacturing method therefor. The manufacturing method includes: providing a semiconductor structure, where the semiconductor structure includes an active region and a gate structure located in the active region, the gate structure at least including a gate electrode, and the active region exposing an upper surface of the gate electrode; forming a surface insulator layer on the upper surface of the gate electrode; forming a patterned interlayer dielectric layer on the semiconductor structure, where the interlayer dielectric layer covers the surface insulator layer, and has a first through hole exposing a portion of the active region; and forming a conductive contact layer passing through the first through hole and contacting with the active region.
    Type: Application
    Filed: November 22, 2017
    Publication date: September 27, 2018
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Xianming Zhang, Ling Tang, Leibin Yuan, Feng Dou, Feng Chen