Patents by Inventor FLORIAN SEUSS

FLORIAN SEUSS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BRASS ALLOY
    Publication number: 20240002980
    Abstract: A brass alloy is formed from 54 to 64% Cu, 0.05 to 0.15% Al, 0.005 to 0.5% In, at least one of the components of Fe, Sn and Ni in an amount of 0.01 to 3.0%, balance Zn and also unavoidable impurities. The combination of these materials provides a brass alloy that has improved machinability.
    Type: Application
    Filed: July 14, 2023
    Publication date: January 4, 2024
    Inventors: Norbert Gaag, Florian Seuss
  • LEAD-FREE BRASS ALLOY AND METHOD OF USING THE LEAD-FREE BRASS ALLOY
    Publication number: 20230037406
    Abstract: A lead-free brass alloy contains 57.0 to 60.0% wt. Cu, 1.0 to 2.0% wt. Al, 1.5 to 2.5% wt. Mn, 0.1 to 1.0% wt. Fe, at most 0.5% wt. Ni, at most 0.5% wt. Sn, 0.5 to 2.0% wt. Si, less than 0.1% wt. Pb, balance Zn and also unavoidable impurities. Wherein the copper equivalent (CuEq) is in the range from 52.0 to 58.0%.
    Type: Application
    Filed: July 21, 2022
    Publication date: February 9, 2023
    Inventors: Florian Seuss, Alexander Dehnelt, Volker Braeutigam
  • LEAD-FREE AND ANTIMONY-FREE BRASS ALLOY
    Publication number: 20230035864
    Abstract: A lead-free and antimony-free brass alloy contains 56 to 66% Cu, 0.1 to 1.5% Mg, less than 0.1% Pb, and a balance of Zn. Unavoidable impurities are also present. According to other embodiments, different amounts of As, P, Al, Sn, Cu, Mg, Pb, In and Zn may be provided as well.
    Type: Application
    Filed: July 27, 2022
    Publication date: February 2, 2023
    Inventors: Florian Seuss, Patrick Feldner, Hartmut Ricken, Alexander Dehnelt
  • LEAD-FREE COPPER ALLOY AND COMPONENT WITH THE LEAD-FREE COPPER ALLOY
    Publication number: 20220119920
    Abstract: A lead-free copper alloy has from 70.0 to 83.0% by weight of Cu, from 2.0 to 2.9% by weight of Si, from 0.05 to 0.10% by weight of P, from 0.01 to <0.30% by weight of Sn, and a balance of Zn and unavoidable impurities. The lead-free copper alloy is particularly suited for the production of an installation components for conducting drinking water.
    Type: Application
    Filed: October 14, 2021
    Publication date: April 21, 2022
    Inventors: Norbert Gaag, Florian Seuss
  • Nickel-free white CuZn alloy and fitting using the alloy
    Patent number: 10041149
    Abstract: A nickel-free white CuZn alloy. The alloy includes the following alloying elements: from 63.0 to 67.0% of Cu, from 0.01 to 0.15% of Pb, from 0.01 to 0.2% of Fe, from 1.3 to 2.5% of Al, from 12.0 to 15.0% of Mn, a balance of Zn, and unavoidable impurities.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: August 7, 2018
    Assignee: Diehl Metall Stiftung & Co. KG
    Inventors: Norbert Gaag, Florian Seuss
  • NICKEL-FREE WHITE CUZN ALLOY AND FITTING USING THE ALLOY
    Publication number: 20170101701
    Abstract: A nickel-free white CuZn alloy. The alloy includes the following alloying elements: from 63.0 to 67.0% of Cu, from 0.01 to 0.15% of Pb, from 0.01 to 0.2% of Fe, from 1.3 to 2.5% of Al, from 12.0 to 15.0% of Mn, a balance of Zn, and unavoidable impurities.
    Type: Application
    Filed: October 5, 2016
    Publication date: April 13, 2017
    Inventors: NORBERT GAAG, FLORIAN SEUSS