Abstract: The present disclosure refers to a method for manufacturing carbon fiber panels stiffened with omega stringers for the construction of aircraft structures, such as fuselage sections, wing panels, etc. One tubular pressure member is provided for each omega stringer of the structure to be manufactured, wherein the tubular pressure member is configured with the shape of the omega stringer. Each tubular pressure member is enclosed between the omega stringer and part of the laminate, and autoclave pressure is applied to the interior of the tubular pressure member, so that the tubular pressure member is used to consolidate the omega stringers and/or part of the laminate from the interior of these two elements, while these two elements are being co-cured or co-bonded in an autoclave. Imperfections on those internal surfaces such as resin wrinkles of the structure are reduced.

Abstract: A power and/or telecommunication cable (Ia,Ib) includes one or several conductor elements (10,20,30) surrounded by an outer sheath, where the outer sheath (40,50) comprising a first layer (40a, 40b) able to emit light radiation, and a second layer (50) made of a light transmitting thermoplastic polyurethane (TPU) material surrounding the first layer (40a, 40b), so that h first layer (40a, 40b) is visible through the second layer (50).

Abstract: A folded circularly symmetric illumination optic comprising a first light transfer mode having a first central refractive surface and a second central refractive surface, wherein one of the first and second central refractive surfaces has at least one peened feature; a second light transfer mode having a first refractive surface, a first TIR surface, a second TIR surface and a second refractive surface; a third light transfer mode having a first refractive surface, a first TIR surface and a second refractive surface, wherein the first TIR surface has at least one peening feature, and wherein the second refractive surface is conical; wherein the first TIR surface and second refractive surface of the second light transfer mode is coincident at least one point, wherein the second refractive surface of the third light transfer mode is coincident with the first TIR surface and second refractive surface of the second light transfer mode.

Abstract: A semiconductor structure fabrication method. A provided structure includes: a semiconductor substrate, a transistor on the semiconductor substrate, N interconnect layers on the semiconductor substrate, and a temporary filling region within the N layers. N is at least 2. The temporary filling region is heated at a high temperature sufficiently high to result in the temporary filling material being replaced by a cooling pipes system that does not include any solid or liquid material. A first portion and a second portion of the cooling pipes system are each in direct physical contact with a surrounding ambient at a first interface and a second interface respectively such that a first direction perpendicular to the first interface is perpendicular to a second direction perpendicular to the second interface. A totality of interfaces between the cooling pipes system and the ambient consists of the first interface and the second interface.

Abstract: A folded circularly symmetric illumination optic comprising a first light transfer mode having a first central refractive surface and a second central refractive surface, wherein one of the first and second central refractive surfaces has at least one peened feature; a second light transfer mode having a first refractive surface, a first TIR surface, a second TIR surface and a second refractive surface; a third light transfer mode having a first refractive surface, a first TIR surface and a second refractive surface, wherein the first TIR surface has at least one peening feature, and wherein the second refractive surface is conical; wherein the first TIR surface and second refractive surface of the second light transfer mode is coincident at least one point, wherein the second refractive surface of the third light transfer mode is coincident with the first TIR surface and second refractive surface of the second light transfer mode.

Abstract: A semiconductor structure fabrication method. A provided structure includes: a semiconductor substrate, a transistor on the semiconductor substrate, N interconnect layers on the semiconductor substrate, and a temporary filling region within the N layers. N is at least 2. The temporary filling region is heated at a high temperature sufficiently high to result in the temporary filling material being replaced by a cooling pipes system that does not include any solid or liquid material. A first portion and a second portion of the cooling pipes system are each in direct physical contact with a surrounding ambient at a first interface and a second interface respectively such that a first direction perpendicular to the first interface is perpendicular to a second direction perpendicular to the second interface. A totality of interfaces between the cooling pipes system and the ambient consists of the first interface and the second interface.

Abstract: A light funnel collimator has a central lens surface and a back reflecting surface, shaped to provide a wider back-ground beam and a narrower hotspot beam within but off-center of the wider beam. One of the beams is on-axis of the collimator, and the other beam is off-axis. The reflector is at least partly asymmetrical relative to the axis, and provides or contributes to the off-axis beam.

Abstract: Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.

Abstract: A power and/or telecommunication cable (Ia,Ib) includes one or several conductor elements (10,20,30) surrounded by an outer sheath, where the outer sheath (40,50) comprising a first layer (40a, 40b) able to emit light radiation, and a second layer (50) made of a light transmitting thermoplastic polyurethane (TPU) material surrounding the first layer (40a, 40b), so that h first layer (40a, 40b) is visible through the second layer (50).

Abstract: An optical device for coupling the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED's light within it and an ejector positioned adjacent the transfer section to receive light from the transfer section and spread the light generally spherically. A base of the transfer section is optically aligned and/or coupled to the LED so that the LED's light enters the transfer section. The transfer section can comprises a compound elliptic concentrator operating via total internal reflection. The ejector section can have a variety of shapes, and can have diffusive features on its surface as well, including a phosphor coating. The transfer section can in some implementations be polygonal, V-grooved, faceted and other configurations.

Abstract: One embodiment of a method of calculating an optical surface comprises calculating a meridional optical line of the surface. A ray is selected that passes a known point defining an end of a part of the optical line already calculated. The optical line is extrapolated from the known point to meet the ray using a polynomial with at least one degree of freedom. The polynomial is adjusted as necessary so that the selected ray is deflected at the extrapolated optical line to a desired target point. The polynomial is added to the optical line up to the point where the selected ray is deflected. The point where the selected ray is deflected is used as the known point in a repetition of those steps.

Abstract: The present invention relates to a power and/or telecommunication cable (1) including one or several conductor elements (10,20,30) surrounded by an outer sheath (40,50) characterized in that said outer sheath comprises a first layer (40) made of a fluorescent material, and a second layer (50) made of a transmitting light thermoplastic polyurethane (TPU) material surrounding the first layer, so that the first layer is visible through the second layer.

Abstract: An optical device for coupling the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED's light within it and an ejector positioned adjacent the transfer section to receive light from the transfer section and spread the light generally spherically. A base of the transfer section is optically aligned and/or coupled to the LED so that the LED's light enters the transfer section. The transfer section can comprises a compound elliptic concentrator operating via total internal reflection. The ejector section can have a variety of shapes, and can have diffusive features on its surface as well. The transfer section can in some implementations be polygonal, V-grooved, faceted and other configurations.

Abstract: Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.

Abstract: One embodiment of a method of calculating an optical surface comprises calculating a meridional optical line of the surface. A ray is selected that passes a known point defining an end of a part of the optical line already calculated. The optical line is extrapolated from the known point to meet the ray using a polynomial with at least one degree of freedom. The polynomial is adjusted as necessary so that the selected ray is deflected at the extrapolated optical line to a desired target point. The polynomial is added to the optical line up to the point where the selected ray is deflected. The point where the selected ray is deflected is used as the known point in a repetition of those steps.

Abstract: Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.

Abstract: Robotic system for assisting in minimally-invasive surgery, which can position a surgical instrument in response to orders from a surgeon, is not attached to the operating table and does not require pre-calibration of the insertion point. The system includes: a manipulator robot having three active degrees of freedom, which is provided with an end actuator having two passive degrees of freedom, said actuator being used to attach a surgical instrument; a robot controller built into the structure thereof, which can perform a method for calculating the movement to be imparted to the carried surgical instrument so that it reaches the desired location without requiring pre-calibration and without the assembly having to be attached to the operating table; and an interface system for ordering the system to perform the desired actions. The assembly comprising the robot, the controller and the interface system is battery operated.

Abstract: Structures and methods for forming the same. A semiconductor chip includes a substrate and a transistor. The chip includes N interconnect layers on the substrate, N being a positive integer. The chip includes a cooling pipes system inside the N interconnect layers. The cooling pipes system does not include any solid or liquid material. Given any first point and any second point in the cooling pipes system, there exists a continuous path which connects the first and second points and which is totally within the cooling pipes system. A first portion of the cooling pipes system overlaps the transistor. A second portion of the cooling pipes system is higher than the substrate and lower than a top interconnect layer. The second portion is in direct physical contact with a surrounding ambient.

Abstract: An optical device for coupling the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED's light within it and an ejector positioned adjacent the transfer section to receive light from the transfer section and spread the light generally spherically. A base of the transfer section is optically aligned and/or coupled to the LED so that the LED's light enters the transfer section. The transfer section can comprises a compound elliptic concentrator operating via total internal reflection. The ejector section can have a variety of shapes, and can have diffusive features on its surface as well, including a phosphor coating. The transfer section can in some implementations be polygonal, V-grooved, faceted and other configurations.

Abstract: An optical device for coupling the luminous output of a light-emitting diode (LED) to a predominantly spherical pattern comprises a transfer section that receives the LED's light within it and an ejector positioned adjacent the transfer section to receive light from the transfer section and spread the light generally spherically. A base of the transfer section is optically aligned and/or coupled to the LED so that the LED's light enters the transfer section. The transfer section can comprises a compound elliptic concentrator operating via total internal reflection. The ejector section can have a variety of shapes, and can have diffusive features on its surface as well. The transfer section can in some implementations be polygonal, V-grooved, faceted and other configurations.