Abstract: A method of packaging an electronic module in a cap is disclosed. The module, comprising one or more silicon chips mounted on a substrate and having the chips sealed onto the substrate with a silicone polymer is supported on a cap with the chips disposed inwardly. An epoxy is dispensed on the back surface of the substrate and allowed to flow and bridge over the gap between the substrate and cap. The epoxy is cured by first heating the assembly with the applied epoxy to a temperature which will gel the epoxy. The temperature and rate of heating are selected so that the temperature is stabilized before the critical viscosity of the epoxy is reached. Subsequently, a higher temperature is used to complete the cure. The process is also characterized in that no significant decrease in temperature is permitted after the dispensing and flowing of the epoxy.