Patents by Inventor Feng-Yu Kuo

Feng-Yu Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9569051
    Abstract: A method for determining touch point coordinates on capacitive type touch panel includes following steps. A touch panel having a conductive layer, a plurality of first electrodes, and a plurality of second electrodes is provided. A first signal curve As1 is obtained by driving and sensing each first electrode. A second signal curve As2 is obtained by driving and sensing each second electrode. A third signal curve Bs1 is obtained by driving and sensing each first electrode, wherein the second electrode opposite to the sensed first electrode is grounded. A fourth signal curve Bs2 is gotten by driving and sensing each second electrodes, wherein the first electrode opposite to the sensed second electrode is grounded. The coordinates of the touch points are obtained by comparing the first signal curve As1, the second signal curve As2, the third signal curve Bs1, and the fourth signal curve Bs2.
    Type: Grant
    Filed: January 22, 2015
    Date of Patent: February 14, 2017
    Assignee: TIANJIN FUNAYUANCHUANG TECHNOLOGY CO., LTD.
    Inventors: Chien-Yung Cheng, Cheng-Tai Huang, Chun-Lung Huang, Feng-Yu Kuo, Po-Sheng Shih
  • Publication number: 20150205411
    Abstract: A method for determining touch point coordinates on capacitive type touch panel includes following steps. A touch panel having a conductive layer, a plurality of first electrodes, and a plurality of second electrodes is provided. A first signal curve As1 is obtained by driving and sensing each first electrode. A second signal curve As2 is obtained by driving and sensing each second electrode. A third signal curve Bs1 is obtained by driving and sensing each first electrode, wherein the second electrode opposite to the sensed first electrode is grounded. A fourth signal curve Bs2 is gotten by driving and sensing each second electrodes, wherein the first electrode opposite to the sensed second electrode is grounded. The coordinates of the touch points are obtained by comparing the first signal curve As1, the second signal curve As2, the third signal curve Bs1, and the fourth signal curve Bs2.
    Type: Application
    Filed: January 22, 2015
    Publication date: July 23, 2015
    Inventors: CHIEN-YUNG CHENG, CHENG-TAI HUANG, CHUN-LUNG HUANG, FENG-YU KUO, PO-SHENG SHIH
  • Publication number: 20130135249
    Abstract: A capacitive touch panel includes a substrate; a transparent conductive layer with anisotropic impedance located on the substrate; a plurality of driving sensing electrodes located on the opposite two sides of the transparent conductive layer; at least one sensing unit connected to the plurality of driving sensing electrodes for scanning the plurality of driving sensing electrodes; at least one voltage compensation unit which provides a offset voltage, at least one voltage compensation unit has a first end and a second end, the first end of at least one voltage compensation unit is at least connected to one of the plurality of driving sensing electrodes, the second end of at least one voltage compensation unit is connected to a grounding voltage. The present application also relates to a driving method for preventing leakage current of the capacitive touch panel.
    Type: Application
    Filed: June 1, 2012
    Publication date: May 30, 2013
    Applicant: SHIH HUA TECHNOLOGY LTD.
    Inventors: PO-YANG CHEN, FENG-YU KUO, PO-SHENG SHIH, CHIEN-YUNG CHENG, CHUN-LUNG HUANG
  • Publication number: 20050092255
    Abstract: An edge-contact wafer holder which is suitable for holding wafers as the wafers are loaded onto and unloaded from a processing tool such as a CMP (chemical mechanical planarization) apparatus, for example. The edge-contact wafer holder includes a typically ring-shaped holder body which is mounted typically on a load cup on a HCLU (Head Clean Load/Unload) station of a CMP apparatus and supports each individual wafer at or near the wafer edge. Multiple guide pins may extend upwardly from the holder body to guide each wafer onto the holder body as the wafer is lowered in place onto the holder body.
    Type: Application
    Filed: November 4, 2003
    Publication date: May 5, 2005
    Inventors: Feng-Jung Chang, Poyueh Tsai, Feng-Yu Kuo, Wei-Kung Tsai