Patents by Inventor Frédéric Boursereau

Frédéric Boursereau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High toughness vinylester and/or epoxy resin-based material, its process of manufacture, composite material comprising it and uses thereof
    Patent number: 7556853
    Abstract: The invention relates to a material with high fracture toughness based on a vinyl ester resin and/or on an epoxide resin and to its process of manufacture. This material comprises at least one polymerized resin chosen from vinyl ester resins and epoxide resins which can be polymerized at a temperature of less than 70° C. and their blends, and a thermoplastic adjuvant present in this resin in the form of particles, and exhibits a fracture toughness (KIc) of greater than or equal to 1.2 MPa·m1/2 as determined according to Standard ISO 13586:2000. It also relates to a composite material comprising a matrix composed of said material and a reinforcement. Applications: automobile, railway, ship-building, aeronautical, aerospatial and other industries.
    Type: Grant
    Filed: March 24, 2008
    Date of Patent: July 7, 2009
    Assignee: Astrium SAS
    Inventors: Estelle Chauray, Brigitte Defoort, Frederic Boursereau, Alain Soum
  • HIGH TOUGHNESS VINYLESTER AND/OR EPOXY RESIN-BASED MATERIAL, ITS PROCESS OF MANUFACTURE, COMPOSITE MATERIAL COMPRISING IT AND USES THEREOF
    Publication number: 20080171207
    Abstract: The invention relates to a material with high fracture toughness based on a vinyl ester resin and/or on an epoxide resin and to its process of manufacture. This material comprises at least one polymerized resin chosen from vinyl ester resins and epoxide resins which can be polymerized at a temperature of less than 70° C. and their blends, and a thermoplastic adjuvant present in this resin in the form of particles, and exhibits a fracture toughness (KIc) of greater than or equal to 1.2 MPa·m1/2 as determined according to Standard ISO 13586:2000. It also relates to a composite material comprising a matrix composed of said material and a reinforcement. Applications: automobile, railway, ship-building, aeronautical, aerospatial and other industries.
    Type: Application
    Filed: March 24, 2008
    Publication date: July 17, 2008
    Applicant: EADS SPACE TRANSPORTATION SA
    Inventors: Estelle Chauray, Brigitte Defoort, Frederic Boursereau, Alain Soum
  • Vinyl ester and epoxide resins toughened with thermoplastic resin particles
    Patent number: 7371801
    Abstract: A material having a fracture toughness (K1c) of at least 1.2 Mpam.m1/2 as determined according to Standard ISO 13586:2000 comprises a vinyl ester and/or epoxide resin polymerizable at a temperature of less than 70° C. combined with thermoplastic particles.
    Type: Grant
    Filed: April 27, 2004
    Date of Patent: May 13, 2008
    Assignee: EADS SPACE Transportation SA
    Inventors: Estelle Chauray, Brigitte Defoort, Frédéric Boursereau, Alain Soum
  • High toughness vinylester and/or epoxy resin-based material, its process of manufacture, composite material comprising it and uses thereof
    Publication number: 20050008866
    Abstract: The invention relates to a material with high fracture toughness based on a vinyl ester resin and/or on an epoxide resin and to its process of manufacture. This material comprises at least one polymerized resin chosen from vinyl ester resins and epoxide resins which can be polymerized at a temperature of less than 70° C. and their blends, and a thermoplastic adjuvant present in this resin in the form of particles, and exhibits a fracture toughness (KIc) of greater than or equal to 1.2 MPa.m½ as determined according to Standard ISO 13586:2000. It also relates to a composite material comprising a matrix composed of said material and a reinforcement. Applications: automobile, railway, ship-building, aeronautical, aerospatial and other industries.
    Type: Application
    Filed: April 27, 2004
    Publication date: January 13, 2005
    Applicant: EADS SPACE TRANSPORTATION SA
    Inventors: Estelle Chauray, Brigitte Defoort, Frederic Boursereau, Alain Soum
  • Method for producing a lightened SiC sandwich type structure with a honeycomb-shaped core and structure obtained by said method
    Patent number: 6187123
    Abstract: The present invention concerns a method for producing a lightened SiC structure, especially for the production of a lightened mirror, with the following stages: cutting of a preform with a honeycomb-shaped structure whose voiles have an organic matrix and a fibrous reinforcement, pyrolysis of this honeycomb-shaped structural preform so as to solely preserve the carbon, silicidation of the carbon of the preform so as to obtain a microporous SiC core, infiltrating type reinforcement by means of a SiC chemical vapor phase depositing of the voiles of the honeycomb structure of the core, embodiment of a felt sheet and assembling on at least one face of the core of the embodied sheet and densification of this sheet so as to obtain at least one SiC skin on the surface of the core. The invention also concerns the structure obtained.
    Type: Grant
    Filed: October 22, 1998
    Date of Patent: February 13, 2001
    Assignee: Aerospatiale Societe Nationale Industrielle
    Inventors: Jean-Pascal Chenier, Gérard Rousseau, Frédéric Boursereau