Abstract: The present disclosure provides a packet modification method and apparatus, a computer device, and a storage medium. The method includes: dividing a field to be modified that is related to packet encapsulation information into M containers; performing instruction extraction on a very long instruction word executing a modification command, to obtain N groups of initial instructions, where 2?N?M; processing the N groups of initial instructions to obtain N groups of source operands and N groups of modification field configuration information; determining, according to the N groups of modification field configuration information, N containers matched with the N groups of source operands, respectively; and modifying, according to the N groups of source operands, the N matched containers, respectively.

Abstract: The method includes: after obtaining an image of a to-be-operated device by using a target application, the electronic device may send the image of the to-be-operated device to a server corresponding to the target application. Then, the server may obtain an operation model of the to-be-operated device based on the image of the to-be-operated device, and the server sends the operation model of the to-be-operated device to the electronic device. Next, the electronic device may display a user operation interface corresponding to the operation model, and the user may perform an operation on the user operation interface. The electronic device sends an operation event corresponding to the second operation of the user to the server, and the server processes the operation event corresponding to the second operation.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. A system may include a PCB stack comprising a first major substrate opposite a second major substrate, a pre-preg layer disposed between the first and second major substrates, a power device stack embedded within the PCB stack and comprising a substrate, a power device coupled to the substrate of the power device stack, and a vapor chamber embedded within at least the pre-preg layer of the PCB stack and the power device stack being coupled to the vapor chamber.

Abstract: A horizontal computer numerical control (CNC) machining device for a crankshaft includes a horizontal machining workbench provided thereon with the crankshaft and a milling spindle adjusting device provided on a side of the horizontal machining workbench along a length direction of the crankshaft. A milling spindle is fixedly provided on the milling spindle adjusting device, and the milling spindle adjusting device includes an X-axis adjusting mechanism, a Y-axis adjusting mechanism, and a Z-axis adjusting mechanism, which are configured to adjust the spatial position of the milling spindle relative to the crankshaft. The horizontal machining workbench is provided thereon with a C-axis headstock configured to drive the crankshaft to rotate. The horizontal CNC machining device can mill on an outside diameter of a crankshaft or a diameter of an eccentric shaft, and can mill, drill, bore, or tap an outer surface of a workpiece through X, Y, and Z-axis feeding movement.

Abstract: The present disclosure provides a writing method, including: writing writing-table data into a corresponding main storage module; performing a calculation on writing-table data in each target main storage module by using a first predetermined algorithm to obtain an auxiliary value, for any target main storage module, the first predetermined algorithm being used for performing a calculation on writing-table data stored in the target main storage module and corresponding writing-table data stored in at least one main storage module other than the target main storage module, an inverse operation of the first predetermined algorithm being used for performing a calculation on any auxiliary value to obtain writing-table data participating in the calculation of the auxiliary value; and storing the auxiliary value into a corresponding auxiliary storage module. The present disclosure further provides a reading method, a computer readable storage medium, a processor chip and an electronic device.

Abstract: In one embodiment, an electronics assembly includes a cold plate assembly having a first surface, at least one power electronic device disposed within a recess on the first surface of the cold plate assembly, and a printed circuit board disposed on a surface of the at least one power electronic device. The printed circuit board includes a first insulation layer, a second insulation layer, an electrically conductive power layer between the first insulation layer and the second insulation layer, a first set of thermal vias extending from the electrically conductive power layer and toward the first surface of the cold plate assembly, and a second set of thermal vias extending from the first surface of the cold plate assembly toward the electrically conductive power layer. The first set of thermal vias is electrically isolated from the second set of thermal vias.

Abstract: A kinetic energy recovery system, a kinetic energy recovery method and a cutting device are provided. The kinetic energy recovery system includes a motor controller, an energy storage device and an energy management device. The energy management device is connected to the energy storage device and the motor controller respectively, and the energy management device is configured to feed back braking information of a motor to the motor controller based on energy storage parameters of the energy storage device. The motor controller is configured to control the motor to convert kinetic energy of a rotating member into electrical energy of the energy storage device based on the braking information when the rotating member is in a braking state, and further control the motor to convert the electrical energy of the energy storage device into the kinetic energy of the rotating member when the rotating member is in an operation state.

Abstract: Disclosed herein are apparatus and methods for a power electronics assembly that includes a printed circuit board (PCB) and an electrical insulation portion. The PCB includes a plurality of embedded power devices and a substrate layer having a plurality of metal inverse opal (MIO) portions. The electrically insulating portion is positioned between each of the MIO portions. The plurality of MIO portions is thermally coupled to the plurality of embedded power devices.

Abstract: A method of forming a device on a silicon substrate having first, second and third areas includes recessing an upper substrate surface in the first and third areas, forming an upwardly extending silicon fin in the second area, forming first source, drain and channel regions in the first area, forming second source, drain and channel regions in the fin, forming third source, drain and channel regions in the third area, forming a floating gate over a first portion of the first channel region using a first polysilicon deposition, forming an erase gate over the first source region and a device gate over the third channel region using a second polysilicon deposition, and forming a word line gate over a second portion of the first channel region, a control gate over the floating gate, and a logic gate over the second channel region using a metal deposition.

Abstract: Disclosed herein are power electronics assemblies which include a printed circuit board (PCB) having a plurality of conductive layers and a cold plate contacting the PCB. The cold plate includes a manifold constructed from an electrically insulating material and including a first cavity and a second cavity. The cold plate further includes a first heat sink positioned in the first cavity and thermally coupled to the plurality of conductive layers. The cold plate further includes a second heat sink positioned in the second cavity and thermally coupled to the plurality of conductive layers.

Abstract: A carbonized composition is formed by a process including providing an organic composition formed into a predetermined configuration, forming a protective layer over the organic composition, increasing temperature to carbonize the organic composition and form the carbonized composition, and removing the protective layer from the carbonized composition, wherein the carbonized composition has substantially the predetermined configuration. In a number of embodiments, the organic composition includes a nucleic acid. In a number of embodiments, the organic composition consists of a nucleic acid. The nucleic acid may, for example, be DNA.

Abstract: Methods, apparatuses and systems provide for technology that includes a transistor assembly for a power electronics apparatus having a plurality of transistor pairs arranged in a common plane, where for each pair of transistors one transistor is flipped relative to the other transistor. The technology further includes a first lead frame arranged parallel to and electrically coupled to the first transistor in each transistor pair, a second lead frame coplanar to the first lead frame and arranged parallel to and electrically coupled to the second transistor in each transistor pair, and a plurality of output lead frames arranged coplanar to each other, where each respective output lead frame is arranged parallel to and electrically coupled to a respective one pair of the plurality of transistor pairs.

Abstract: A floor washing machine includes a handle assembly; a control unit provided at the handle assembly; a power supply unit electrically connected to the control unit; a rod assembly connected to the handle assembly; a base assembly connected to a lower portion of the rod assembly; a sweeping/scrubbing assembly provided at the base assembly and having a motor controlled by the control unit and a scrubbing roller to be driven into forward or reverse rotation by the motor; and a water supply assembly having a water outlet pipe, wherein the water outlet pipe has a water outlet opening and can be rotated in order to point the water outlet opening to a forward-of-roller direction or a rearward-of-roller direction of the sweeping/scrubbing assembly.

Abstract: A power electronics module includes a heat sink structurally configured to dissipate thermal energy, an electrically-insulating layer directly contacting the heat sink, a conductive substrate positioned on and in direct contact with the electrically-insulating layer, a power electronics device positioned on and in direct contact with the conductive substrate, a printed circuit board layer that at least partially encapsulates the conductive substrate and the power electronics device, and a driver circuit component positioned on a surface of the printed circuit board layer.

Abstract: An electrochemical apparatus includes a negative electrode, where the negative electrode includes a current collector, a first coating, and a second coating. The second coating is provided on at least one surface of the current collector. The first coating is provided between the current collector and the second coating, and the first coating includes inorganic particles. A peeling force F between the first coating and the second coating satisfies 15 N?F?30 N. The first coating is provided between the current collector and the second coating of the negative electrode, and the first coating contains the inorganic particles, effectively enhancing adhesion between the current collector and the second coating, reducing the binder amount in the second coating, and increasing the proportion of a negative electrode active material in the negative electrode, thereby increasing the energy density of lithium-ion batteries.

Abstract: Disclosed is a heterocyclic compound as represented by formula (I), a tautomer thereof, or a pharmaceutically acceptable salt thereof. The compound has better inhibitory activity on TRPC5, has good metabolic stability in liver micro-particles, and has good clinical pharmacokinetic properties.

Abstract: There are provided compounds of Formula I, and pharmaceutically acceptable salts and esters thereof, and pharmaceutical compositions thereof, used for inhibition or modulation of the activity of cyclin dependent kinases (CDK) and/or glycogen synthase kinase-3 (GSK-3), for the treatment of disease states or conditions mediated by cyclin dependent kinases and/or glycogen synthase kinase-3, including cancers.

Abstract: A driver board assembly includes first and second substrates, one or more power device assemblies and a cooling manifold. At least one jet impingement assembly is formed on a first surface of the first substrate and includes an impingement receiving portion that is at least partially circumferentially surrounded by a plurality of fluid microchannels that extend radially from the impingement receiving portion along the first surface. The second substrate is bonded onto the first substrate. The second substrate surface has a recess. The plurality of receiving contours are etched within the first surface of the first substrate. The one or more power device assemblies are bonded into the recess of the second substrate. A first cooling surface of the cooling manifold is bonded to the first surface such that the first cooling surface bonds within the plurality of receiving contours within the first surface of the first substrate.

Abstract: A portable electronic device, and an image-capturing device and an assembling method thereof are provided. The image-capturing device includes a carrier substrate, a first image sensing chip, a first filter assembly and a first lens assembly. The first image sensing chip is disposed on the bottom side of the carrier substrate and electrically connected to the carrier substrate. The first filter assembly includes a first support element disposed on the carrier substrate and a first filter element configured for cooperating with the first support element. The first support element is configured to carry the first filter element such that all or a part of the first filter element can be received within the first through opening. The shortest distance between the first filter element and the first image sensing chip can range from 30 ?m to 200 ?m.

Abstract: Disclosed herein are apparatus and methods for a power electronics assembly that includes a cold plate assembly and one or more power device assemblies. The cold plate assembly has a manifold having a heat sink cavity in a first surface and a heat sink that includes one or more substrate cavities. The heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly includes an S-cell, a power device, and a direct bonded metal substrate bonded to the S-Cell. The S-cell includes a base layer constructed at least of graphite or a graphite-composite, a conductive layer at least partially surrounding the base layer, and a power device cavity. The power device is positioned in the power device cavity and is electrically coupled to the conductive layer.