Patents by Inventor Francis SAYNES

Francis SAYNES has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD
    Publication number: 20240114620
    Abstract: A printed circuit board includes a first insulating layer, a plurality of first and second pads disposed on the first insulating layer, and a solder resist layer disposed on the first insulating layer, the solder resist layer having a plurality of first and second openings respectively exposing at least portions of the plurality of first and second pads. The first pad has a closed region having a side surface covered by the solder resist layer, and an open region having a side surface exposed by the first opening. The second pad has only a closed region having a side surface covered by the solder resist layer.
    Type: Application
    Filed: August 25, 2023
    Publication date: April 4, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min LEE, Francis SAYNES, Keun Woo KWON