Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Abstract: An electroplating bath for depositing a silver/tin alloy on a substrate. The electroplating bath comprises (a) a source of tin ions; (b) a source of silver ions; (c) an acid; (d) a first complexing agent; (e) a second complexing agent, wherein the second complexing agent is selected from the group consisting of allyl thioureas, aryl thioureas, and alkyl thioureas, and combinations thereof; and (f) optionally, a wetting agent, and (g) optionally, an antioxidant.

Abstract: Upon use of an immersion tin plating solution, contaminants build in the solution, which cause the plating rate and the quality of the plated deposit to decrease. One primary contaminant, which builds in the plating solution upon use, is hydrogen sulfide, H2S. If a gas is bubbled or blown through the solution, contaminants, especially hydrogen sulfide, can be effectively removed from the solution and, as a result, the high plating rate and plate quality can be restored or maintained. In this regard, any gas can be used, however, it is preferable to use a gas that will not detrimentally interact with the solution, other than to strip out contaminants. Nitrogen is particularly preferred for this purpose because it is efficient at stripping out contaminants, including hydrogen sulfide, but does not induce the oxidation of the tin ions from their divalent state to the tetravalent state, which is detrimental.

Abstract: Upon use of an immersion tin plating solution, contaminants build in the solution, which cause the plating rate and the quality of the plated deposit to decrease. One primary contaminant, which builds in the plating solution upon use, is hydrogen sulfide, H2S. If a gas is bubbled or blown through the solution, contaminants, especially hydrogen sulfide, can be effectively removed from the solution and, as a result, the high plating rate and plate quality can be restored or maintained. In this regard, any gas can be used, however, it is preferable to use a gas that will not detrimentally interact with the solution, other than to strip out contaminants. Nitrogen is particularly preferred for this purpose because it is efficient at stripping out contaminants, including hydrogen sulfide, but does not induce the oxidation of the tin ions from their divalent state to the tetravalent state, which is detrimental.

Abstract: A coated article that includes a substrate and a wear-resistant coating scheme. The coated article may be a cutting insert shown to improve performance in chip-forming material removal operations or a wear-resistant component used in chipless forming operations. The wear-resistant coating scheme has an underlayer and top layer containing aluminum, chromium, and nitrogen. The coating scheme also includes a mediate multi-periodicity nanolayer coating scheme containing titanium, aluminum, chromium and nitrogen. The mediate multi-periodicity nanolayer coating scheme includes a plurality of sets of alternating layer arrangements. Each one of the alternating layer arrangements has a base layer comprising titanium, aluminum and nitrogen and a nanolayer region having a plurality of sets of alternating nanolayers. Each set of alternating nanolayers has one nanolayer having aluminum, chromium, titanium and nitrogen and another nanolayer having aluminum, chromium, titanium and nitrogen.

Abstract: A coated article that includes a substrate and a wear-resistant coating scheme. The coated article may be a cutting insert shown to improve performance in chip-forming material removal operations or a wear-resistant component used in chipless forming operations. The wear-resistant coating scheme has an underlayer and top layer containing aluminum, chromium, and nitrogen. The coating scheme also includes a mediate multi-periodicity nanolayer coating scheme containing titanium, aluminum, chromium and nitrogen. The mediate multi-periodicity nanolayer coating scheme includes a plurality of sets of alternating layer arrangements. Each one of the alternating layer arrangements has a base layer comprising titanium, aluminum and nitrogen and a nanolayer region having a plurality of sets of alternating nanolayers. Each set of alternating nanolayers has one nanolayer having aluminum, chromium, titanium and nitrogen and another nanolayer having aluminum, chromium, titanium and nitrogen.