Patents by Inventor Frank E. Guthrie

Frank E. Guthrie has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of forming an electronic package with a solder seal
    Patent number: 6352195
    Abstract: A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.
    Type: Grant
    Filed: September 18, 2000
    Date of Patent: March 5, 2002
    Assignee: RF Monolithics, Inc.
    Inventors: Frank E. Guthrie, Paul O. Johnson
  • Method of forming an electronic package with a solder seal
    Patent number: 6119920
    Abstract: A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.
    Type: Grant
    Filed: December 20, 1996
    Date of Patent: September 19, 2000
    Assignee: RF Monolithics, Inc.
    Inventors: Frank E. Guthrie, Paul O. Johnson