Abstract: A light-emitting unit, comprising a substrate and a light-emitting device, which is situated on the substrate (2) and is designed to emit a laser beam. A swiveling light-deflecting device is situated on the substrate. A capping device is situated on the substrate and covers the light-emitting device and the light-deflecting device, the capping device having a first cap section and a transparent second cap section. The first cap section is designed to redirect the laser beam emitted by the light-emitting device onto the light-deflecting device. The light-deflecting device is designed to deflect the redirected laser beam in such a way that deflected laser beam is able to exit through second cap section.

Abstract: A light-emitting unit, comprising a substrate and a light-emitting device, which is situated on the substrate (2) and is designed to emit a laser beam. A swiveling light-deflecting device is situated on the substrate. A capping device is situated on the substrate and covers the light-emitting device and the light-deflecting device, the capping device having a first cap section and a transparent second cap section. The first cap section is designed to redirect the laser beam emitted by the light-emitting device onto the light-deflecting device. The light-deflecting device is designed to deflect the redirected laser beam in such a way that deflected laser beam is able to exit through second cap section.

Abstract: A mechanical component having an adjustable part and a magnetic actuator device having at least one first permanent-magnetic element, which is able to be set into a first adjustment motion, whereby the adjustable part is able to be set into a first co-adjustment motion about a first axis of rotation, and wherein the magnetic actuator device includes at least one first external permanent magnet, which induces a first magnetic field and is able to be set into a first excitation motion such that the at least one first permanent-magnetic element is able to be set into the first adjustment motion. A production method for a mechanical component and a method for adjusting an adjustable part at least about a first axis of rotation in relation to its support, are also described.

Abstract: A micromechanical device is described as having a stationary element (100) and a deflectable element. The invention relates to a light source that is situated on the deflectable element. Also described is a micromechanical scanner including a micromechanical device having a movable element with a light source disposed thereon.

Abstract: A method for producing a pressure sensor comprises providing a substrate with a depression; attaching a micromechanical sensor element to the substrate in the depression; attaching an evaluation circuit to the substrate next to the depression; electrically connecting the evaluation circuit to the sensor element; covering the substrate around the depression by means of a potting die such that the depression is closed; potting the evaluation circuit between the substrate and the potting die; and removing the potting die.

Abstract: A mechanical component having an adjustable part and a magnetic actuator device having at least one first permanent-magnetic element, which is able to be set into a first adjustment motion, whereby the adjustable part is able to be set into a first co-adjustment motion about a first axis of rotation, and wherein the magnetic actuator device includes at least one first external permanent magnet, which induces a first magnetic field and is able to be set into a first excitation motion such that the at least one first permanent-magnetic element is able to be set into the first adjustment motion. A production method for a mechanical component and a method for adjusting an adjustable part at least about a first axis of rotation in relation to its support, are also described.

Abstract: A method for producing a pressure sensor comprises providing a substrate with a depression; attaching a micromechanical sensor element to the substrate in the depression; attaching an evaluation circuit to the substrate next to the depression; electrically connecting the evaluation circuit to the sensor element; covering the substrate around the depression by means of a potting die such that the depression is closed; potting the evaluation circuit between the substrate and the potting die; and removing the potting die.

Abstract: A micromechanical device is described as having a stationary element (100) and a deflectable element. The invention relates to a light source that is situated on the deflectable element. Also described is a micromechanical scanner including a micromechanical device having a movable element with a light source disposed thereon.

Abstract: A structural concept for a vertically hybridly integrated assembly having at least one MEMS component is provided, whose MEMS structure is developed at least partially in the front side of the component and which is electrically contactable via at least one connection pad on the front side of the component. This structural concept is able to be realized in an uncomplicated and cost-effective manner and allows the largely stress-free mounting of the MEMS structure within the chip stack and also ensures a reliable electrical linkage of the MEMS component to further component parts of the assembly. For this purpose, the structural concept provides for mounting the MEMS assembly headfirst on a further component of the chip stack via an interposer and for electrically linking it to the further component via at least one plated contacting in the interposer.

Abstract: A structural concept for a vertically hybridly integrated assembly having at least one MEMS component is provided, whose MEMS structure is developed at least partially in the front side of the component and which is electrically contactable via at least one connection pad on the front side of the component. This structural concept is able to be realized in an uncomplicated and cost-effective manner and allows the largely stress-free mounting of the MEMS structure within the chip stack and also ensures a reliable electrical linkage of the MEMS component to further component parts of the assembly. For this purpose, the structural concept provides for mounting the MEMS assembly headfirst on a further component of the chip stack via an interposer and for electrically linking it to the further component via at least one plated contacting in the interposer.

Abstract: A microelectromechanical system includes a microelectromechanical element and a substrate, in which an element surface of the element and a substrate surface of the substrate is integrally joined with the aid of an eutectic alloy at at least one joint. Also described is a method for manufacturing a microelectromechanical system.

Abstract: An electrical device, particularly a control unit, having at least one joint having a first joining partner, especially a sleeve, and a second joining partner, especially a pin, the joint between the two joining partners having a junction; at least at the junction an at least partially solidified lubricant being present. Furthermore, in a method for lubricating a joint of an electrical device, the joint having a first joining partner, particularly a sleeve, and a second joining partner, particularly a pin; in a step one of the joining partners being wetted with a lubricant, in a following step the joining partner wetted with the lubricant being joined to the other joining partner and the lubricant subsequently solidifying.

Abstract: A micromechanical projection device includes: a carrier which has a first, a second, and a third section, the second section being situated between the first and the third sections and having a flexible design; a mirror, which is mounted on the first section; and a light source which is mounted on the third section. The second section is bent in such a way that a light beam from the light source is directable onto the mirror.

Abstract: An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Abstract: A micromechanical projection device includes: a carrier which has a first, a second, and a third section, the second section being situated between the first and the third sections and having a flexible design; a mirror, which is mounted on the first section; and a light source which is mounted on the third section. The second section is bent in such a way that a light beam from the light source is directable onto the mirror.

Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.

Abstract: An integrated circuit includes an electronic circuit in a housing and a first contacting device for soldering the circuit to a corresponding second contacting device of a circuit board. The first and second contacting devices are each divided into a first section and a second section, the sections of one of the contacting devices being fixedly electrically connected to each other, and the sections of the other contacting device being selectively connectable to a device for resistance determination.

Abstract: A housing for a semiconductor component, in which the housing has a plurality of pins which are provided at the edge of the housing at distances, the pins each having a width, a thickness and a length. In order to create a housing for a semiconductor component whose characteristic frequencies are outside a range in which the characteristic frequencies of the housing negatively influence the semiconductor component, either at least one of the distances lies outside the range of 1.24 mm to 1.30 mm, at least one of the widths lies outside the range of 0.33 mm to 0.51 mm, at least one of the thicknesses lies outside the range of 0.23 to 0.32 mm, or at least one of the lengths lies outside the range of 2.05 to 4.12 mm.

Abstract: A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure.

Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.