Patents by Inventor Feng Feng

Feng Feng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030071129
    Abstract: A manufacturing method of a module card comprises steps of: providing a base board having a golden finger; mounting a chip on the base board for electrically connecting to the golden finger; and forming a packing layer on the chip for forming the module card. A module card comprises: a base board; a chip mounting on a surface of the base board; a golden finger on the board and electrically connecting to the chip; and a packing layer forming on the chip for covering the chip.
    Type: Application
    Filed: December 4, 2001
    Publication date: April 17, 2003
    Inventors: Mon Nan Ho, Hsiu Wen Tu, Kuo Feng Feng, Yung Sheng Chiu, Joe Liu, Nai Hua Yeh, Wen Chuan Chen, Allis Chen
  • Patent number: 6364132
    Abstract: A bookshelf including a pair of side plates, a back plate, and a bottom plate being spaced from the back plate by a transverse opening and one or more sliding dividers each including a substantially L-shaped attachment member. The back plate is at a predetermined angle with respect to a vertical axis, the bottom plate is at the same predetermined angle with respect to a vertical axis.
    Type: Grant
    Filed: October 13, 2000
    Date of Patent: April 2, 2002
    Inventor: Yuan Feng Feng
  • Patent number: 6231381
    Abstract: An insulative housing of a PCMCIA card connector includes a header defining a plurality of passageways therein. The passageways are exposed to a rear face of the header for allowing contact elements to be inserted therein from the rear face. The header has a top face forming a post and an opposite bottom face defining a corresponding bore. The post pivotally supports a rocking arm of a card ejection mechanism for releasing a PCMCIA card from the connector. A number of insulative housings may be vertically stacked and precisely positioned with respect to each other by inserting the post of a lower housing into the bore of an upper housing thereby aligning the passageways of the housings. Contact elements fixed to a carrier strip and equally spaced therealong are simultaneously inserted into the passageways of the housings thereby enhancing the efficiency of assembling the PCMCIA card connectors.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: May 15, 2001
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Ming-Lun Kuo, Hsiang-Feng Feng
  • Patent number: 6162215
    Abstract: An infrared rays cauterizing structure is composed of a base, locating devices, fixed cauterizers and a hand-held cauterizer. In light of locating devices, the cauterizers can be located in proximity of a specific point of the human body without attendance of a medical personnel. The base is provided in the interior thereof with a plurality of temperature controllers and timers for regulating the treatment temperature and the treatment duration of a heater of the cauterizers. The heater is capable of bringing about a predetermined energy for treating disease or relieving pain of the specific point of the body of a patient under treatment.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: December 19, 2000
    Inventor: Yuan Feng Feng
  • Patent number: 4711743
    Abstract: A process for the production of anthraquinone-1-sulphonic acid by sulphonating anthraquinone with a sulphonating agent in the presence of palladium catalyst in a solvent, is characterized in that before sulphonation, the palladium is mixed with nitric acid or mineral acids containing nitric acid at room temperature and then the acid is removed from the treated palladium. Preferably, the sulphonating agent of 1-10% SO.sub.3 is first mixed with the nitric acid treated palladium as a solvent, and the same sulphonating agent of 50-65% SO.sub.3 is added for sulphonation at about 90-100 degs. C.
    Type: Grant
    Filed: January 21, 1987
    Date of Patent: December 8, 1987
    Assignee: 501 China Technical Consultants, Inc.
    Inventor: Feng-Feng Wey