Patents by Inventor Frank J. Baresich

Frank J. Baresich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7279122
    Abstract: An injection mold and process are arranged to produce very thin articles, such as data discs. Molten plastic is injected into mold parts forming a thin cavity (17), in a cyclic molding process wherein the mold parts are subjected to a substantially constant temperature stimulus and rise and fall in temperature during injection and cooling of the molten plastic. Temperature boosting thermal insulation layers (11, 21) are placed along at least certain parts of the molding cavity surface. This elevates the temperature of the molted melt material for a time during injection. According to a calculated relationship, this thermal insulation is sized to permit the thin mold cavity to fill before heat transfer to the mold parts solidifies the molding material and blocks further flow. The temperature boosters can be contoured in thickness.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: October 9, 2007
    Assignee: Thermal Wave Molding Corporation
    Inventors: Frank J. Baresich, Robert F. Thompson
  • Patent number: 7175416
    Abstract: A nozzle for injection molding is made of at thermally conductive metal material but is thermally conductively blocked or interrupted. An abrupt reduction in wall thickness and/or a gap in the continuity of thermally conductive material occur along the nozzle material passageway. This provides a localized restriction to thermal conduction, causing a reduction in heat flow from the mold to the material supply while cooling the melt material near the end of the nozzle. This material, which is relatively cooled to near the mold temperature, becomes the last injected material when filling of the mold is completed, occupying the area of the sprue. As a result, the sprue is relatively cool, thus reducing stringing and shortening mold cycle time.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: February 13, 2007
    Assignee: Thermal Wave Molding Corp.
    Inventors: Frank J. Baresich, Robert F. Thompson
  • Publication number: 20040191354
    Abstract: A nozzle for injection molding is made of at thermally conductive metal material but is thermally conductively blocked or interrupted. An abrupt reduction in wall thickness and/or a gap in the continuity of thermally conductive material occur along the nozzle material passageway. This provides a localized restriction to thermal conduction, causing a reduction in heat flow from the mold to the material supply while cooling the melt material near the end of the nozzle. This material, which is relatively cooled to near the mold temperature, becomes the last injected material when filling of the mold is completed, occupying the area of the sprue. As a result, the sprue is relatively cool, thus reducing stringing and shortening mold cycle time.
    Type: Application
    Filed: March 31, 2004
    Publication date: September 30, 2004
    Inventors: Frank J. Baresich, Robert F. Thompson
  • Publication number: 20020014722
    Abstract: Mold cycle time is accelerated by employing thermally insulating surface temperature boosters, which are of a minimum thickness to promote cooling by heat transfer through the boosters. According to the thermal transfer properties of the insulating boosters and the respective temperatures of the molten material and the dies, the temperature of the cavity surface is raised by contact with the molten material to equal or exceed the temperature required to produce a molded article, preferably just until the time that the mold is fully filled. Heat transfer through the boosters to the dies then cools and solidifies the molded article until it can be removed from the mold. The temperature boosters result in increased cavity surface temperatures, such that the mold dies can be kept at substantially lower temperatures. The overall result is a reduction in mold cooling time and therefore acceleration of mold cycling.
    Type: Application
    Filed: July 10, 2001
    Publication date: February 7, 2002
    Inventor: Frank J. Baresich
  • Patent number: 6276656
    Abstract: Mold cycle time is accelerated by employing thermally insulating surface temperature boosters, which are of a minimum thickness to promote cooling by heat transfer through the boosters. According to the thermal transfer properties of the insulating boosters and the respective temperatures of the molten material and the dies, the temperature of the cavity surface is raised by contact with the molten material to equal or exceed the temperature required to produce a molded article, preferably just until the time that the mold is fully filled. Heat transfer through the boosters to the dies then cools and solidifies the molded article until it can be removed from the mold. The temperature boosters result in increased cavity surface temperatures, such that the mold dies can be kept at substantially lower temperatures. The overall result is a reduction in mold cooling time and therefore acceleration of mold cycling.
    Type: Grant
    Filed: October 19, 1999
    Date of Patent: August 21, 2001
    Assignee: Thermal Wave Molding Corp.
    Inventor: Frank J. Baresich
  • Patent number: 6019930
    Abstract: Mold cycle time is accelerated by employing thermally insulating surface temperature boosters, which are of a minimum thickness to promote cooling by heat transfer through the boosters. According to the thermal transfer properties of the insulating boosters and the respective temperatures of the molten material and the dies, the temperature of the cavity surface is raised by contact with the molten material to equal or exceed the temperature required to produce a molded article, preferably just until the time that the mold is fully filled. Heat transfer through the boosters to the dies then cools and solidifies the molded article until it can be removed from the mold. The temperature boosters result in increased cavity surface temperatures, such that the mold dies can be kept at substantially lower temperatures. The overall result is a reduction in mold cooling time and therefore acceleration of mold cycling.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: February 1, 2000
    Assignee: Thermal Wave Molding Corp.
    Inventor: Frank J. Baresich
  • Patent number: 5324473
    Abstract: Methods and apparatus for molding a thermoplastic article bring the surface of the mold cavity above the flow stress relaxation temperature of the molten plastic during molding of a part sufficiently long enough to relax the resin at the surface of the molded part and produce negligible residual stress. The surface of the mold cavity is maintained above the flow stress relaxation temperature of the molten plastic as the center of molten plastic in the mold cavity cools from a temperature above the solidification temperature toward the solidification temperature, thereby reducing flow-induced and temperature gradient induced stresses in the solidified mold material of the molded part. The heat of the molten plastic introduced into the mold is used as the source of the heat for heating the surface of the mold cavity.
    Type: Grant
    Filed: June 3, 1991
    Date of Patent: June 28, 1994
    Inventor: Frank J. Baresich