Abstract: A method of forming semiconductor structure includes attaching backsides of top dies to a front side of a bottom wafer, the bottom wafer comprising a plurality of bottom dies; forming first conductive pillars on the front side of the bottom wafer adjacent to the top dies; forming a first dielectric material on the front side of the bottom wafer around the top dies and around the first conductive pillars; and dicing the bottom wafer to form a plurality of structures, each of the plurality of structures comprising at least one of the top dies and at least one of the bottom dies.

Abstract: Monolithic power stage (Pstage) packages and methods for using same are provided that may be implemented to provide lower thermal resistance/enhanced thermal performance, reduced noise, and/or smaller package footprint than conventional monolithic Pstage packages. The conductive pads of the disclosed Pstage packages may be provided with a larger surface area for contacting respective conductive layers of a mated PCB to provide a more effective and increased heat transfer away from a monolithic Pstage package. In one example, the increased heat transfer away from the monolithic Pstage package results in lower monolithic Pstage package operating temperature and increased power output.

Abstract: A cutting element includes a substrate and an ultrahard layer on an upper surface of the substrate, a top surface of the ultrahard layer having a ridge extending along a major dimension of the top surface from an edge of the top surface, where the ridge has a peak with at least two different roof radii of curvature, and at least two sidewalls sloping in opposite directions from the peak of the ridge at a roof angle, where a first roof angle of the ridge proximate the edge is smaller than a second roof angle in a central portion of the ridge around a longitudinal axis of the cutting element.

Abstract: This application provides a pre-connector and a communications device. The pre-connector includes a connector component and an outdoor component. The connector component includes a ferrule base and a ferrule that is slidable relative to the ferrule base. The ferrule base is configured to fasten the optical cable, and the ferrule is connected to an optical fiber that is of the optical cable and that is inserted into the ferrule base. In this way, the optical fiber can be connected to the communications device by using the ferrule. The outdoor component includes: a spindle that is sleeved on the ferrule base and that is fastened to the ferrule base; and a handle sleeve sleeved on the spindle. The outdoor component is used as a connecting piece to be detachably fastened and connected to the communications device, so as to provide a locking force used when the communications device is connected.

Abstract: A direct-lit backlight module includes a substrate, an optical layer that forms an accommodating space with the substrate, first light emitting units in the accommodating space, second light emitting units in the accommodating space and a control unit electrically connected to the first light emitting units and the second light emitting units. The first light emitting units emit light towards the optical layer and have a first viewing angle. The second light emitting units emit light towards the optical layer and have a second viewing angle. The control unit provides a control signal to selectively drive the first light emitting units and the second light emitting units. The first light emitting units are adjacent to the second light emitting units. The first light emitting units and the second light emitting units are arranged alternately. The first viewing angle is larger than the second viewing angle.

Abstract: Methods, apparatus, and processor-readable storage media for automatically determining work environment-related ergonomic data are provided herein. An example computer-implemented method includes obtaining ergonomic-related data pertaining to one or more of an individual within a work environment and the work environment; determining one or more ergonomic parameter values by processing at least a portion of the obtained ergonomic-related data using one or more models; generating and outputting, to the individual via one or more automated systems, at least one notification based at least in part on the one or more ergonomic parameter values; and performing one or more automated actions based at least in part on one or more of the one or more ergonomic values and the at least one notification.

Abstract: This disclosure above describes a method, a device, and a system for encrypting/decrypting physical channels in a wireless communication network. Among various embodiments are: pre-allocating a key, dynamically granting a key, encrypting the physical channel based on key in various levels, dividing the spectrum into two categories, or dividing a network into an initial access network and a private network. In one embodiment, a method for physical channel encryption is disclosed. Performed by a UE, the method may include obtaining a first key for decrypting a first physical channel, the first physical channel being encrypted; and decrypting the first physical channel based on the first key to obtain a signal or data transmitted by a first network element, the signal or the data being carried in the first physical channel.

Abstract: A method and apparatus for data retransmission in a wireless communication network, specifically, for a data packet generation before retransmission, according to available resources, link status, and the like is disclosed. In one embodiment, a method for a data packet retransmission by a wireless communication device, includes: receiving first information from a wireless communication node, wherein the first information comprises a first indicator; and performing a data packet retransmission with a data packet generation according to the indicator.

Abstract: The present disclosure provides a semiconductor package, including a first semiconductor structure, including an active region in a first substrate portion, wherein the active region includes at least one of a transistor, a diode, and a photodiode, a first bonding metallization over the first semiconductor structure, a first bonding dielectric over the first semiconductor structure, surrounding and directly contacting the first bonding metallization, a second semiconductor structure over a first portion of the first semiconductor structure, wherein the second semiconductor structure includes a conductive through silicon via, a second bonding dielectric at a back surface of the second semiconductor structure, a second bonding metallization surrounded by the second bonding dielectric and directly contacting the second bonding dielectric, and a conductive through via over a second portion of the first semiconductor structure different from the first portion.

Abstract: Examples of determining electronic component authenticity via electronic signal signature measurement are discussed. Reference pin identifiers corresponding to pins of a known authentic electronic component are determined. Measurement values corresponding to characteristics of pins of an electronic component are obtained, and pin identifiers based on the measurement values are generated. Accordingly, an indication that the electronic component is authentic can be provided based at least in part on a comparison of the pin identifiers and the reference pin identifiers.

Abstract: This application relates to the field of lighting, and discloses an LED filament. The LED filament includes an LED chip unit, a light conversion layer, and an electrode. The light conversion layer covers the LED chip unit and part of the electrode, and a color of a light emitted by the LED filament after lighting is different from a color of the light conversion layer. This application has the characteristics of uniform light emission and good heat dissipation effect.

Abstract: An electromagnetic wave absorption structure includes at least two electromagnetic wave composite absorbing layers stacked and overlapped with each other. Each of the electromagnetic wave composite absorbing layers comprises a conductive composite layer and an insulating layer, and the insulating layer is stacked and overlapped with the conductive composite layer. The conductive composite layer comprises a plurality of conductive layers and a plurality of interlayer insulating layers, and the conductive layers and the interlayer insulating layers are stacked in a staggered manner. The ratio of a thickness of one of the plurality of insulating layers to a thickness of one of the plurality of interlayer insulating layers is greater than or equal to 20.

Abstract: The present application discloses a liquid crystal display panel, a method for manufacturing the liquid crystal display panel, and a curved display. The liquid crystal display panel is configured with an alignment layer only on an array substrate, but not on an opposing substrate opposite to the array substrate. After photo-alignment, a pretilt angle of liquid crystal molecules near the array substrate is greater than a pretilt angle of liquid crystal molecules near the opposing substrate to effectively mitigate a problem of “black clusters.

Abstract: A communication method includes determining that content of a to-be-sent second data packet is the same as content of a first data packet, and sending repetition indication information. The second data packet follows the first data packet. The repetition indication information is useable to indicate that the second data packet repeats a previous data packet.

Abstract: Described herein are DGKalpha inhibitors and pharmaceutical compositions comprising said inhibitors. The subject compounds and compositions are useful for the treatment of a disease or disorder associated with DGKalpha.

Abstract: A method and an apparatus for three-dimensional reconstruction. Images of the reconstruction space captured by N cameras are acquired as N current images in response to an object entering the reconstruction space. Foreground-background differences of all position points in the N current images are obtained according to the N current images and N corresponding initial background images captured by the N cameras when the reconstruction space is empty. Corresponding foreground-background differences of position points in the N current images are fused according to a corresponding relationship between all position points in the N current images and all position points in the reconstruction space, to obtain a foreground-background difference of each position point in the reconstruction space.

Abstract: A peripheral component interconnect express (PCIe) device error reporting optimization method includes acquiring advanced error reporting data of a PCIe device, executing a removal detection process of the PCIe device for detecting if the PCIe device is plugged into a connector, transmitting error log data of the PCIe device to a baseboard management controller and an advanced configuration and power interface according to the advanced error reporting data if the PCIe device is plugged into the connector, and filtering the error log data of the PCIe device so that filtered error log data is received by the baseboard management controller and the advanced configuration and power interface if the PCIe device and the connector are electrically disconnected.

Abstract: This application provides a communication method and apparatus, to improve transmission reliability and a transmission rate. The method includes: An access network device determines first information for configuring a data transmission rule of a first service, and send the first information to a first terminal device in N terminal devices, where the N terminal devices are related to the first service, and N is an integer greater than 1. Based on control on an access network side, data of the first service may be transmitted on the N terminal devices based on the configured data transmission rule, and the access network device can flexibly configure the data transmission rule, so that a data transmission rule that meets requirements, such as high reliability and a high rate, of the first service can be configured, to improve transmission performance of the first service.