Patents by Inventor Feng-Wei Dai

Feng-Wei Dai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9162893
    Abstract: A method for making a carbon nanotube composite preform includes following steps. A substrate is provided. Carbon nanotubes are formed on the substrate. The carbon nanotubes and the substrate are placed in a solvent for a predetermined time. The carbon nanotubes and the substrate are drawn from the solvent. The carbon nanotubes and the substrate are dried.
    Type: Grant
    Filed: August 5, 2013
    Date of Patent: October 20, 2015
    Assignees: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Hai-Zhou Guo, Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Chang-Hong Liu, Kai-Li Jiang
  • Patent number: 8900541
    Abstract: An apparatus for manufacturing a carbon nanotube heat sink includes a board, and a number of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: December 2, 2014
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Yuan Yao, Feng-Wei Dai, Kai-Li Jiang, Chang-Hong Liu, Liang Liu
  • Publication number: 20140102687
    Abstract: A thermal interface material includes a low melting point metal matrix and a number of carbon nanotube arrays disposed in the low melting point matrix. The low melting point metal matrix includes a first surface and a second surface opposite to the first surface. Each carbon nanotube array includes a number of carbon nanotubes substantially parallel to each other. A number of first interspaces are defined between adjacent carbon nanotube arrays. The carbon nanotubes of the carbon nanotube arrays extend from the first surface to the second surface.
    Type: Application
    Filed: December 17, 2013
    Publication date: April 17, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., Tsinghua University
    Inventors: FENG-WEI DAI, YUAN YAO, YOU-SEN WANG, JI-CUN WANG, HUI-LING ZHANG
  • Patent number: 8642121
    Abstract: A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.
    Type: Grant
    Filed: October 8, 2009
    Date of Patent: February 4, 2014
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Feng-Wei Dai, Yuan Yao, You-Sen Wang, Ji-Cun Wang, Hui-Ling Zhang
  • Publication number: 20130316093
    Abstract: A method for making a carbon nanotube composite preform includes following steps. A substrate is provided. Carbon nanotubes are formed on the substrate. The carbon nanotubes and the substrate are placed in a solvent for a predetermined time. The carbon nanotubes and the substrate are drawn from the solvent. The carbon nanotubes and the substrate are dried.
    Type: Application
    Filed: August 5, 2013
    Publication date: November 28, 2013
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., TSINGHUA UNIVERSITY
    Inventors: HAI-ZHOU GUO, FENG-WEI DAI, YUAN YAO, CHANG-SHEN CHANG, CHANG-HONG LIU, KAI-LI JIANG
  • Patent number: 8530052
    Abstract: A carbon nanotube composite preform includes a substrate and a plurality of carbon nanotubes formed thereon. Each carbon nanotube includes a first end adjacent to the substrate and a second end away from the substrate. Gaps between the second ends of the carbon nanotubes are bigger than gaps between the first ends thereof. The method for making the carbon nanotube composite preform includes the following steps: (a) providing a substrate; (b) forming a plurality of carbon nanotubes (e.g., a carbon nanotube array) on the substrate; (c) placing the carbon nanotubes and the substrate in a solvent for some time; (d) removing the carbon nanotubes and the substrate from the solvent; (e) drying the carbon nanotubes and the substrate to form a carbon nanotube composite preform.
    Type: Grant
    Filed: December 14, 2007
    Date of Patent: September 10, 2013
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Hai-Zhou Guo, Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Chang-Hong Liu, Kai-Li Jiang
  • Patent number: 8437136
    Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: May 7, 2013
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
  • Publication number: 20130026339
    Abstract: An apparatus for manufacturing a carbon nanotube heat sink includes a board, and a number of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes.
    Type: Application
    Filed: October 9, 2012
    Publication date: January 31, 2013
    Inventors: YUAN YAO, FENG-WEI DAI, KAI-LI JIANG, CHANG-HONG LIU, LIANG LIU
  • Patent number: 8309051
    Abstract: The present disclosure provides an apparatus for manufacturing a carbon nanotube heat sink. The apparatus includes a board, and a plurality of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes. A method for manufacturing multiple carbon nanotube heat sinks is also provided.
    Type: Grant
    Filed: October 30, 2009
    Date of Patent: November 13, 2012
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Yuan Yao, Feng-Wei Dai, Kai-Li Jiang, Chang-Hong Liu, Liang Liu
  • Patent number: 8221667
    Abstract: The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.
    Type: Grant
    Filed: October 13, 2009
    Date of Patent: July 17, 2012
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang, You-Sen Wang, Chang-Hong Liu
  • Patent number: 8081469
    Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: December 20, 2011
    Assignees: Tsinghua University, Hon Hai Precision Industry Co., Ltd.
    Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
  • Publication number: 20110052477
    Abstract: The present disclosure provides an apparatus for manufacturing a carbon nanotube heat sink. The apparatus includes a board, and a plurality of first and second carbon nanotubes formed on the board. The first carbon nanotubes and the second nanotubes are grown along a substantially same direction from the board. A height difference exists between a common free end of the first carbon nanotubes and a common free end of the second carbon nanotubes. A method for manufacturing multiple carbon nanotube heat sinks is also provided.
    Type: Application
    Filed: October 30, 2009
    Publication date: March 3, 2011
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUAN YAO, FENG-WEI DAI, KAI-LI JIANG, CHANG-HONG LIU, LIANG LIU
  • Publication number: 20100301260
    Abstract: A method for making a thermal interface material includes following steps. A substrate having a plurality of CNT arrays arranged thereon and a number of first interspaces defined between the CNT arrays is provided. A container is provided and the substrate with the CNT arrays is disposed into the container. A number of low melting point metallic nanoparticles is provided and filled in the first interspaces. The low melting point metallic nanoparticles in the container is heated into a liquid state, and the low melting point metal nanoparticles in liquid state is combined with the CNT arrays to form a composite material on the substrate. The composite material is peeled off from the substrate, and a thermal interface material is obtained.
    Type: Application
    Filed: October 8, 2009
    Publication date: December 2, 2010
    Applicants: Tsinghua University, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Feng-Wei Dai, Yuan Yao, You-Sen Wang, Ji-Cun Wang, Hui-Ling Zhang
  • Publication number: 20100302739
    Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
    Type: Application
    Filed: October 14, 2009
    Publication date: December 2, 2010
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: You-Sen Wang, Yuan Yao, Feng-Wei Dai, Ji-Cun Wang, Hui-Ling Zhang
  • Publication number: 20100273946
    Abstract: A carbon nanotube microcapsule includes at least one carbon nanotube and a shell encapsulating the at least one carbon nanotube. The shell includes a plurality of first functional groups. A composite using the carbon nanotube microcapsule, and a method for making the carbon nanotube microcapsule is also disclosed.
    Type: Application
    Filed: September 22, 2009
    Publication date: October 28, 2010
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: HUI-LING ZHANG, YUAN YAO, JI-CUN WANG, YOU-SEN WANG, FENG-WEI DAI
  • Publication number: 20100219550
    Abstract: The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified.
    Type: Application
    Filed: October 13, 2009
    Publication date: September 2, 2010
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YUAN YAO, FENG-WEI DAI, JI-CUN WANG, HUI-LING ZHANG, YOU-SEN WANG, CHANG-HONG LIU
  • Publication number: 20100157538
    Abstract: An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.
    Type: Application
    Filed: October 14, 2009
    Publication date: June 24, 2010
    Applicants: TSINGHUA UNIVERSITY, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: YOU-SEN WANG, YUAN YAO, FENG-WEI DAI, JI-CUN WANG, HUI-LING ZHANG
  • Publication number: 20090263310
    Abstract: A method for making carbon nanotubes that includes the following steps. A metal substrate is provided. The surface of the metal substrate is polished. The polished metal substrate is put into a reaction device. A protecting gas is introduced to the reaction device while the environment inside of the reaction device is heated to about 400 to 800 degrees. A mixture of carbon source gas and protecting gas is introduced to the reaction device, whereby the carbon nanotubes are grown on the metal substrate on the polished metal substrate.
    Type: Application
    Filed: April 9, 2009
    Publication date: October 22, 2009
    Applicants: Tsinghua University, HON HAI Precision Industry CO., LTD.
    Inventors: Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Hsien-Sheng Pei, Kai-Li Jiang, Shou-Shan Fan
  • Publication number: 20090061208
    Abstract: A carbon nanotube composite preform includes a substrate and a plurality of carbon nanotubes formed thereon. Each carbon nanotube includes a first end adjacent to the substrate and a second end away from the substrate. Gaps between the second ends of the carbon nanotubes are bigger than gaps between the first ends thereof. The method for making the carbon nanotube composite preform includes the following steps: (a) providing a substrate; (b) forming a plurality of carbon nanotubes (e.g., a carbon nanotube array) on the substrate; (c) placing the carbon nanotubes and the substrate in a solvent for some time; (d) removing the carbon nanotubes and the substrate from the solvent; (e) drying the carbon nanotubes and the substrate to form a carbon nanotube composite preform.
    Type: Application
    Filed: December 14, 2007
    Publication date: March 5, 2009
    Applicants: Tsinghua University, HON HAI Precision Industry Co., LTD.
    Inventors: Hai-Zhou Guo, Feng-Wei Dai, Yuan Yao, Chang-Shen Chang, Chang-Hong Liu, Kai-Li Jiang