Abstract: A packaged electronic module for downhole applications, in particular in a petrochemical well or similar environment. The electronic module includes one or more electronic components located on each side of a substrate, where the one or more electronic components are attached to the substrate by means of glue.

Abstract: A packaged electronic module for downhole applications, in particular in a petrochemical well or similar environment. The electronic module includes one or more electronic components located on each side of a substrate, where the one or more electronic components are attached to the substrate by means of glue.

Abstract: An electronic assembly for use in a downhole module may include a multilayer ceramic assembly and an electronic component disposed on the multilayer ceramic assembly. The multilayer ceramic assembly includes a ceramic substrate, a nickel plating layer disposed on the ceramic substrate and a gold plating layer having a thickness of less than about 0.5 microns disposed on the nickel plating layer. A wirebond such as an aluminum wirebond extends between the electronic component and the gold plating layer.

Abstract: Methods and packages for containing electronics components are described that use characteristic dimensions, so that the electronics components can remain electrically functional within the package subjected to harsh environments, such as a subterranean environment.

Abstract: Systems, methods, and devices that have a hermetic seal formed using reflow soldering are provided. The hermetic seal may protect electrical components within a packaging for use in downhole tools and/or other applications where the electrical components may be exposed to extreme environments. In one example, an electronic device includes a ceramic substrate having a plated ring. The electronic device also includes a metal lid. A high-temperature solder is disposed between the plated ring of the ceramic substrate and the metal lid. The electronic device includes a hermetically sealed cavity formed between the ceramic substrate and the metal lid. The hermetically sealed cavity is formed via a first bond between the plated ring of the ceramic substrate and the high-temperature solder, and via a second bond between the metal lid and the high-temperature solder. Moreover, the first and second bonds are formed using reflow soldering.

Abstract: The disclosure provides a sensor cartridge that includes a protective housing that is resistant to downhole oilfield environment; a sensor within the protective housing able to measure a parameter of the down-hole oilfield environment; an attaching device to interconnect with another sensor cartridge and/or a hub; a data communication unit within the protective housing, the data communication unit providing wireless communication of the measured parameter to the other sensor cartridge and/or the hub when interconnected with the other sensor cartridge and/or the hub; and a power unit within the protective housing, the power unit providing power supply to sensor and/or data communication unit.

Abstract: The invention provides a sensor cartridge comprising: (a) a protective housing (10), the protective housing being resistant to downhole oilfield environment; (b) a sensor (1) within the protective housing able to measure a parameter of the down-hole oilfield environment; (c) an attaching means (5) to interconnect with another sensor cartridge (102) and/or a hub (1OO); (d) a data communication unit (6) within the protective housing, the data communication unit providing wireless communication of the measured parameter to the other sensor cartridge and/or the hub when interconnected with the other sensor cartridge and/or the hub; and (e) a power unit (7) within the protective housing, the power unit providing power supply to sensor and/or data communication unit.