Abstract: A non-contact sensor for determining orientation of an object, such as a tire and wheel assembly of a vehicle, includes a projector assembly having a light emitter, a lens assembly and a mask, with the mask including mask apertures and the light emitter configured to project light through the lens assembly and mask apertures and onto the object, and with the mask apertures creating a light pattern of projected light onto the object. The sensor also includes an imager configured to image reflections of the light pattern from the object, and a processor. The projector assembly and imager are angled with respect to one another, and the processor is configured to process imaged reflections of the light pattern to derive the orientation of the object, such as the alignment orientation of the tire and wheel assembly.

Abstract: An electronic device comprises a substrate and an electrical contact in contact with the dielectric layer and electrically coupled with at least one resistor, a substrate carrier including an electrical trace electrically coupled to the electrical contact, a polymer enclosing the electrical contact, and a substantially planar film disposed over the electrical contact.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep the interface areas free of an insulative material. The method distributes a flowable insulative material around portions of the die assembly.

Abstract: A technique for handling residual ink that is from time to time present on the orifice plate of an ink-jet print cartridge. In one preferred embodiment, an ink-jet print cartridge is equipped with an ink-receptive member, such as an absorbent pad. The pad is located so that a service station wiper will move the residual ink from the orifice plate and spread it across the pad. The pad absorbs the ink. In essence, the ink is sequestered on the cartridge, in the pad. The exterior surface of the pad dries quickly so that there is little likelihood of developing a tacky area over the pad to which fibers may stick and degrade print quality.