Patents by Inventor Francisco de Costa Alves

Francisco de Costa Alves has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for two sided solder cladded surface mounted printed circuit boards
    Patent number: 5167361
    Abstract: A method of forming flat solder bumps (16 and 18) on contact areas (12 and 14) of a first side and second side of a printed circuit board (12, 14 and 10) comprises the steps of applying solder paste in a predetermined pattern and a predetermined thickness on the contact areas of the first side and the second side of the printed circuit board forming joint areas. Next, the solder paste is reflowed. Then, the solder joints on the first side are flattened (17). Before surface mounted components (20 and 26) are mounted on the printed circuit board, tack media (32) is dispensed onto the joint areas. Subsequently, the printed circuit boards is reflowed. Now the second side of the printed circuit board is flattened (19). As with the first side, tack media (34) is dispensed on the solder joints on the second side before surface mounted components (40 and 46) are mounted on the second side. Finally, the printed circuit board is reflowed again.
    Type: Grant
    Filed: May 16, 1991
    Date of Patent: December 1, 1992
    Assignee: Motorola, Inc.
    Inventors: Henry F. Liebman, Anthony B. Suppelsa, Francisco de Costa Alves