Abstract: Methods and apparatuses are provided herein for independently adjusting flowpath conductance. One multi-station processing apparatus may include a processing chamber, a plurality of process stations in the processing chamber that each include a showerhead having a gas inlet, and a gas delivery system including a junction point and a plurality of flowpaths, in which each flowpath includes a flow element, includes a temperature control unit that is thermally connected with the flow element and that is controllable to change the temperature of that flow element, and fluidically connects one corresponding gas inlet of a process station to the junction point such that each process station of the plurality of process stations is fluidically connected to the junction point by a different flowpath.

Abstract: A scoop for removing semi-fluid materials such as acrylic stucco from a bucket, with a close gripping handle to improve leverage and a scalloped top edge of the receptacle that allows excess material to flow out of the receptacle.

Abstract: In one aspect, a system includes a generator configured to generate and tune a frequency of a supply signal. The system includes an auto-matching network configured to receive the supply signal and to generate an impedance-matched signal for use in powering a plasma system. In some implementations, during a first stage of an impedance matching operation, the generator is configured to tune the frequency of the supply signal until the generator identifies a frequency for which the reactance of the generator and the reactance of the load are best matched. In some implementations, during a second stage of the impedance matching operation, the auto-matching network is configured to tune a tuning element within the auto-matching network until the auto-matching network identifies a tuning of the tuning element for which the resistance of the generator and the resistance of the load are best matched.

Abstract: In one aspect, a system includes a generator configured to generate and tune a frequency of a supply signal. The system includes an auto-matching network configured to receive the supply signal and to generate an impedance-matched signal for use in powering a plasma system. In some implementations, during a first stage of an impedance matching operation, the generator is configured to tune the frequency of the supply signal until the generator identifies a frequency for which the reactance of the generator and the reactance of the load are best matched. In some implementations, during a second stage of the impedance matching operation, the auto-matching network is configured to tune a tuning element within the auto-matching network until the auto-matching network identifies a tuning of the tuning element for which the resistance of the generator and the resistance of the load are best matched.

Abstract: In one aspect, a system includes a generator configured to generate and tune a frequency of a supply signal. The system includes an auto-matching network configured to receive the supply signal and to generate an impedance-matched signal for use in powering a plasma system. In some implementations, during a first stage of an impedance matching operation, the generator is configured to tune the frequency of the supply signal until the generator identifies a frequency for which the reactance of the generator and the reactance of the load are best matched. In some implementations, during a second stage of the impedance matching operation, the auto-matching network is configured to tune a tuning element within the auto-matching network until the auto-matching network identifies a tuning of the tuning element for which the resistance of the generator and the resistance of the load are best matched.

Abstract: In one aspect, a system includes a generator configured to generate and tune a frequency of a supply signal. The system includes an auto-matching network configured to receive the supply signal and to generate an impedance-matched signal for use in powering a plasma system. In some implementations, during a first stage of an impedance matching operation, the generator is configured to tune the frequency of the supply signal until the generator identifies a frequency for which the reactance of the generator and the reactance of the load are best matched. In some implementations, during a second stage of the impedance matching operation, the auto-matching network is configured to tune a tuning element within the auto-matching network until the auto-matching network identifies a tuning of the tuning element for which the resistance of the generator and the resistance of the load are best matched.

Abstract: A rapid vapor deposition (RVD) method conformally deposits a dielectric material on small features of a substrate surface. The resulting dielectric film has a low dielectric constant, low wet etch rate, low film shrinkage and low stress hysteresis, appropriate for various integrated circuit dielectric gap fill applications such as shallow trench isolation. The method includes the following two principal operations: depositing a thin conformal and saturated layer of aluminum-containing precursor over some or all of the substrate surface; and exposing the saturated layer of aluminum-containing precursor to a silicon-containing precursor gas to form a dielectric layer. In some cases, the substrate temperatures during contact with silicon-containing precursor are greater than about 250 degree Celsius to produce an improved film. In other cases, post-deposition anneal process may be used to improve properties of the film.