Abstract: The present disclosure discloses a data receiving apparatus and a data receiving method having blind deconvolution mechanism. A descrambling circuit descrambles received data according to an antenna assumption and N data position assumptions within a transmission period to generate N groups of soft-bit data. A soft-bit processing circuit retrieves bit position data to determine non-variable bit positions and variable bit positions. N circular buffers of a storage circuit store and superimpose the N groups of soft-bit data corresponding to N data position assumptions in a circular manner to generate N groups of superimposed results and keep the data corresponding to the non-variable bit positions. A post-processing circuit performs de-interleaving and decoding on the N groups of superimposed results to generate N groups of decoded results to perform redundancy check thereon. When one decoded results passes the redundancy check, the soft-bit processing circuit stops performing the blind deconvolution process.

Abstract: A semiconductor package is provided, which includes a first chip disposed over a first package substrate, a molding compound surrounding the first chip, a first thermal interface material disposed over the first chip and the molding compound, a heat spreader disposed over the thermal interface material, and a second thermal interface material disposed over the heat spreader. The first thermal interface material and the second thermal interface material have an identical width.

Abstract: A semiconductor structure, comprising a redistribution layer (RDL) including a dielectric layer and a conductive trace within the dielectric layer; a first conductive member disposed over the RDL and electrically connected with the conductive trace; a second conductive member disposed over the RDL and electrically connected with the conductive trace; a first die disposed over the RDL; a second die disposed over the first die, the first conductive member and the second conductive member; and a connector disposed between the second die and the second conductive member to electrically connect the second die with the conductive trace, wherein the first conductive member is electrically isolated from the second die.

Abstract: A curable composition includes the following: (A) a polymer having an average unit formula (I?): [(R?)2SiO2/2]a?[(CH2?CH)(R?)2SiO1/2]b?[R?SiO3/2]c?[O1/2Si(R?)2(CH2CH2)(R?)2SiO1/2]e?; (B) a branched organopolysiloxane having an average unit formula (VI) (R4SiO3/2)x(SiO4/2)y[(R8)3SiO1/2]1-x-y; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R?, R4 to R8, x, y, a? to c?, e? and f to j are as defined in the specification.

Abstract: The present invention provides a halogen-free dry film photosensitive resin composition, which comprises (a) 10˜60 wt % of at least two kinds of acrylic resins having unsaturated carboxylic acid monomers as polymerized units; (b) 5˜20 wt % of a photosensitive resin having at least two (meth)acrylate groups; (c) 0.1˜15 wt % of a photoinitiator; and (d) 0.5˜20 wt % of a thermo-curing agent. The resin composition of the invention is suitable for use as a photoresist in the process of producing printed circuit boards. The resin composition of the invention is particularly suitable for use in the surface of printed circuit boards or semiconductor packages as a protective dry film solder mask.

Abstract: The present invention provides a halogen-free dry film photosensitive resin composition, which comprises (a) 10˜60 wt % of at least two kinds of acrylic resins having unsaturated carboxylic acid monomers as polymerized units; (b) 5˜20 wt % of a photosensitive resin having at least two (meth)acrylate groups; (c) 0.1˜15 wt % of a photoinitiator; and (d) 0.5˜20 wt % of a thermo-curing agent. The resin composition of the invention is suitable for use as a photoresist in the process of producing printed circuit boards. The resin composition of the invention is particularly suitable for use in the surface of printed circuit boards or semiconductor packages as a protective dry film solder mask.

Abstract: A method for transmitting data from a first cellular phone to a second cellular phone is provided. The first cellular phone includes a first flash memory having a transmitting program code, a receiving program code, and an application program code. The second cellular phone includes a second flash memory, and a random access memory (RAM). The method includes transmitting the receiving program code to the RAM of the second cellular phone and then transmitting the application program code to the second flash memory of the second cellular phone. Thus, the flash memory of the second cellular phone is refreshed by the first cellular phone.

Abstract: A method for transmitting data from a first cellular phone to a second cellular phone is provided. The first cellular phone includes a first flash memory having a transmitting program code, a receiving program code, and an application program code. The second cellular phone includes a second flash memory, and a random access memory (RAM). The method includes transmitting the receiving program code to the RAM of the second cellular phone and then transmitting the application program code to the second flash memory of the second cellular phone. Thus, the flash memory of the second cellular phone is refreshed by the first cellular phone.