Abstract: Process for manufacturing a MEMS device, including: forming a dielectric region which coats part of a semiconductive substrate of a first semiconductive wafer; forming a region which is permeable to gases and coats the dielectric region; coupling the first semiconductive wafer to a second semiconductive wafer so as to form a first chamber, which houses a first movable mass and has a pressure equal to a first value, and a second chamber, which houses a second movable mass and has a pressure equal to the first value, the permeable region facing the second chamber; selectively removing a portion of the semiconductor substrate and an underlying portion of the dielectric region, so as to expose a part of the permeable region, so as to allow gas exchanges through the permeable region; placing the first and the second semiconductive wafers in an environment with a pressure equal to a second value, so that the pressure in the second chamber becomes equal to the second value; and subsequently forming, on the exposed p

Abstract: A combined cycle power plant comprises a gas turbo group and a water/steam circuit A liquid atomization device is arranged, upstream of the compressor, in the intake duct of the gas turbo group. The liquid under pressure, which is intended to be injected into the compressor inflow, is branched off from the water/steam circuit.

Abstract: A combined cycle power plant comprises a gas turbo group and a water/steam circuit A liquid atomization device is arranged, upstream of the compressor, in the intake duct of the gas turbo group. The liquid under pressure, which is intended to be injected into the compressor inflow, is branched off from the water/steam circuit.