Abstract: The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the circuit board by providing the necessary geometry for the footprint pattern of the chip connections without the necessity of multi-level packaging using chip carriers. The circuit board includes a substrate with plated through holes, and a film of photoresist dielectric material disposed on the substrate. The dielectric material is photo patterned to form vias which are then filled with conductive material. Electrical connection pads are formed on the exposed surface of the film of dielectric material in the pattern of the chip footprint to be mounted thereon.

Abstract: Apparatus for recording in memory the data of a displayed video frame by storing as data bytes all of the binary data bits from the video data signal appearing as scan lines generated in succession within groups in a frame. The capture of video data occurs within a single regeneration of the raster image. Also recorded in memory for each scan line is a status byte to designate whether the next predetermined number of scan lines are to be omitted to provide spacing between rows of displayed characters.