Abstract: A method of producing a high-performance connection between a metal and a solid superconductive ceramic member is effected by introducing into a mold, in juxtaposition, grains or powder of the ceramic or of its precursors and a volume of silver or gold powder, and ceramic grains or powder at the level of an incorporated silver, gold or copper porous body of the foam, straw or lattice type prior to compression of the ceramic powder and sintering of the same. The electrical connection so formed exhibits a low electrical resistance capable of carrying high currents at rated temperature without interfering with the zero resistance state of the superconductive ceramic, with the metal connection free of cracking and having a contact resistance that is substantially constant throughout the range of superconductive material operating conditions.