Abstract: At least two electrodes are mounted in a wall of a melting furnace for melting glass or glass ceramics to supply electric current for additional heating of the melt. Each electrode includes a first section with a heating element and a second section with a cooling device. The first section is assigned to an interior of the melting furnace and the second section is assigned to a side of the wall of the melting furnace facing away from the glass melt. In the method energy is supplied to the glass melt by the electrodes of the present invention, the first section of each electrode is heated with the heating element, and the second section is cooled with the cooling device. Advantageously the heating element is a non-inductive resistor element and the cooling device operates with a cooling liquid.

Abstract: The suction feeder for glass processing includes a housing containing a material; a heatable noble metal or noble metal alloy feed line embedded in the housing in a thermally insulated fashion; a connection element at one end of the feed line for connection with a molten glass supply device and an outlet element for operative engagement with a suction device at the other end of the feed line. To prevent aspiration of bubbles through the feed line the material together with the housing surrounds the heatable feed line and has a composition and/or structure such that in operation a negative pressure can be produced on an outer side of the feed line. Preferably this negative pressure is lower than a minimum internal pressure within the feed line that is established during a suction process.

Abstract: In order to disclose a structure, which performs the functions of a structured, organic, electrically conductive, transparent electrode and an orientation layer, a cost-reducing and time-saving method for producing such a structure, and uses of this structure, the invention proposes a layer on a substrate, which layer contains an organic, transparent, electrically conductive material and which has a preferred orientation, a method for producing such a layer, in which a transparent, electrically conductive layer is produced and oriented on a substrate, and a use of such a layer as a combined electrode-and orientation layer in LC displays.

Abstract: Suction feeders of this type are used in the processing of glass and have a heatable feed line (1) consisting of noble metal. Said feed line is embedded in a heat-insulated manner in a housing (4a) with a refractory material (3a). Said housing has a connecting flange (5) for connection to a molten glass supply device and an exit flange (6) for operational engagement with a suction ball (7) which removes the gob from the feed line (1). According to the invention, the material (3a, 4a) surrounding the feed line (1) is configured in such a way in terms of the construction and/or substance that a negative pressure can be produced on the outer periphery of the feed line (1), so that the mechanical compression of the feed line (1) is minimised and air bubbles are not drawn up.

Abstract: An ion generator for the generation of a plasma is assembled from module subassemblies. The first subassembly includes a dielectric plate 1, on the first surface 1a of which are located a large number of first electrodes 3, and the second surface 1b of which is coated with a structured conductive layer 2. The second subassembly includes an aperatured spacer plate with a large number of dielectric spacers with a second electrode 5 on the side facing away from the dielectric plate 1. In joining the subassemblies together, the aperatured spacer plate is connected to the dielectric plate 1 at its first surface 1a in such a way that cavities 6 for accommodating plasma are formed by the first electrodes 3, parts of the first surface 1a of the dielectric plate 1 and the spacers 4 with the second electrodes 5. The first set of electrodes 3 shield the points where the subassemblies are bonded together from plasma in the cavities.

Abstract: Described is a method for manufacturing of carrier element modules of a thin carrier element (4) and a thereon mounted semiconductor chip (2). This method renders possible the application of chips (2) with great dimensions (macro-chips) and a wide variety of different types. A chip transfer moulding process is designed so that a minimised height--without the need for reworking--is achievable, and therefore a less costly surface mounting of the chips can be applied. The manufactured module according to the invention can be used as well as in flexible circuit boards (e.g. for cameras) or in chipcards. The method according to the present invention has a first step of putting the at least one IC (2) onto the carrier element (4), a second step of contacting the at least one IC (2) with the carrier element (4) and a third step of transfer moulding a transfer moulding compound (18) to encapsulate the IC (2).

Abstract: The invention relates to an adhesive bond 1 for a plurality of densely packed elements 4a, 4b, 4c guided into a plate pack 3. At the plate surface 2 with the adhesive bond 1 the guidance holes 5a are made larger than the guidance holes 5b in the remainder of the plate pack (3) and the adhesive bond is effected by means of a highly viscous adhesive. Because of the larger opening 5a, an adhesive reservoir 10 is formed at the plate surface 2. This makes it possible to use high viscosity adhesives. The geometric features and the use of a highly viscous adhesive make it possible to manufacture durable and heat-resistant adhesive bonds for elements such as wires, glass fibers or micromechanical components.

Abstract: Hydrophilic polyacrylonitrile filaments or fibres where at least one filament-forming synthetic polymer is wet spun in a spinning solvent and wherein the spinning solvent has added to it from 10 to 20% by weight of a substance which is readily miscible with the spinning solvent and a washing liquid and is a nonsolvent for the polymer to be spun.

Abstract: A surface treatment composition for glass fibers comprising an aqueous solution or emulsion of an organosilane which contains at least one isoimido group. The organosilane with the highest adhesion promotion is N-2-(isomaleimodo)aminoethyl-3-aminopropyl-trimethylsilane.

Abstract: According to this method, copper is dry etched in a glow discharge containing compounds with at least one methyl or methylene group, particularly at temperatures close to room temperature.The method is applied in particular for making conductors on or in module substrates or circuit cards, solder spots, and the wiring of magnetic thin films.

Abstract: The invention is directed to flame-resistant, transparent aromatic polycarbonate compositions comprising polycarbonate resin and an additive amount of a member selected from the group consisting of aldehyde-bisulphite adducts and ketone-bisulphite adducts.

Abstract: The invention relates to a process for rendering flame-resistant the thermoplastic aromatic polycarbonates prepared by a solution process, characterized by dispersing an aqueous solution of salt-like flameproofing agent in a washed and neutral polycarbonate/organic solvent system.

Abstract: The invention relates to a process for the production of hydrophilic filaments or fibres having a sheath/core structure, a porosity of at least 10% and a water retention capacity of at least 10% and having a fibre swelling factor which is lower than the water retention capacity. The process is carried out by spinning a solution of a fibre forming synthetic polymer, especially an acrylonitrile polymer by the dry jet wet-spinning method wherein immediately on leaving the spinning jet and prior to coagulation in the precipitation bath the filaments or fibres are contacted with steam or with the vapor of another liquid which coagulates the filaments.

Abstract: The invention relates to a process for the production of a stabilized crosslinkable copolymer of acrylonitrile which comprises copolymerizing at least 65% by weight of acrylonitrile with from 0.1 to 3% by weight of an N-methylol acyl ester of an ethylenically unsaturated carboxylic acid amide, optionally from 0.5 to 5% by weight of an N-methylol alkyl ether of an ethylenically unsaturated carboxylic acid amide and, optionally, at least one other copolymerizable comonomer in an aqueous medium in the presence of a redox catalyst and in the presence of at least one water-soluble compound containing a carboxylic acid amide group.