Patents by Inventor Frank Hawley
Frank Hawley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10855286Abstract: A resistive random-access memory device formed on a semiconductor substrate includes a first interlayer dielectric formed over the semiconductor substrate and includes a first via. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A lower metal layer formed in the first via has a top surface extending above a top surface of the chemical-mechanical-polishing stop layer. A dielectric layer is formed over the chemical-mechanical-polishing stop layer and is in electrical contact with the lower metal layer. A barrier metal layer is formed over the dielectric layer. Edges of the dielectric layer and the first barrier metal layer extend beyond outer edges of the first via. A second interlayer dielectric layer including a second via is formed over the dielectric layer. An upper metal layer formed in the second via in electrical contact with the barrier metal layer.Type: GrantFiled: January 29, 2019Date of Patent: December 1, 2020Assignee: Microsemi SoC Corp.Inventors: Jonathan Greene, Frank Hawley, John McCollum
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Publication number: 20200013952Abstract: A resistive random-access memory device formed on a semiconductor substrate includes a first interlayer dielectric formed over the semiconductor substrate and includes a first via. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A lower metal layer formed in the first via has a top surface extending above a top surface of the chemical-mechanical-polishing stop layer. A dielectric layer is formed over the chemical-mechanical-polishing stop layer and is in electrical contact with the lower metal layer. A barrier metal layer is formed over the dielectric layer. Edges of the dielectric layer and the first barrier metal layer extend beyond outer edges of the first via. A second interlayer dielectric layer including a second via is formed over the dielectric layer. An upper metal layer formed in the second via in electrical contact with the barrier metal layer.Type: ApplicationFiled: January 29, 2019Publication date: January 9, 2020Applicant: Microsemi SoC Corp.Inventors: Jonathan Greene, Frank Hawley, John McCollum
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Patent number: 10256822Abstract: A resistive random-access memory device formed on a semiconductor substrate includes an interlayer dielectric formed over the semiconductor substrate and includes a first via. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A lower metal layer formed in the first via presents a substantially planar top surface. A dielectric layer is formed over the chemical-mechanical-polishing stop layer and is in electrical contact with the lower metal layer. A barrier metal layer is formed over the dielectric layer. Edges of the dielectric layer and the first barrier metal layer form an aligned stack having edges extending beyond outer edges of the first via. A dielectric barrier layer including a second via is formed over the aligned stack and at least a portion of the chemical-mechanical-polishing stop layer. An upper metal layer formed in the second via in electrical contact with the barrier metal layer.Type: GrantFiled: April 18, 2018Date of Patent: April 9, 2019Assignee: Microsemi SoC Corp.Inventors: Jonathan Greene, Frank Hawley, John McCollum
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Publication number: 20180241398Abstract: A resistive random-access memory device formed on a semiconductor substrate includes an interlayer dielectric formed over the semiconductor substrate and includes a first via. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A lower metal layer formed in the first via presents a substantially planar top surface. A dielectric layer is formed over the chemical-mechanical-polishing stop layer and is in electrical contact with the lower metal layer. A barrier metal layer is formed over the dielectric layer. Edges of the dielectric layer and the first barrier metal layer form an aligned stack having edges extending beyond outer edges of the first via. A dielectric barrier layer including a second via is formed over the aligned stack and at least a portion of the chemical-mechanical-polishing stop layer. An upper metal layer formed in the second via in electrical contact with the barrier metal layer.Type: ApplicationFiled: April 18, 2018Publication date: August 23, 2018Inventors: Jonathan Greene, Frank Hawley, John McCollum
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Patent number: 9991894Abstract: A layout arrangement for a resistive random access memory cell includes an active area, a polysilicon row address line over the active region, a metal column address line running orthogonal to the row address line and having an active region contact portion extending over the active region and having a contact to the active region. A metal output line runs parallel to the column address line over the active region. A first cell contact region intersects with the output line and has a contact to the active region. A first metal cell contact region forms an intersection with the first cell contact region. A first resistive random access memory device is formed at the intersection of the first cell contact region and the output line. A second resistive random access memory device is formed at the intersection of the first cell contact region and the first cell contact region.Type: GrantFiled: August 26, 2015Date of Patent: June 5, 2018Assignee: Microsemi SoC Corp.Inventors: Jonathan Greene, Frank Hawley, John L. McCollum
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Patent number: 9754948Abstract: A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor.Type: GrantFiled: January 15, 2014Date of Patent: September 5, 2017Assignee: MICROSEMI SoC CORPORATIONInventors: Fethi Dhaoui, John McCollum, Frank Hawley, Leslie Richard Wilkinson
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Publication number: 20150365090Abstract: A layout arrangement for a resistive random access memory cell includes an active area, a polysilicon row address line over the active region, a metal column address line running orthogonal to the row address line and having an active region contact portion extending over the active region and having a contact to the active region. A metal output line runs parallel to the column address line over the active region. A first cell contact region intersects with the output line and has a contact to the active region. A first metal cell contact region forms an intersection with the first cell contact region. A first resistive random access memory device is formed at the intersection of the first cell contact region and the output line. A second resistive random access memory device is formed at the intersection of the first cell contact region and the first cell contact region.Type: ApplicationFiled: August 26, 2015Publication date: December 17, 2015Inventors: Jonathan Greene, Frank Hawley, John L. McCollum
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Patent number: 9147836Abstract: A layout arrangement for a resistive random access memory cell includes an active area, a polysilicon row address line over the active region, a metal column address line running orthogonal to the row address line and having an active region contact portion extending over the active region and having a contact to the active region. A metal output line runs parallel to the column address line over the active region. A first cell contact region intersects with the output line and has a contact to the active region. A first metal cell contact region forms an intersection with the first cell contact region. A first resistive random access memory device is formed at the intersection of the first cell contact region and the output line. A second resistive random access memory device is formed at the intersection of the first cell contact region and the first cell contact region.Type: GrantFiled: February 12, 2015Date of Patent: September 29, 2015Assignee: Microsemi SoC CorporationInventors: Jonathan Greene, Frank Hawley, John McCollum
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Publication number: 20150155483Abstract: A layout arrangement for a resistive random access memory cell includes an active area, a polysilicon row address line over the active region, a metal column address line running orthogonal to the row address line and having an active region contact portion extending over the active region and having a contact to the active region. A metal output line runs parallel to the column address line over the active region. A first cell contact region intersects with the output line and has a contact to the active region. A first metal cell contact region forms an intersection with the first cell contact region. A first resistive random access memory device is formed at the intersection of the first cell contact region and the output line. A second resistive random access memory device is formed at the intersection of the first cell contact region and the first cell contact region.Type: ApplicationFiled: February 12, 2015Publication date: June 4, 2015Inventors: Jonathan Greene, Frank Hawley, John McCollum
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Patent number: 8981328Abstract: A resistive random access memory cell formed in an integrated circuit includes first and second resistive random access memory devices, each including an anode and a cathode. The anode of the second resistive random access memory device is connected to the anode of the first resistive random access memory device. A programming transistor has a first source/drain terminal connected to a programming potential node, a second source/drain terminal connected to the anodes of the first and second resistive random access memory devices, and a gate connected to a program-enable node.Type: GrantFiled: May 9, 2014Date of Patent: March 17, 2015Assignee: Microsemi SoC CorporationInventors: Jonathan Greene, Frank Hawley, John McCollum
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Publication number: 20140246644Abstract: A resistive random access memory device formed on a semiconductor substrate comprises an interlayer dielectric having a via formed therethrough. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A barrier metal liner lines walls of the via. A conductive plug is formed in the via. A first barrier metal layer is formed over the chemical-mechanical-polishing stop layer and in electrical contact with the conductive plug. A dielectric layer is formed over the first barrier metal layer. An ion source layer is formed over the dielectric layer. A dielectric barrier layer is formed over the ion source layer, and includes a via formed therethrough communicating with the ion source layer. A second barrier metal layer is formed over the dielectric barrier layer and in electrical contact with the ion source layer. A metal interconnect layer is formed over the barrier metal layer.Type: ApplicationFiled: May 9, 2014Publication date: September 4, 2014Applicant: Microsemi SoC CorporationInventors: Jonathan Greene, Frank Hawley, John McCollum
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Publication number: 20140138755Abstract: A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor.Type: ApplicationFiled: January 15, 2014Publication date: May 22, 2014Applicant: Microsemi SoC CorporationInventors: Fethi Dhaoui, John McCollum, Frank Hawley, Leslie Richard Wilkinson
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Patent number: 8633548Abstract: A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor.Type: GrantFiled: September 30, 2010Date of Patent: January 21, 2014Assignee: Microsemi SoC CorporationInventors: Fethi Dhaoui, John McCollum, Frank Hawley, Leslie Richard Wilkinson
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Publication number: 20110024821Abstract: A flash memory cell includes a p-channel flash transistor having a source, a drain, a floating gate, and a control gate, an n-channel flash transistor having a source, a drain coupled to the drain of the p-channel flash transistor, a floating gate, and a control gate, a switch transistor having a gate coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source, and a drain, and an n-channel assist transistor having a drain coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source coupled to a fixed potential, and a gate.Type: ApplicationFiled: October 13, 2010Publication date: February 3, 2011Inventors: Zhigang Wang, Fethi Dhaoui, Michael Sadd, John McCollum, Frank Hawley
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Publication number: 20110018070Abstract: A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor.Type: ApplicationFiled: September 30, 2010Publication date: January 27, 2011Inventors: Fethi Dhaoui, John McCollum, Frank Hawley, Leslie Richard Wilkinson
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Patent number: 7839681Abstract: A flash memory cell includes a p-channel flash transistor having a source, a drain, a floating gate, and a control gate, an n-channel flash transistor having a source, a drain coupled to the drain of the p-channel flash transistor, a floating gate, and a control gate, a switch transistor having a gate coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source, and a drain, and an n-channel assist transistor having a drain coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source coupled to a fixed potential, and a gate.Type: GrantFiled: December 12, 2008Date of Patent: November 23, 2010Assignee: Actel CorporationInventors: Zhigang Wang, Fethi Dhaoui, Michael Sadd, John McCollum, Frank Hawley
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Patent number: 7838944Abstract: A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor.Type: GrantFiled: March 25, 2008Date of Patent: November 23, 2010Assignee: Actel CorporationInventors: Fethi Dhaoui, John McCollum, Frank Hawley, Leslie Wilkinson
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Publication number: 20100149873Abstract: A flash memory cell includes a p-channel flash transistor having a source, a drain, a floating gate, and a control gate, an n-channel flash transistor having a source, a drain coupled to the drain of the p-channel flash transistor, a floating gate, and a control gate, a switch transistor having a gate coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source, and a drain, and an n-channel assist transistor having a drain coupled to the drains of the p-channel flash transistor and the n-channel flash transistor, a source coupled to a fixed potential, and a gate.Type: ApplicationFiled: December 12, 2008Publication date: June 17, 2010Applicant: ACTEL CORPORATIONInventors: Zhigang Wang, Fethi Dhaoui, Michael Sadd, John McCollum, Frank Hawley
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Patent number: 7590000Abstract: A non-volatile programmable memory cell suitable for use in a programmable logic array includes a non-volatile MOS transistor of a first conductivity type in series with a volatile MOS transistor of a second conductivity type. The non-volatile MOS transistor may be a floating gate transistor, such as a flash transistor, or may be another type of non-volatile transistor such as a floating charge-trapping SONOS, MONOS transistor, or a nano-crystal transistor. A volatile MOS transistor, an inverter, or a buffer may be driven by coupling its gate or input to the common connection between the non-volatile MOS transistor and the volatile MOS transistor.Type: GrantFiled: June 13, 2007Date of Patent: September 15, 2009Assignee: Actel CorporationInventors: John McCollum, Hung-Sheng Chen, Frank Hawley
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Publication number: 20090057821Abstract: A reprogrammable metal-to-metal antifuse is disposed between two metal interconnect layers in an integrated circuit. A lower barrier layer is formed from Ti. A lower adhesion-promoting layer is disposed over the lower Ti barrier layer. An antifuse material layer selected from a group comprising at least one of amorphous carbon and amorphous carbon doped with at least one of hydrogen and fluorine is disposed over the lower adhesion-promoting layer. An upper adhesion-promoting layer is disposed over the antifuse material layer. An upper Ti barrier layer is disposed over the upper adhesion-promoting layer.Type: ApplicationFiled: October 27, 2008Publication date: March 5, 2009Applicant: ACTEL CORPORATIONInventors: A. Farid Issaq, Frank Hawley, John McCollum