Abstract: Polishing and cleaning techniques are combinatorially processed and evaluated. A polishing system can include a reactor assembly having multiple reaction chambers, with at least a reaction chamber including a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Different downward forces can be applied to the polishing heads for evaluating optimum process conditions. Channels in the polishing pads can redistribute slurry and chemical to the polishing area.

Abstract: The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

Abstract: Polishing and cleaning techniques are combinatorially processed and evaluated. A polishing system can include a reactor assembly having multiple reaction chambers, with at least a reaction chamber including a rotatable polishing head, slurry and chemical distribution, chemical and water rinse, and slurry and fluid removal. Different downward forces can be applied to the polishing heads for evaluating optimum process conditions. Channels in the polishing pads can redistribute slurry and chemical to the polishing area.

Abstract: The embodiments describe methods for controlling the particles generated when cleaning and drying a wafer in a spin rinse dryer (SRD) module. In some embodiments, the substrate surface is cooled by dispensing deionized (DI) water across the surface of the substrate, while the substrate rests on the SRD chuck. In addition, a method for controlling the particles generated when sleeves in a processing module or SRD contact a substrate surface during a clamping operation or when the sleeves are removed from the substrate surface is provided. A bottom edge or lip of the sleeves and/or the surface of the wafer contacting the sleeve is wetted during clamping/unclamping operations. Alternatively, the substrate may be wetted prior to clamping/unclamping operations.

Abstract: A method and apparatus for supporting and transferring a substrate in a semiconductor wafer processing system. In one aspect, a support ring having one or more substrate support members mounted thereon and defining a central opening therein for receipt of a substrate support member during processing is disclosed. In another aspect, a substrate handler blade having a plurality of substrate supports disposed thereon is provided which is adapted to support a substrate thereon and effectuate substrate transfer between the substrate handler blade and the support ring.

Abstract: A cable connector includes a casing having two members ultra-sonically jointed to define therein an interior space for receiving a connector body which has a coupling end to couple to a counterpart connector with a plurality of slots formed therein, wherein the respective slot receives a connection pin, for establishing signal channel with a counterpart connector. A cable containing a number of conductors has a joint end received within the casing to allow the conductors to be electrically connected to the connector body via a circuit board. The joint end of the cable has two opposite shoulders each having a front face and an opposite rear face to be snugly receive within a chamber defined within the casing by two spaced wall segments with the front and rear faces thereof in abutment relationship with the wall segments to provide resistance to external force acting upon the cable.

Abstract: A system (10) for arrangement of a D-Sub connector (60) and three audio jacks (34), includes an insulative bracket (12) generally comprising an upper section (14) and a lower section (16). The upper section (14) includes a pair of securement posts (18) defining a D-Sub receiving space (19) therebetween for attachment of a D-Sub connector (60) thereto. The lower section (16) includes a jack assembly receiving cavity (29) with latching lugs (28) aside for locking the jack assembly (30) therein wherein a plurality of openings (25) are formed in the front portion (21) for allowing the mating portions (42) of the audio jack assembly (30) to extend forward. The system (10) further includes a pair of boardlocks (54) which not only secures the D-Sub connector (60) to the bracket (12) but also retains the whole system (10) on the mother board in position.

Abstract: A cable connector assembly (10) includes a cable connector kit (12) which comprises an elongated housing having a plurality of contacts (18) therein for engagement with a complementary I/O connector of an I/O card. A PC board (24) is positioned behind the cable connector kit (12) and electrically connected thereto via solder joints with contact tails of the connector kit (12). A cable unit (80) encloses a plurality of wires (82) for being soldered on the rear side of the PC board (24). A pair of covers (40) sandwich therebetween and enclose therein the connector kit (12) and PC board (24) with a coupling section of the connector kit (12) protruding out an front opening (51) of the covers (40). The cable unit (80) comprises an engagement device which can incorporate a hollow (99) defined by two covers (40) to form strain relief means to resist improper pulling force applied to the cable connector assembly (10).

Abstract: An I/O card (1) includes a rectangular frame (10) sandwiched between a top cover (11) and a bottom cover (13). Connector means (16, 18) are positioned at the ends of the I/O card (1) to form an in-and-out interface, and is mounted on a PC board (28) in the I/O card (1). A pair of top and bottom grounding clips (40, 30) are respectively attached on two opposite sides of the frame (10) and electrically and mechanically engage the top surface (29) and the bottom surface (27) of the inner PC board (28), respectively, wherein both grounding clips (30, 40) can be pre-assembled with the frame (10) and the bottom cover (13) as a semi-finished product which is delivered to an I/O card manufacturer who assembles the internal PC board (28) and the associated interface connectors (16, 18) to such pre-assembly without any interference from either of the grounding clips (30, 40) and successively places a top cover (11) thereon to complete the final product.

Abstract: An I/O card assembly (1) is provided having an insulative frame means (10, 40) sandwiched by a pair of generally similar conductive covers (50, 70). Each cover (50) includes a main plate (52) and two elongated side shielding walls (56) downward extending from two opposite sides of the plate (52) a first distance which is generally half of a height of the side wall (12) of the frame (10). A groove (18) horizontally extends along the center line of side wall (12) of the frame (10) for receiving both the hook sections (58) which are respectively inwardly formed at the outermost edges of the side shielding walls (56) of the top and the bottom covers (50, 70).

Abstract: A holding device (10) includes an elongated base (12) and two raised platforms (14, 16) respectively position at two opposite ends thereof. A central cavity (27) is formed in the base for reception of the protrusion portion (62) of the I/O connector (60) therein, and two retaining holes (17) respectively provided approximate or in the platforms extend perpendicular to the holding device (10) for reception of the corresponding screws (50), respectively. The holding device (10) can be attached to and hold the slide latch (30) by its resilience to combine these two components as one unit, and two screws (50) are also temporarily retained in the retaining holes (17) of the holding device (10) by the resilience of the holding device.