Patents by Inventor Florian Lueck

Florian Lueck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132679
    Abstract: The invention relates to composite materials (organosheets) containing a thermoplastic molding compound, at least one continuous reinforcing fiber layer and at least one inorganic filler material. According to the invention, a sheet material consisting of continuous reinforcing fibers in a matrix composition comprising the molding compound is used, the thermoplastic molding compound containing at least one polyolefin, and optionally at least one further, polarity-functionalized polymer. The invention also relates to a process for produci2023ng the claimed composite material and to uses thereof.
    Type: Application
    Filed: December 14, 2021
    Publication date: April 25, 2024
    Inventors: Felix KLAUCK, Pierre JUAN, Norbert NIESSNER, Eike JAHNKE, Andre LUECK, Florian PIOTT, Dietmar DRUMMER, Leo HOFFMANN
  • Patent number: 11837805
    Abstract: An electrical conductor assembly includes a line section having a plurality of conductor wires formed of a first electrically conductive material, a contact section in which the conductor wires are compacted to form a contact unit, and a layer formed of a second electrically conductive material. The layer is disposed on a contact surface of the contact unit.
    Type: Grant
    Filed: April 13, 2022
    Date of Patent: December 5, 2023
    Assignee: TE Connectivity Germany GmbH
    Inventors: Maximilian Veihl, Chris Buechling, Manuel Eheim, Frank Kaehny, Marcus Wolf, Harald Ulrich, Kevin Scheer, Florian Lueck, Christoph Kosmalski, Rolf Maurus
  • Publication number: 20220336974
    Abstract: An electrical conductor assembly includes a line section having a plurality of conductor wires formed of a first electrically conductive material, a contact section in which the conductor wires are compacted to form a contact unit, and a layer formed of a second electrically conductive material. The layer is disposed on a contact surface of the contact unit.
    Type: Application
    Filed: April 13, 2022
    Publication date: October 20, 2022
    Applicant: TE Connectivity Germany GmbH
    Inventors: Maximilian Veihl, Chris Buechling, Manuel Eheim, Frank Kaehny, Marcus Wolf, Harald Ulrich, Kevin Scheer, Florian Lueck, Christoph Kosmalski, Rolf Maurus