Patents by Inventor FoldedPak, Inc.

FoldedPak, Inc. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SMALL DIMENSION PACKING MATERIAL
    Publication number: 20130071613
    Abstract: A packing chip is formed from a flat intermediate sheet and includes a central section and two outer sections located on opposite sides of the central section and a tab located on each of the two outer sections. Each section defines a width and a depth, which may each be between about 0.5 inches and about 0.75 inches. Securing elements for securing the tabs of the chips in an assembled shape are located on each tab. One or more apertures defined by at least one section are configured such that the packing chip forms interlocking engagement with portions of adjacent packing chips when employed as packaging.
    Type: Application
    Filed: September 19, 2012
    Publication date: March 21, 2013
    Applicant: FOLDEDPAK, INC.
    Inventor: FoldedPak, Inc.
  • THIN-MEDIA PACKING MATERIAL
    Publication number: 20130071605
    Abstract: A packing chip formed from a flat intermediate sheet, and includes a central section and two outer sections located on opposite sides of the central section and a tab located on each of the two outer sections. Each section has a width and a depth. A securing element is on each tab for securing the tabs of the chip in an assembled shape. One or more apertures defined by at least one section are configured such that the packing chip forms interlocking engagement with portions of adjacent packing chips when employed as packaging. The sheet material has a thickness of less than about 0.014 inches.
    Type: Application
    Filed: September 19, 2012
    Publication date: March 21, 2013
    Applicant: FoldedPak, Inc.
    Inventor: FoldedPak, Inc.