Abstract: A wafer-level full-color display device and a method for manufacturing the same are provided. In the method, a plurality of LED structures arranged into an array and a peripheral electrode layer surrounding the LED structures are formed on a front side of a wafer substrate. Next, one or more insulating layers are formed to flatten the stepped difference of each of the LED structures and fill up the height difference between the LED structures and the wafer substrate. Afterwards, conductive lines are formed on the one or more insulating layers to provide a reliable electrical connection between the LED structures and the peripheral electrode layer.

Abstract: A water filter cartridge having an ultraviolet sterilizing function and a water purifier are provided. The water filter cartridge includes a housing, a filtering component, a plurality of flow channels, and an ultraviolet module. The housing has an upper chamber and a lower chamber in fluid communication with the upper chamber. The filtering component is disposed in the upper chamber. The flow channels are arranged in the lower chamber and stacked in a multi-layered arrangement. The ultraviolet module includes an ultraviolet light emitting element disposed in the lower chamber.

Abstract: A planar multi-chip device includes a base structure and a plurality of functional chips. The base structure has a central area and a peripheral area outside the central area. The central area includes a first conductive portion arranged therein. The peripheral area includes a plurality of second conductive portions and a plurality of third conductive portions arranged therein and separated from each other. The functional chips are arranged on the base structure, and each of the functional chips has a portion located on and electrically connected to the first conductive portion. At least two of the functional chips are configured to be in signal communication with each other via at least one of the third conductive portions.

Abstract: A vertical type multi-chip device includes a base structure, an intermediate layer, a first functional chip, and a second functional chip. The intermediate layer is disposed on the base structure and has a first signal transmission path and a second signal transmission path. The first functional chip is embedded in the intermediate layer and electrically connected to the base structure. The second functional chip is disposed on the intermediate layer and configured to be electrically connected to the first functional chip via the first signal transmission path and to the base structure via the second signal transmission path.

Abstract: An LED display screen module includes a module substrate and a plurality of LED package structures. The LED package structures are disposed on the module substrate and arranged into an array. Each of the LED package structures includes a plurality of pixels and a packaging layer. The pixels are spaced apart from each other. The packaging layer includes a plurality of packaging portions and a plurality of connecting portions. The packaging portions respectively cover the pixels, and each of the connecting portions is connected between the adjacent two packaging portions. Each of the packaging portions has an upper light emitting surface and a lateral light emitting surface. The upper light emitting surface is a flat surface and is connected to the lateral light emitting surface via a transitional curved surface.

Abstract: The application is related to a UV LED package structure for improving light extraction efficiency. An UV LED chip is set on a substrate with an anti-flare film for increasing upward light extraction to concentrate the emitted light by an optical element. Because no glue is filled between the UV LED chip and the optical element, it will be prevented the glue from spoiling and deteriorating by the UV light from the UV LED chip. Thereby, the UV LED package structure can prevent from the light performance reducing.

Abstract: An LED display screen module includes a module substrate and a plurality of LED package structures. The LED package structures are disposed on the module substrate and arranged into an array. Each of the LED package structures includes a plurality of pixels and a packaging layer. The pixels are spaced apart from each other. The packaging layer includes a plurality of packaging portions and a plurality of connecting portions. The packaging portions respectively cover the pixels, and each of the connecting portions is connected between the adjacent two packaging portions. Each of the packaging portions has an upper light emitting surface and a lateral light emitting surface. The upper light emitting surface is a flat surface and is connected to the lateral light emitting surface via a transitional curved surface.

Abstract: The application is related to a UV LED package structure for improving light extraction efficiency. An UV LED chip is set on a substrate with an anti-flare film for increasing upward light extraction to concentrate the emitted light by an optical element. Because no glue is filled between the UV LED chip and the optical element, it will be prevented the glue from spoiling and deteriorating by the UV light from the UV LED chip. Thereby, the UV LED package structure can prevent from the light performance reducing.

Abstract: A movable display device includes a carrying module, a lifting module, a frame module and a display module. The carrying module includes a carrier unit, a base unit disposed on the carrier unit, and a plurality of positioning units disposed on the carrier unit. The lifting module is disposed on the base unit. The frame module includes a primary frame unit movably connected to the positioning units and a plurality of secondary frame units movably connected to the primary frame unit. The primary frame unit has a connecting portion connected to the lifting module. The secondary frame units are respectively located at two sides of the primary frame unit. The display module includes a primary display unit disposed on the primary frame unit and a plurality of secondary display units respectively disposed on the secondary frame units.

Abstract: A movable display device includes a carrying module, a lifting module, a frame module and a display module. The carrying module includes a carrier unit, a base unit disposed on the carrier unit, and a plurality of positioning units disposed on the carrier unit. The lifting module is disposed on the base unit. The frame module includes a primary frame unit movably connected to the positioning units and a plurality of secondary frame units movably connected to the primary frame unit. The primary frame unit has a connecting portion connected to the lifting module. The secondary frame units are respectively located at two sides of the primary frame unit. The display module includes a primary display unit disposed on the primary frame unit and a plurality of secondary display units respectively disposed on the secondary frame units.

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.

Abstract: A light emission module is provided. The light emission module includes a substrate, a plurality of LED chips disposed on the substrate, a fluorescent colloid and a package colloid surrounding the plurality of LED chips. The substrate includes a substrate body and a plurality of chip pads disposed thereon for carrying the LED chips. A plurality of via holes is formed passing through the chip pads and the substrate body to enhance the heat dissipation of the LED chips. The fluorescent colloid and the package colloid both have light guide structures to improve the color stability and the capacity to process the light shape of the light emission module.