Patents by Inventor Franco Zambon
Franco Zambon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6994803Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02–0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.Type: GrantFiled: May 12, 2003Date of Patent: February 7, 2006Assignee: International Business Machines CorporationInventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon
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Patent number: 6815088Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).Type: GrantFiled: July 29, 2003Date of Patent: November 9, 2004Assignee: International Business Machines CorporationInventors: Pietro Luigi Cavallotti, Flavio Cereda, Vittorio Sirtori, Franco Zambon
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Publication number: 20040020566Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).Type: ApplicationFiled: July 29, 2003Publication date: February 5, 2004Applicant: International Business Machines CorporationInventors: Pietro Luigi Cavallotti, Flavio Cereda, Franco Zambon, Vittorio Sirtori
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Patent number: 6635123Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).Type: GrantFiled: April 23, 2001Date of Patent: October 21, 2003Assignee: International Business Machines CorporationInventors: Pletro Luigi Cavallotti, Fiavio Cereda, Vittorio Sirtori, Franco Zambon
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Publication number: 20030188430Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimetre) of a paste very soluble in water and washing it off.Type: ApplicationFiled: May 12, 2003Publication date: October 9, 2003Applicant: International Business Machines CorporationInventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon
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Patent number: 6574860Abstract: The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.Type: GrantFiled: September 20, 2000Date of Patent: June 10, 2003Assignee: International Business Machines CorporationInventors: Luigi Giussani, Lorenza Lombardi, Michele Monopoli, Vittorio Sirtori, Franco Zambon
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Patent number: 6453263Abstract: A method and system for estimating the roughness and the contamination of a surface. A preferred embodiment of the present invention makes use of a mathematical model which gives indications of the metal roughness, expressed as the ratio of metal volume to air volume, and the contamination thickness values of a metal substrate (e.g. gold) for a determined contamination (e.g. organic). This model is based on a series of tables which represent the expected values of &psgr;, i.e. the ratio between the amplitudes of the incident beam on the two polarization planes multiplied by the ratio of the amplitudes of the reflected beam on the polarization planes, and &Dgr;, i.e. the difference between the phases on the two polarization planes of the incident beam and the reflected beam, for a gold substrate having a predetermined roughness and a predetermined type of contamination (organic).Type: GrantFiled: April 13, 2000Date of Patent: September 17, 2002Assignee: International Business Machines CorporationInventors: Vittorio Sirtori, Lorenza Lombardi, Michele Monopoli, Franco Zambon
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Publication number: 20010030223Abstract: A method of pretreating a copper surface for protecting the surface from oxidation, by immersing the surface in a solution containing organic solderabilty preservatives, such as BenzoTriAzole, with the addition of a zinc salt. The method is particularly useful in the manufacturing of electronic Printed Circuit Boards for protecting the copper surfaces during the solder processes when the PCB undergoes high temperature. The addition of the zinc salts also gives the additional advantage of increasing the solderabilty properties of the copper surface (i.e. wettability and adhesion).Type: ApplicationFiled: April 23, 2001Publication date: October 18, 2001Inventors: Pletro Luigi Cavallotti, Fiavio Cereda, Vittorio Sirtori, Franco Zambon
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Publication number: 20010025016Abstract: A water-free solution and method for dissolving and removing thermal grease from a high frequency logic device (e.g. a microprocessor in the form of a BGA and ASIC in the form of Quad Flat Pack component) assembled onto an electronic card which needs to be reworked. The method and solution of the present invention allow the complete removal of the grease by a simple and fast process, using an alcoholic, inert and cheap solution, without needing a mechanical action (e.g. brushing) and without damaging the card components. Furthermore, given the low surface tension of the alcoholic solution a good diffusion within the small holes and spaces of the card is ensured.Type: ApplicationFiled: December 4, 2000Publication date: September 27, 2001Inventors: Paul Joseph Hart, Vittorio Sirtori, Sergio Varinelli, Marino Verderio, Franco Zambon
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Patent number: 6190734Abstract: A method and a bath for protecting a Zn or Zn alloy surface against the corrosion and oxidation and for improving the wettability characteristics of a Zn or Zn alloy surface with a Sn solder alloy. The method is particularly useful in the manufacture of electronic components, when the deposition of a thin layer of Zn or Zn alloy is needed before the deposition of the Sn alloy (particularly Pb free) to improve the solderability characteristics of the Cu surface.Type: GrantFiled: September 23, 1998Date of Patent: February 20, 2001Assignee: International Business Machines CorporationInventors: Vittorio Sirtori, Franco Zambon, Pietro Luigi Cavallotti, Luca Magagnin
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Patent number: 6165278Abstract: A method for removing thermal grease from an electronic card having plated via holes and including electronic components thereon, the method including the steps of providing a substantially water free solution having an alcohol and at least one compound of a neutral ammonium salt of an organic acid and immersing the electronic card in the solution for a predetermined period of time remove the thermal grease from the electronic card.Type: GrantFiled: March 27, 2000Date of Patent: December 26, 2000Assignee: International Business Machines CorporationInventors: Paul Joseph Hart, Vittorio Sirtori, Sergio Varinelli, Marino Verderio, Franco Zambon