Patents by Inventor Fong Chin Yee

Fong Chin Yee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package-on-package assembly and method
    Patent number: 9070787
    Abstract: A package-on-package (PoP) assembly is provided. The package-on-package (PoP) assembly includes a first integrated circuit package and an anisotropic conductive film (ACF) disposed on a top surface of the first integrated circuit package, wherein the anisotropic conductive film comprises a plurality of conductive particles. The package-on-package (PoP) assembly also includes a second integrated circuit package disposed on a top surface of the anisotropic conductive film.
    Type: Grant
    Filed: May 15, 2014
    Date of Patent: June 30, 2015
    Assignee: Intel Corporation
    Inventors: Amir Wagiman, Thor Soo Fung, Fong Chin Yee
  • PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD
    Publication number: 20140248741
    Abstract: A package-on-package (PoP) assembly is provided. The package-on-package (PoP) assembly includes a first integrated circuit package and an anisotropic conductive film (ACF) disposed on a top surface of the first integrated circuit package, wherein the anisotropic conductive film comprises a plurality of conductive particles. The package-on-package (PoP) assembly also includes a second integrated circuit package disposed on a top surface of the anisotropic conductive film.
    Type: Application
    Filed: May 15, 2014
    Publication date: September 4, 2014
    Inventors: Amir Wagiman, Thor Soo Fung, Fong Chin Yee
  • PACKAGE-ON-PACKAGE ASSEMBLY AND METHOD
    Publication number: 20100078788
    Abstract: A package-on-package (PoP) assembly is provided. The package-on-package (PoP) assembly includes a first integrated circuit package and an anisotropic conductive film (ACF) disposed on a top surface of the first integrated circuit package, wherein the anisotropic conductive film comprises a plurality of conductive particles. The package-on-package (PoP) assembly also includes a second integrated circuit package disposed on a top surface of the anisotropic conductive film.
    Type: Application
    Filed: September 26, 2008
    Publication date: April 1, 2010
    Inventors: Amir Wagiman, Thor Soo Fung, Fong Chin Yee