Abstract: In a described example, an apparatus includes: a semiconductor die having a device side surface and an opposing backside surface, the backside surface mounted to a die pad of a lead frame using a die attach film; bond pads overlying the device side surface of the semiconductor die; bond wires electrically coupling the bond pads to leads of the lead frame spaced from the die pad; and mold compound covering the semiconductor die, the bond wires, and portions of the lead frame, where portions of the leads are exposed from the mold compound to form terminals of the packaged semiconductor device. The die attach film has a partially cut die attach film layer with a cut side edge normal to the backside surface, and the die attach film has an uncut die attach film layer with a torn side edge normal to the backside surface.

Abstract: A method includes applying laser pulses along a direction to a side of a wafer to create first and second stealth damage regions at respective first and second depths in the wafer and to create cracks that extend in the wafer from the respective stealth damage regions and that are spaced apart from one another along the direction, applying a compressive and retractive cyclical force to the wafer along the third direction to propagate and join the cracks from the respective stealth damage regions together, and expanding the wafer to separate individual dies from the wafer.

Abstract: Integrated circuit packaging with cavities and methods of manufacturing the same are disclosed. An example apparatus includes a semiconductor die and a housing enclosing portions of the semiconductor die. The housing defines an opening that extends from a surface of the semiconductor die to an external environment, the housing formed of a first material. The example apparatus includes a second material disposed within the opening to block exposure of the semiconductor die to the external environment.

Abstract: Integrated circuit packaging with cavities and methods of manufacturing the same are disclosed. An example apparatus includes a semiconductor die and a housing enclosing portions of the semiconductor die. The housing defines an opening that extends from a surface of the semiconductor die to an external environment, the housing formed of a first material. The example apparatus includes a second material disposed within the opening to block exposure of the semiconductor die to the external environment.