Patents by Inventor Feng-Neng Hsiao

Feng-Neng Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-phase heat transfer structure
    Patent number: 6702003
    Abstract: A three-phase heat transfer structure includes a heat conducting plate, a heat sink mounted on the heat conducting plate near one end, a thermal tube embedded in and extended through two distal ends of the heat conducting plate, and a phase change material filled in recessed receiving spaces in the heat conducting plate near one end remote from the heat sink and adapted to accumulate heat energy absorbed by the heat conducting plate from a heat source.
    Type: Grant
    Filed: October 15, 2002
    Date of Patent: March 9, 2004
    Assignee: Quanta Computer Inc.
    Inventors: Feng-Neng Hsiao, Meng-Cheng Huang
  • Three-phase heat transfer structure
    Publication number: 20030221812
    Abstract: A three-phase heat transfer structure includes a heat conducting plate, a heat sink mounted on the heat conducting plate near one end, a thermal tube embedded in and extended through two distal ends of the heat conducting plate, and a phase change material filled in recessed receiving spaces in the heat conducting plate near one end remote from the heat sink and adapted to accumulate heat energy absorbed by the heat conducting plate from a heat source.
    Type: Application
    Filed: October 15, 2002
    Publication date: December 4, 2003
    Applicant: Quanta Computer Inc.
    Inventors: Feng-Neng Hsiao, Meng-Cheng Huang