Patents by Inventor Francois Roussel
Francois Roussel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210314072Abstract: A digital predistortion (DPD) verification and transmitter nonlinearity estimation system includes a transmitter path including one or more power amplifiers (PAs) coupled to an upconversion mixer. A digital tone generator circuit generates a single-tone radio-frequency (RF) signal that is applied to a first input of the upconversion mixer to generate a dual-tone RF signal, where a second input of the upconversion mixer is disabled. A downconversion mixer downconverts an amplified dual-tone RF signal to generate an intermediate-frequency (IF) dual-tone signal. A processing block analyzes the IF dual-tone signal to estimate signal strengths of one or more intermodulation (IM) product signals.Type: ApplicationFiled: April 2, 2020Publication date: October 7, 2021Inventors: Dmitriy ROZENBLIT, Vincent Yves Francois ROUSSEL
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Patent number: 10855352Abstract: A binning-based transmit beamforming for wireless communication systems includes determining a time correlation and a frequency correlation of a beamforming vector estimated from a previous transmission on a current hopping channel and one or more neighboring channels using one or more binning architectures that exploit channel correlation in both frequency and time dimensions. These binning architectures include global binning, local binning, and adaptive version of global and local binning. The subject system determines one or more beamforming weights for the current hoping channel according to the binning architecture, and provides, for transmission, a signal using transmit beamforming based on the one or more beamforming weights.Type: GrantFiled: February 27, 2019Date of Patent: December 1, 2020Assignee: Avago Technologies International Sales Pte. LimitedInventors: Gozde Sahinoglu, Vincent Yves Francois Roussel, Siukai Mak
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Publication number: 20200274587Abstract: A binning-based transmit beamforming for wireless communication systems includes determining a time correlation and a frequency correlation of a beamforming vector estimated from a previous transmission on a current hopping channel and one or more neighboring channels using one or more binning architectures that exploit channel correlation in both frequency and time dimensions. These binning architectures include global binning, local binning, and adaptive version of global and local binning. The subject system determines one or more beamforming weights for the current hoping channel according to the binning architecture, and provides, for transmission, a signal using transmit beamforming based on the one or more beamforming weights.Type: ApplicationFiled: February 27, 2019Publication date: August 27, 2020Inventors: Gozde Sahinoglu, Vincent Yves Francois Roussel, Siukai Mak
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Patent number: 10569443Abstract: To place an insert cut out of film with no gaps in a cavity formed in a foil, after placing the foil on a supporting substrate, the cavity is punched into the foil by means of a tubular cutting punch comprising an inner pusher with a cutting edge in the required shaped of the cavity and the insert, so that the edge goes through the thickness of the foil and cuts a slug out of it; the punch is lifted with the slug held inside the punch, without moving the foil, the film is brought between the foil and the edge of the punch, the punch is lowered once again so as to cut the insert out of the film and then push the insert cut in that way in the cavity with a pusher, and the punch and the pusher are removed, with the insert held in place in the cavity.Type: GrantFiled: December 3, 2014Date of Patent: February 25, 2020Assignee: Thales Dis France SAInventors: Francois Roussel, Joseph Leibenguth, Frederic Blanchon, Jean-Luc Lesur
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Patent number: 10511322Abstract: A high-speed digital transmitter for wireless communication systems includes a plurality of transmitter chain circuits configured to respectively receive incoming component signals having a first frequency and to produce outgoing transmission signals having a second frequency greater than the first frequency in a first domain. In some aspects, the incoming component signals are up-sampled to the second frequency using a plurality of streams processed concurrently at a predetermined sample rate over a predetermined number of interpolation filter stages in each of the plurality of transmitter chain circuits. The high-speed digital transmitter also includes a serializer configured to combine the outgoing transmission signals from the plurality of transmitter chain circuits into a serialized transmission signal having a third frequency greater than the second frequency in a second domain different from the first domain.Type: GrantFiled: January 31, 2019Date of Patent: December 17, 2019Assignee: Avago Technologies International Sales Pte. LimitedInventors: Federico Santiago Cattivelli, Gozde Sahinoglu, Vincent Yves Francois Roussel, Zhiheng Cao, Mengan Pan
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Publication number: 20160318203Abstract: To place an insert cut out of film with no gaps in a cavity formed in a foil, after placing the foil on a supporting substrate, the cavity is punched into the foil by means of a tubular cutting punch comprising an inner pusher with a cutting edge in the required shaped of the cavity and the insert, so that the edge goes through the thickness of the foil and cuts a slug out of it; the punch is lifted with the slug held inside the punch, without moving the foil, the film is brought between the foil and the edge of the punch, the punch is lowered once again so as to cut the insert out of the film and then push the insert cut in that way in the cavity with a pusher, and the punch and the pusher are removed, with the insert held in place in the cavity.Type: ApplicationFiled: December 3, 2014Publication date: November 3, 2016Applicant: GEMALTO SAInventors: Francois ROUSSEL, Joseph LEIBENGUTH, Frederic BLANCHON, Jean-Luc LESUR
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Patent number: 9082061Abstract: A device having an integrated-circuit chip includes an insulating body containing at least one conductive pad, at least one electrical contact opposite the electrically conductive pad, and at least one recess in the body, including a bottom and one aperture. The recess is connected, at the bottom thereof, to the conductive pad and, at the aperture thereof, to the electrical contact. At least one coil spring is arranged in the recess and connecting the conductive pad to the electrical contact. The installation of the spring in the recess is facilitated by means of the friction of the central portion of the spring relative to the walls of the recess. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite the electrically conductive pad.Type: GrantFiled: November 3, 2011Date of Patent: July 14, 2015Assignee: GEMALTO SAInventors: Antoine Bajolle, Frédérick Seban, Joseph Leibenguth, François Roussel, Jean-Christophe Fidalgo
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Patent number: 8973834Abstract: A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers.Type: GrantFiled: April 18, 2005Date of Patent: March 10, 2015Assignee: Gemalto SAInventors: Yves Reignoux, Joseph Jerome Leibenguth, Severine Cheramy, Denis Groeninck, Denis Vere, Francois Roussel
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Publication number: 20130299595Abstract: A device having an integrated-circuit chip includes an insulating body containing at least one conductive pad, at least one electrical contact opposite the electrically conductive pad, and at least one recess in the body, including a bottom and one aperture. The recess is connected, at the bottom thereof, to the conductive pad and, at the aperture thereof, to the electrical contact. At least one coil spring is arranged in the recess and connecting the conductive pad to the electrical contact. The installation of the spring in the recess is facilitated by means of the friction of the central portion of the spring relative to the walls of the recess. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite the electrically conductive pad.Type: ApplicationFiled: November 3, 2011Publication date: November 14, 2013Applicant: GEMALTO SAInventors: Antoine Bajolle, Frédérick Seban, Joseph Leibenguth, François Roussel, Jean-Christophe Fidalgo
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Publication number: 20130153667Abstract: The invention relates to a method for making a device comprising a transponder antenna, wherein the method comprises the steps of: making an assembly including a thin substrate carrying at least one antenna, the antenna having connection end portions bearing on the substrate at substrates locations. The substrate forms or includes a sheet- or strip-like adhesive body in contact with the antenna. The invention also relates to the resulting device.Type: ApplicationFiled: May 24, 2011Publication date: June 20, 2013Applicant: GEMALTO SAInventors: Christophe Bousquet, Jean-Francois Martinent, Laurence Robles, Francois Roussel
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Patent number: 8359729Abstract: A method for producing a device having a transponder antenna connected to contact pads. An antenna with terminal connections is provided in contact with a substrate. The contact pads are placed on the substrate and connected to the terminal sections of the antenna. The connection is produced by means of a soldering by introducing energy between the pads and the terminal sections. The pads are placed such as to provide a surface facing an antenna terminal connection section. The section is arranged on the substrate and the soldering energy is directly applied to the pads. The invention also relates to the device obtained.Type: GrantFiled: May 13, 2008Date of Patent: January 29, 2013Assignee: Gemalto SAInventors: Jean-François Martinent, Laurence Robles, François Roussel
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Publication number: 20110114732Abstract: A secured identification document has at least two flexible layers embedding an electronic module. The electronic module includes a flexible substrate on which are positioned an antenna and a radiofrequency microcontroller storing identification data. The radiofrequency microcontroller is electrically connected to said antenna. The secured identification document has the at least two flexible layers locally joined together by means of a chemically and mechanically tamper proof material that is applied in cavities that are distributed in each of said at least two flexible layers that surround the electronic module in order to make the electronic module interdependent with the at least two flexible layers.Type: ApplicationFiled: April 18, 2005Publication date: May 19, 2011Applicant: AXALTO SAInventors: Yves Reignoux, Joseph Jerome Leibenguth, Severine Cheramy, Denis Groeninck, Denis Vere, Francois Roussel
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Patent number: 7871011Abstract: The chip card comprises a card body and an embedded chip module having a plurality of contact fields connected to respective terminals of the chip. The card body further comprises a positioning feature adapted to univocally identify said contact fields according to their location and orientation on the card body. The positioning feature is a hole or a notch formed on the card body in an area including the chip module such as a contact field which has no electrical functionality as contact field C6 according to ISO 7816-2. The invention is particularly adapted to card bodies including a plug-in removable portion of smaller size comprising said chip module and said positioning feature such as smaller size “mini-plug” SIMs for mobile phones.Type: GrantFiled: June 20, 2005Date of Patent: January 18, 2011Assignee: Gemalto SAInventors: Yves Reignoux, Dorothée Nerot, François Roussel
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Publication number: 20100200662Abstract: The invention relates to a method for producing a device comprising a radio frequency transponder antenna, said method comprising a step of producing the antenna with two terminal sections (15, 17) on a support by means of a wiring technique. The method is characterised in that it comprises a step of producing an end point (9) on an antenna wire at the end of at least one of said terminal sections (5, 15, 17). The invention further relates to the device thus produced.Type: ApplicationFiled: May 19, 2008Publication date: August 12, 2010Applicant: GEMALTO SAInventors: Jean-François Martinent, Laurence Robles, François Roussel
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Publication number: 20100147958Abstract: A method for producing a device having a transponder antenna connected to contact pads. An antenna with terminal connections is provided in contact with a substrate. The contact pads are placed on the substrate and connected to the terminal sections of the antenna. The connection is produced by means of a soldering by introducing energy between the pads and the terminal sections. The pads are placed such as to provide a surface facing an antenna terminal connection section. The section is arranged on the substrate and the soldering energy is directly applied to the pads. The invention also relates to the device obtained.Type: ApplicationFiled: May 13, 2008Publication date: June 17, 2010Applicant: GEMALTO SAInventors: Jean-Francois Martinent, Laurence Robles, François Roussel
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Patent number: 7726578Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).Type: GrantFiled: August 8, 2005Date of Patent: June 1, 2010Assignee: Axalto SAInventors: Alexis Froger, Denis Groeninck, Alain Le Loc'h, Dorothée Nerot, Yves Reignoux, Francois Roussel, Stéphane Provost
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Publication number: 20090065917Abstract: A card body comprises a module-receiving part (3) having a cavity for receiving an electronic module ML. The card body comprises a first side part (4) coupled to the module-receiving part (3), the first side part being separated from the module-receiving part by a first separation line (6), and a second side part (5) coupled to the module-receiving part (3), the second side part being separated from the module-receiving part by a second separation line (7). The module-receiving part defines a third shape corresponding to a third card body (3) type when the first (4) and second (5) side parts are detached from the module-receiving part (3). The module-receiving part defines a second shape (2) corresponding to a second card body type when the first (4) and second (5) side parts are coupled to the module-receiving part (3).Type: ApplicationFiled: August 8, 2005Publication date: March 12, 2009Applicant: Axalto SAInventors: Guillermo Geva, Alain Le Loc'h, Stephane Provost, Francois Roussel, Sylvain Torlet
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Publication number: 20080233804Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).Type: ApplicationFiled: February 7, 2007Publication date: September 25, 2008Applicant: AXALTO S.AInventors: Alexis Froger, Denis Groeninck, Alain Le Loc'h, Dorothee Nerot, Yves Reignoux, Francois Roussel, Stephane Provost
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Publication number: 20080135626Abstract: The chip card comprises a card body (24) and an embedded chip module (14) having a plurality of contact fields (C1-C8) connected to respective terminals of the chip. The card body further comprises a positioning feature (28) adapted to univocally identify said contact fields according to their location and orientation on the card body. The positioning feature is a hole or a notch formed on the card body in an area including the chip module such as a contact field (C1-C8) which has no electrical functionality as contact field C6 according to ISO 7816-2. The invention is particularly adapted to card bodies including a plug-in removable portion of smaller size comprising said chip module and said positioning feature such as smaller size “mini-plug” SIMs for mobile phones.Type: ApplicationFiled: November 29, 2005Publication date: June 12, 2008Applicant: Axalto SAInventors: Yves Reignoux, Dorothee Nerot, Francois Roussel
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Publication number: 20070270039Abstract: A card body comprises a first card body (ID-1 card 1), a second card body (plug-in card 2) and a third card body (mini card 3). The first card body has a first shape (ID-1 shape). The second card body comprises a second shape (plug-in shape). The first card body encompasses the second card body. The third card body comprises a third shape (mini shape). The second card body encompasses the third card body. The third card body has a cavity for receiving an electronic module. A first boundary separates the first shape (ID-1 shape) from the second shape (plug-in shape), and comprises a first number of apertures (5, 6, 7, 17, 18) and a first number of notches (19 and 20) defining a first mechanical inter-card body coupling strength (link between ID-1 card 1 and plug-in card 2).Type: ApplicationFiled: August 8, 2005Publication date: November 22, 2007Applicant: AXALTO SAInventors: Alexis Froger, Denis Groeninck, Alain Le Loc'h, Dorothee Nerot, Yves Reignoux, Francois Roussel, Stephane Provost