Patents by Inventor FRANK DANAHER

FRANK DANAHER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND METHODS FOR THE PRODUCTION THEREOF
    Publication number: 20210217685
    Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.
    Type: Application
    Filed: March 26, 2021
    Publication date: July 15, 2021
    Applicant: NXP USA, INC.
    Inventors: AUDEL SANCHEZ, JERRY LYNN WHITE, HAMDAN ISMAIL, FRANK DANAHER, DAVID JAMES DOUGHERTY, ARUNA MANOHARAN
  • Overmolded microelectronic packages containing knurled flanges and methods for the production thereof
    Patent number: 10998255
    Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.
    Type: Grant
    Filed: July 12, 2018
    Date of Patent: May 4, 2021
    Assignee: NXP USA, Inc.
    Inventors: Audel Sanchez, Jerry Lynn White, Hamdan Ismail, Frank Danaher, David James Dougherty, Aruna Manoharan
  • OVERMOLDED MICROELECTRONIC PACKAGES CONTAINING KNURLED FLANGES AND METHODS FOR THE PRODUCTION THEREOF
    Publication number: 20200020614
    Abstract: Overmolded microelectronic packages containing knurled base flanges are provided, as are methods for producing the same. In various embodiments, the overmolded microelectronic package includes a molded package body, at least one microelectronic device contained in the molded package body, and a base flange to which the molded package body is bonded. The base flange includes, in turn, a flange frontside contacted by the molded package body, a device attachment region located on the flange frontside and to which the at least one microelectronic is mounted, and a knurled surface region. The knurled surface region includes a first plurality of trenches formed in the base flange and arranged in a first repeating geometric pattern. The molded package body extends or projects into the first plurality of trenches to decrease the likelihood of delamination of the molded package body from the base flange.
    Type: Application
    Filed: July 12, 2018
    Publication date: January 16, 2020
    Applicant: NXP USA, INC.
    Inventors: AUDEL SANCHEZ, JERRY LYNN WHITE, HAMDAN ISMAIL, FRANK DANAHER, DAVID JAMES DOUGHERTY, ARUNA MANOHARAN