Patents by Inventor Frank Burke DiPiazza

Frank Burke DiPiazza has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Interposer for mounting semiconductor dice on substrates
    Patent number: 6303992
    Abstract: An interposer 10 for electrically coupling a semiconductor die 50 to a substrate 70, comprising: an interposer body 12 made of a dielectric material and having a contact surface 14 and an opposed bonding surface 16; a plurality of contact pads 18 arranged about the periphery of the contact surface 14; a plurality of bonding pads 20 arranged across generally the entire area of the bonding surface 16; and a plurality of electrically conductive conduits 22 disposed generally within the interposer body, such that each conduit 22 connects a respective one of the contact pads 18 with a respective one of the bonding pads 20.
    Type: Grant
    Filed: July 6, 1999
    Date of Patent: October 16, 2001
    Assignee: Visteon Global Technologies, Inc.
    Inventors: Cuong Van Pham, Frank Burke DiPiazza, Jay DeAvis Baker, Marc Alan Straub, Vivek Amir Jairazbhoy
  • Molten solder dispensing system
    Patent number: 6000597
    Abstract: An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
    Type: Grant
    Filed: January 28, 1998
    Date of Patent: December 14, 1999
    Assignee: Ford Motor Company
    Inventors: Marc Alan Straub, Frank Burke DiPiazza, Vivek Amir Jairazbhoy, Lakhi Nandial Goenka, Randy Claude Stevenson
  • Molten solder dispensing system
    Patent number: 5746368
    Abstract: An apparatus for dispensing solder includes a nozzle body having a plurality of flow channels formed therein. Each flow channel includes an inlet end and a dispenser end for dispensing solder. The nozzle body forms a nipple surrounding each dispenser end, and the nozzle body further forms a shielding chamber in communication with each dispenser end for protecting the respective nipple, and optionally providing flow of inerting gas and/or excluding ambient oxygen from the soldering area. The nozzle bodies comprise micro-machined silicon. Various flow channel configurations are provided for improved flow characteristics.
    Type: Grant
    Filed: May 15, 1996
    Date of Patent: May 5, 1998
    Assignee: Ford Motor Company
    Inventors: Marc Alan Straub, Frank Burke DiPiazza, Vivek Amir Jairazbhoy, Lakhi Nandial Goenka, Randy Claude Stevenson