Abstract: A method of forming a semiconductor device for improving an electrical connection. The semiconductor device includes a top metal layer. A protective dielectric layer is formed over the top metal layer. A sintering operation is performed while the top metal layer is covered by the protective dielectric layer. After the sintering operation, the protective dielectric layer is patterned to expose areas on the top metal layer for bond pads of the semiconductor device. A bond pad cap is formed on the top metal layer where exposed by the protective dielectric layer.

Abstract: A nut torqueing device for a recessed nut is disclosed. The nut torqueing device includes a nut engaging assembly to engage a nut in a recess. The nut engaging assembly includes: a nut engaging element to engage the nut in the recess, at least one stackable riser element to stackably connect to one of the nut engaging element and an adjacent stackable riser element therebelow, and a transmission engaging element to stackably connect to an uppermost one of the at least one stackable riser element. A ratchet interface within the nut engaging assembly allows rotation of the nut engaging element in only one direction, while other stackable elements rotationally interlock. A low profile transmission extends within a small space to transmit rotational power to the nut engaging assembly. The nut torqueing device is applicable with a terminal nut of an electric generator.

Abstract: An electronic device is formed by providing a substrate having a recess at a top surface. A layer of an organic protective material is formed over the substrate, with the organic protective material extending into the recess. A polishing process is performed on the layer of protective material. The polishing process may remove a portion of an underlying metal layer over the top surface while protecting the underlying metal layer within the recess.

Abstract: A microelectronic device is formed by providing a substrate having a recess at a top surface, and a liner layer formed over the top surface of the substrate, extending into the recess. A protective layer is formed over the liner layer, extending into the recess. A CMP process removes the protective layer and the liner layer from over the top surface of the substrate, leaving the protective layer and the liner layer in the recess. The protective layer is subsequently removed from the recess, leaving the liner layer in the recess. The substrate may include an interconnect region with a bond pad and a PO layer having an opening which forms the recess; the bond pad is exposed in the recess. The liner layer in the recess may be a metal liner suitable for a subsequently-formed wire bond or bump bond.

Abstract: A nut torqueing device for a recessed nut is disclosed. The nut torqueing device includes a nut engaging assembly to engage a nut in a recess. The nut engaging assembly includes: a nut engaging element to engage the nut in the recess, at least one stackable riser element to stackably connect to one of the nut engaging element and an adjacent stackable riser element therebelow, and a transmission engaging element to stackably connect to an uppermost one of the at least one stackable riser element. A ratchet interface within the nut engaging assembly allows rotation of the nut engaging element in only one direction, while other stackable elements rotationally interlock. A low profile transmission extends within a small space to transmit rotational power to the nut engaging assembly. The nut torqueing device is applicable with a terminal nut of an electric generator.

Abstract: A microelectronic device is formed by providing a substrate having a recess at a top surface, and a liner layer formed over the top surface of the substrate, extending into the recess. A protective layer is formed over the liner layer, extending into the recess. A CMP process removes the protective layer and the liner layer from over the top surface of the substrate, leaving the protective layer and the liner layer in the recess. The protective layer is subsequently removed from the recess, leaving the liner layer in the recess. The substrate may include an interconnect region with a bond pad and a PO layer having an opening which forms the recess; the bond pad is exposed in the recess. The liner layer in the recess may be a metal liner suitable for a subsequently-formed wire bond or bump bond.

Abstract: A microelectronic device is formed by providing a substrate having a recess at a top surface, and a liner layer formed over the top surface of the substrate, extending into the recess. A protective layer is formed over the liner layer, extending into the recess. A CMP process removes the protective layer and the liner layer from over the top surface of the substrate, leaving the protective layer and the liner layer in the recess. The protective layer is subsequently removed from the recess, leaving the liner layer in the recess. The substrate may include an interconnect region with a bond pad and a PO layer having an opening which forms the recess; the bond pad is exposed in the recess. The liner layer in the recess may be a metal liner suitable for a subsequently-formed wire bond or bump bond.

Abstract: A microelectronic device is formed by providing a substrate having a recess at a top surface, and a liner layer formed over the top surface of the substrate, extending into the recess. A protective layer is formed over the liner layer, extending into the recess. A CMP process removes the protective layer and the liner layer from over the top surface of the substrate, leaving the protective layer and the liner layer in the recess. The protective layer is subsequently removed from the recess, leaving the liner layer in the recess. The substrate may include an interconnect region with a bond pad and a PO layer having an opening which forms the recess; the bond pad is exposed in the recess. The liner layer in the recess may be a metal liner suitable for a subsequently-formed wire bond or bump bond.

Abstract: A force compensated probe for electrical measurement is provided and includes a support structure having a back plate and sidewalls, a probe for electrical measurement of an article and an elastic base disposed to supportively couple the probe to the back plate such that the probe normally protrudes away from the back plate beyond distal edges of the sidewalls, and, when the probe is applied to the article for the electrical measurement such that components of the support structure contact the article, a predefined load is consistently applied to the elastic base.

Abstract: A force compensated probe for electrical measurement is provided and includes a support structure having a back plate and sidewalls, a probe for electrical measurement of an article and an elastic base disposed to supportively couple the probe to the back plate such that the probe normally protrudes away from the back plate beyond distal edges of the sidewalls, and, when the probe is applied to the article for the electrical measurement such that components of the support structure contact the article, a predefined load is consistently applied to the elastic base.

Abstract: A chair structure comprising a one-piece, loop-shaped tubular frame having a pair of leg structures depending from and supporting the frame. A mesh body support member including a back and seat portion having a plurality of relatively closely interwoven metallic strands, with the strand ends at side and end marginal portions securely connected to the frame. The support member is formed of resiliently flexible mesh material whereby the same elastically yields to the weight of a user, such that the chair back and seat has a small curvature and an attractive appearance and yields tending to conform comfortably to the seated shape of the user.