Abstract: Communication devices are disclosed. In an example embodiment, a communication device may include a communication module including an illumination source and a body element. The body element may be configured to allow illumination generated by the illumination source to propagate within and illuminate at least a portion of an outer surface of the body element.

Abstract: Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module.

Abstract: One embodiment includes a latching mechanism having a latch, a cam and a slider. The cam is configured to rotate about an axis of rotation. The cam is also configured to displace an end of the latch when the cam is rotated about the axis of rotation. The slider is operably connected to the cam and is configured to cause the cam to rotate about the axis of rotation. Some embodiments also include a retaining cover and a boot. The retaining cover secures a second end of the latch to a module in which the latching mechanism is implemented. The boot is operatively connected to the slider and can be manipulated by a user to activate the slider.

Abstract: Printed circuit board (PCB) positioning spacers in an optoelectronic module. In one example embodiment, an optoelectronic module includes a housing comprising a top shell and a bottom shell, top and bottom printed circuit boards (PCBs) at least partially enclosed within the housing, and a spacer positioned between the first and second PCBs. The spacer includes top and bottom surfaces, a plurality of top posts extending from the top surface, and a bottom post extending from the bottom surface. The top posts extend through openings in the top PCB to contact one or more inside surfaces of the top shell. The bottom post extends through an opening in the bottom PCB to contact an inside surface of the bottom shell.

Abstract: Transceiver modules with dual printed circuit boards. In one example embodiment, a transceiver module includes first and second printed circuit boards (PCBs), a transmitter, a receiver, and a flexible circuit. The first PCB is positioned in a first plane and the second PCB is positioned in a second plane. The transmitter and the receiver are both positioned in a third plane that is offset from the first and second planes. The flexible circuit includes conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs.

Abstract: One embodiment includes a connector comprising a connector housing, a ferrule, and a crimp ring. The connector housing has inner and outer surfaces extending between forward and rear ends of the connector housing. The inner surfaces defined a passageway extending lengthwise between the forward and rear ends. The connector housing includes at least one protrusion formed on one of the outer surfaces that is configured to engage a corresponding connector engaging structure of an alignment guide to secure the connector housing within the alignment guide. The ferrule is configured to mount upon end portions of a plurality of optical fibers of a multi-fiber communication cable. The ferrule is disposed partially within the passageway. The crimp ring encompasses the rear end of the connector housing and is configured to secure the connector to the multi-fiber communication cable.

Abstract: One embodiment includes a latching mechanism having a latch, a cam and a slider. The cam is configured to rotate about an axis of rotation. The cam is also configured to displace an end of the latch when the cam is rotated about the axis of rotation. The slider is operably connected to the cam and is configured to cause the cam to rotate about the axis of rotation. Some embodiments also include a retaining cover and a boot. The retaining cover secures a second end of the latch to a module in which the latching mechanism is implemented. The boot is operatively connected to the slider and can be manipulated by a user to activate the slider.

Abstract: Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module.

Abstract: Printed circuit board (PCB) positioning in an optoelectronic module. In one example embodiment, a spacer can be use to position top and bottom PCBs that are at least partially enclosed within top and bottom shells of an optoelectronic module. The spacer includes top and bottom surfaces and a plurality of top posts extending from the top surface. The top posts are configured to extend through openings in the top PCB to contact inside surfaces of the top shell.

Abstract: Transceiver modules with dual printed circuit boards. In one example embodiment, a transceiver module includes first and second printed circuit boards (PCBs), a transmitter, a receiver, and a flexible circuit. The first PCB is positioned in a first plane and the second PCB is positioned in a second plane. The transmitter and the receiver are both positioned in a third plane that is offset from the first and second planes. The flexible circuit includes conductive traces that allow electrical data signals to pass between the transmitter and the receiver and the first and second PCBs.

Abstract: An optical element includes a light absorbing medium formed of a transparent material and light absorbing elements encapsulated within the transparent material. The light absorbing elements have an ultraviolet (UV) light-dependent absorption characteristic and UV light is applied to the light absorbing medium to change the attenuation of the light absorbing medium to a desired attenuation. UV light is applied to the light absorbing medium in a controlled manner to change the attenuation of the light absorbing medium from an initial attenuation to the desired attenuation. The application of UV light to the light absorbing medium can cause the light absorbing elements encapsulated within the light absorbing medium to degrade such that the amount of light absorbed by the light absorbing medium is reduced. Reducing the amount of light that is absorbed effectively reduces the attenuation of the light absorbing medium.

Abstract: An opto-electronic housing and an opto-electronic assembly. The housing includes an enclosure defining a cavity. An opening through a wall of the enclosure is adapted to receive a substrate. A mount projects into the cavity opposite the opening. The mount is adapted to support an opto-electronic device. Adjacent the mount is an optically transmissive region in a wall of the enclosure. An opto-electronic assembly also includes a substrate disposed in the opening and an opto-electronic device supported by the mount.

Abstract: A fiber optic transmitter and the method of using the fiber optic transmitter includes a laser supplied with an input current and which produces a light beam coupled into a fiber. A photodiode detects the intensity of the light beam. A processor performs the steps of sampling the waveform and detecting peaks and valleys of the detected light beam waveform. The processor also tunes the input current based on the relative values of the detected peaks and valleys of the detected light beam waveform.

Abstract: An electro-optical subassembly generally includes a base supporting at least one lead and a lens unit having a lens. The lead supports an electro-optical component. The lens unit is through transmission laser welded to the base such that the lens is aligned with the electro-optical component.

Abstract: An optical element includes a light absorbing medium formed of a transparent material and light absorbing elements encapsulated within the transparent material. The light absorbing elements have an ultraviolet (UV) light-dependent absorption characteristic and UV light is applied to the light absorbing medium to change the attenuation of the light absorbing medium to a desired attenuation. UV light is applied to the light absorbing medium in a controlled manner to change the attenuation of the light absorbing medium from an initial attenuation to the desired attenuation. The application of UV light to the light absorbing medium can cause the light absorbing elements encapsulated within the light absorbing medium to degrade such that the amount of light absorbed by the light absorbing medium is reduced. Reducing the amount of light that is absorbed effectively reduces the attenuation of the light absorbing medium.

Abstract: A method for controlling the attenuation of an optical element. A base material, such as a resin, is selected from which to fabricate the optical element. The base material has an intrinsic attenuation or intrinsic absorption spectrum. A predetermined concentration of a first type of dye molecule is then added to the base material to vary the intrinsic attenuation of the base material to achieve a predetermined absorption spectrum.

Abstract: An electro-optical subassembly formed using an optical unit and a base. The optical unit has a lens and a cavity in communication with the lens, the cavity having surfaces aligned with the lens. The base includes a body, shaped to fit within the cavity so as to have a predetermined alignment with the lens, and a plurality of leads embedded in and extending from the body. At least one end of one lead is positioned behind the lens when the base is inserted into the cavity. An electro-optical component supported by the at least one lead behind the lens and is optically accessible to the lens when the base is inserted into the optical unit.

Abstract: An electro-optical subassembly formed using an optical unit and a base. The optical unit has a lens and a cavity in communication with the lens, the cavity having surfaces aligned with the lens. The base includes a body, shaped to fit within the cavity so as to have a predetermined alignment with the lens, and a plurality of leads embedded in and extending from the body. At least one end of one lead is positioned behind the lens when the base is inserted into the cavity and supports an electro-optical component that is aligned to the lens when the base is inserted into the optical unit.

Abstract: An electro-optical subassembly generally includes a base supporting at least one lead and a lens unit having a lens. The lead supports an electro-optical component. The lens unit is through transmission laser welded to the base such that the lens is aligned with the electro-optical component.

Abstract: An opto-electronic housing and an opto-electronic assembly. The housing includes an enclosure defining a cavity. An opening through a wall of the enclosure is adapted to receive a substrate. A mount projects into the cavity opposite the opening. The mount is adapted to support an opto-electronic device. Adjacent the mount is an optically transmissive region in a wall of the enclosure. An opto-electronic assembly also includes a substrate disposed in the opening and an opto-electronic device supported by the mount.