Abstract: A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at significant operating current, to obtain enhanced characterization and matching of mounted switching transistors. Trimmable gate lead resistances can be incorporated in the substrate subassemblies. Enhanced compositional, geometrical and electrical module symmetry is available. New module structures and method are afforded.

Abstract: A readily manufacturable low inductance linear semiconductor switching module having coplanar contacts. Also disclosed is a pretestable terminal subassembly for such a module, and a method of making such a terminal subassembly. The module can contain high power, high frequency semiconductor switching devices, operating at high power but low inductance. The module incorporates compositional, geometrical and electrical symmetry in a linear configuration. The terminal subassembly is readily fabricated and assembled into the module. In addition, it permits use of short internal leads that are readily connected to the terminal subassembly.

Abstract: A low inductance triaxial semiconductor switching module. The module permits high power semiconductor switching devices to operated at high frequency but with low inductance. The module incorporates compositional, geometrical and electrical symmetry in connection with a triaxial terminal subassembly having coplanar contact areas. The terminal subassembly is readily fabricated and assembled into the module. The module also includes short internal leads, a special circumferential array of substrates subassemblies, and a circular circuit board having gate and Kelvin circuit patterns.

Abstract: A substrate subassembly for a high power module, and methods involving the same. The substrate subassembly contains only one switching transistor and has at least one integral short terminal lead tab. The substrate subassemblies can be pretested at significant operating current, to obtain enhanced characterization and matching of mounted switching transistors. Trimmable gate lead resistances can be incorporated in the substrate subassemblies. Enhanced compositional, geometrical and electrical module symmetry is available. New module structures and method are afforded.

Abstract: A coil suitable for use as a radio component, for example, an FM trimmer coil, is formed of a self-supporting wire coil enclosed in a housing comprising two halves molded of insulated material and ultrasonically welded together to captivate the coil, ribs on the housing interior extend between turns of the coil in contact therewith to securely contain the coil turns and prevent axial movement thereof. Optionally, a threaded tuning slug is adjustably located within the coil supported by the inner ends of the ribs at a fixed spacing from the coil. Integral coil terminals extend through the housing and a window in the side of the housing allows an additional terminal to be welded to a coil turn intermediate the ends of the coil.