Abstract: The present disclosure relates to a CMOS image sensor having a multiple deep trench isolation (MDTI) structure, and an associated method of formation. In some embodiments, the image sensor comprises a boundary deep trench isolation (BDTI) structure disposed at boundary regions of a pixel region surrounding a photodiode. The BDTI structure has a ring shape from a top view and two columns surrounding the photodiode with the first depth from a cross-sectional view. A multiple deep trench isolation (MDTI) structure is disposed at inner regions of the pixel region overlying the photodiode, the MDTI structure extending from the back-side of the substrate to a second depth within the substrate smaller than the first depth. The MDTI structure has three columns with the second depth between the two columns of the BDTI structure from the cross-sectional view. The MDTI structure is a continuous integral unit having a ring shape.

Abstract: An audio jack connector (100) includes an insulating housing (1) and a number of contacts (2) assembled in the insulating housing. The insulating housing defines a mating surface (111) with an insertion hole (14) through which an audio plug is inserted into a receiving channel (15) of the insulating housing, a rear surface (123) opposite to the mating surface, a mounting surface (121) facing to a printed circuit board, and a top surface (122) opposite to the mounting surface. The audio jack connector includes an insulative plate (4) attached to the rear surface of the insulating housing and a solidified glue portion (5) formed between the insulative plate and the insulating housing. The insulative plate defines a plurality of holes (41) through which the contacts extending out of the insulating housing. The rear surface of the insulating housing is sealed by the insulative plate and the solidificated glue portion.

Abstract: An audio jack connector (100) includes an insulating housing (1) and a number of contacts (2) assembled in the insulating housing. The insulating housing defines a mating surface (111) with an insertion hole (14) through which an audio plug is inserted into a receiving channel (15) of the insulating housing, a rear surface (123) opposite to the mating surface, a mounting surface (121) facing to a printed circuit board, and a top surface (122) opposite to the mounting surface. The audio jack connector includes an insulative plate (4) attached to the rear surface of the insulating housing and a solidified glue portion (5) formed between the insulative plate and the insulating housing. The insulative plate defines a plurality of holes (41) through which the contacts extending out of the insulating housing. The rear surface of the insulating housing is sealed by the insulative plate and the solidificated glue portion.

Abstract: A card connector includes an insulative housing, a number of contacts retained in the insulative housing, a metallic shell covering the insulative housing to jointly form a card receiving space, and a locking member pivotally mounted to the insulative housing. The locking member includes a card locking beam outside the card receiving space. The locking member is pivotable to an opening status where a card can be freely inserted into the card receiving space along a back-to-front direction, and the locking member is pivotable to a closed status where the card is restricted by the card locking beam in order to prevent the card from backwardly withdrawing from the card receiving space.