Patents by Inventor Frank Krueger
Frank Krueger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230386706Abstract: The invention relates to a method for producing a wire, having at least the following steps: (i) providing a wire precursor; (ii) pressing depressions on the wire precursor and optionally reshaping the wire precursor in the process, and (iii) annealing the wire precursor provided with depressions in order to form the wire; wherein the wire has a content of at least 95 wt. % of copper based on the total weight of the wire. The invention additionally relates to a wire which can be obtained according to the aforementioned method and to the use of a roller in order to produce the wire and/or in order to set the roughness at at least one location of the wire.Type: ApplicationFiled: September 15, 2021Publication date: November 30, 2023Inventors: Marcel NEUBAUER, Frank KRÜGER
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Patent number: 11556728Abstract: Systems, methods, and techniques to efficiently and effectively verifying and calibrating a machine learning model. The method can include training a machine learning model by at least processing training data with the machine learning model. The method can further include manipulating a first data set of the training data and applying the manipulated first data set to the machine learning model to thereby determine a first matching rate. In addition, the method can include applying the manipulated first data set to a rule engine to thereby determine a second matching rate and determining a difference between the first matching rate and the second matching rate. The method can further include determining whether the difference is within a predefined threshold range and providing an error indication if the determined difference is outside of the predefined threshold range.Type: GrantFiled: December 11, 2018Date of Patent: January 17, 2023Assignee: SAP SEInventors: Stefan Butscher, Frank Krueger
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Patent number: 11424506Abstract: The invention relates to a rechargeable battery transportation device (10) for a re-chargeable battery (22), in particular a lithium rechargeable battery, with (a) an external case (12) which has (i) a base body (16) with a filling opening (20), (ii) a cap (18) for creating an air-tight seal of the filling opening (20), and (iii) a ventilation opening (28), and (b) an inner tank (14) which (i) is arranged in the external case (12) and (ii) encloses an accommodation space (30) for accommodating the rechargeable battery (22). According to the invention, between the external case (12) and the inner tank (14) there is at least one flow path (S) from the accommodation space (30) to the ventilation opening (28), and a heat absorption material (36) is arranged along the flow path (S).Type: GrantFiled: March 5, 2019Date of Patent: August 23, 2022Assignee: STOEBICH TECHNOLOGY GMBHInventors: Sascha Bruns, Stefan Tappe, Marc Dinse, Frank Krüger
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Publication number: 20200184253Abstract: Systems, methods, and techniques to efficiently and effectively verifying and calibrating a machine learning model. The method can include training a machine learning model by at least processing training data with the machine learning model. The method can further include manipulating a first data set of the training data and applying the manipulated first data set to the machine learning model to thereby determine a first matching rate. In addition, the method can include applying the manipulated first data set to a rule engine to thereby determine a second matching rate and determining a difference between the first matching rate and the second matching rate. The method can further include determining whether the difference is within a predefined threshold range and providing an error indication if the determined difference is outside of the predefined threshold range.Type: ApplicationFiled: December 11, 2018Publication date: June 11, 2020Inventors: Stefan Butscher, Frank Krueger
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Patent number: 10593608Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.Type: GrantFiled: May 9, 2018Date of Patent: March 17, 2020Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Ronald Eisele, Anton-Zoran Miric, Frank Krüger, Wolfgang Schmitt
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Publication number: 20190280259Abstract: The invention relates to a rechargeable battery transportation device (10) for a re-chargeable battery (22), in particular a lithium rechargeable battery, with (a) an external case (12) which has (i) a base body (16) with a filling opening (20), (ii) a cap (18) for creating an air-tight seal of the filling opening (20), and (iii) a ventilation opening (28), and (b) an inner tank (14) which (i) is arranged in the external case (12) and (ii) encloses an accommodation space (30) for accommodating the rechargeable battery (22). According to the invention, between the external case (12) and the inner tank (14) there is at least one flow path (S) from the accommodation space (30) to the ventilation opening (28), and a heat absorption material (36) is arranged along the flow path (S).Type: ApplicationFiled: March 5, 2019Publication date: September 12, 2019Inventors: Sascha BRUNS, Stefan TAPPE, Marc DINSE, Frank KRÜGER
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Patent number: 10212836Abstract: One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%.Type: GrantFiled: January 19, 2018Date of Patent: February 19, 2019Assignee: Heraeus Deutschland GmbH & Co. KGInventors: Robert Dittmer, Frank Krüger
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Patent number: 10176420Abstract: A strip-type substrate includes a foil having a number of substrate units for producing chip card modules. The substrate has an inner face for at least partial direct or indirect contacting of a semiconductor chip and an outer face lying opposite the inner face. The foil includes of steel, in particular high-grade steel, and a first layer of nickel or a nickel alloy on at least some sections of the outer face.Type: GrantFiled: February 17, 2016Date of Patent: January 8, 2019Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KGInventors: Eckhard Ditzel, Bernd Gehlert, Frank Krüger
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Publication number: 20180362372Abstract: The current method relates to the use of a composition comprising a non-ionic surfactant and an ionic polymer in papermaking processes. The compositions are useful inter alia as retention aids and/or drainage aids when added to cellulosic suspensions.Type: ApplicationFiled: July 12, 2018Publication date: December 20, 2018Applicant: Solenis Technologies, L.P.Inventors: Patric BIERGANNS, Werner Peter Karl FISCHER, Jochen Josef HOUBEN, Joerg KARP, Frank KRUEGER
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Publication number: 20180261518Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.Type: ApplicationFiled: May 9, 2018Publication date: September 13, 2018Inventors: Ronald EISELE, Anton-Zoran MIRIC, Frank KRÜGER, Wolfgang SCHMITT
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Publication number: 20180213665Abstract: One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%.Type: ApplicationFiled: January 19, 2018Publication date: July 26, 2018Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Robert DITTMER, Frank KRÜGER
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Publication number: 20180072595Abstract: The invention relates to the use of a composition comprising a non-ionic surfactant and an ionic polymer and method of preparation of the composition. The compositions are useful inter alia as flocculation auxiliaries for solid-liquid separation processes, for example in sludge dewatering/waste water purification and as retention aids or other additives in paper manufacture.Type: ApplicationFiled: November 17, 2017Publication date: March 15, 2018Inventors: Patric Bierganns, Warner Pert Karl Fricker, Jochen Josef Houben, Joerg Karp, Frank Krueger
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Publication number: 20180040580Abstract: A power electronics module includes a semiconductor element and a support with a functional surface for indirectly connecting to the semiconductor element. A palladium barrier layer is formed directly or indirectly on the functional surface, and the semiconductor element is directly or indirectly connected to the barrier layer face facing away from the functional surface by a layer of sintering silver paste. A silver layer is can be formed on the barrier layer, and a nickel layer can be formed between the functional surface and the barrier layer.Type: ApplicationFiled: February 24, 2016Publication date: February 8, 2018Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KGInventors: Frank KRÜGER, Gerald FREISE
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Publication number: 20180039875Abstract: A strip-type substrate includes a foil having a number of substrate units for producing chip card modules. The substrate has an inner face for at least partial direct or indirect contacting of a semiconductor chip and an outer face lying opposite the inner face. The foil includes of steel, in particular high-grade steel, and a first layer of nickel or a nickel alloy on at least some sections of the outer face.Type: ApplicationFiled: February 17, 2016Publication date: February 8, 2018Applicant: Heraeus Deutschland GmbH & Co. KGInventors: Eckhard DITZEL, Bernd GEHLERT, Frank KRÜGER
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Publication number: 20170331205Abstract: An electrical contact element includes a base body and a coating covering the base body at least in sections. The coating includes an inner layer and an outer layer. The inner layer is applied to the base body and the outer layer is applied to the inner layer and forms a surface at least in sections of the electrical contact element. The inner layer is made of tin and the outer layer of silver, and the outer layer has a thickness of 50 nm-5.0 ?m.Type: ApplicationFiled: November 18, 2015Publication date: November 16, 2017Applicant: HERAEUS DEUTSCHLAND GMBH & CO. KGInventors: Frank KRÜGER, Gerald FREISE
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Patent number: 9756730Abstract: A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator.Type: GrantFiled: October 21, 2011Date of Patent: September 5, 2017Assignee: OSRAM Opto Semiconductors GmbHInventors: Andreas Steffen Klein, Eckhard Ditzel, Frank Krüger, Michael Schumann
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Publication number: 20170133291Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.Type: ApplicationFiled: May 12, 2015Publication date: May 11, 2017Inventors: Ronald EISELE, Anton-Zoran MIRIC, Frank KRÜGER, Wolfgang SCHMITT
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Patent number: 9499891Abstract: A class of alloys is provided that form metallic glass upon cooling below the glass transition temperature Tg at a rate below 100° K/sec. The alloys have a high value of temperature difference (DT) between the crystallization temperature (Tx) and the glass transition temperature (Tg) of the intermetallic alloy. Such alloys comprise zirconium in the range of 70 to 80 weight percent, beryllium in the range of 0.8 to 5 weight percent, copper in the range of 1 to 15 weight percent, nickel in the range of 1 to 15 weight percent, aluminum in the range of 1 to 5 weight percent and niobium in the range of 0.5 to 3 weight percent, or narrower ranges depending on other alloying elements and the critical cooling rate and value of DT desired. Furthermore, methods are provided for making such metallic glasses.Type: GrantFiled: August 23, 2013Date of Patent: November 22, 2016Assignees: Heraeus Deutschland GmbH & Co. KG, Heraeus Materials Technology North America LLCInventors: Hans Jürgen Wachter, Frank Krüger, Bernd Kunkel, Xiaoyun Wang, Doug Shearer
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Patent number: 9127501Abstract: A lead system for a fire/smoke protection device that enables deployment/retraction of the device's flexible protection member relative to a building wall opening and improves the member's resistance to forces. The system comprises lead guides for guiding the flexible protection member between storage and protection configurations, for permitting stretching when a force is applied, and for transferring forces to the building. The guides are configured with the flexible protection member to slidably receive member loops extending about lead members. The guides and lead members are also configured to allow lead member movement and permit elastic deformation or destruction of connections between certain internal guide components, when a force is exerted on the flexible protection member. Additionally, the system comprises one or more members configured with a flexible protection member having a bar to enable bar movement during stretching of the flexible protection member responsive to a force.Type: GrantFiled: January 10, 2013Date of Patent: September 8, 2015Assignee: Stoebich Brandschutz GmbHInventors: Jochen Stöbich, Stefan Siller, Frank Krüger, Robert Knein-Linz
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Patent number: 9090975Abstract: One aspect is a method for the production of a three-dimensional structure of successive layers producing a multitude of successive layers wherein, with the exception of a first layer, each of the successive layers is arranged on a preceding layer. Each of the successive layers includes at least two materials wherein one material is a sacrificial material and one material is a structure material. Each of the successive layers defines a successive cross-section through the three-dimensional structure. Producing each of the layers includes depositing the sacrificial material by means of an electrochemical process and depositing the structure material by means of physical gas phase deposition. After a multitude of successive layers has been produced, the three-dimensional structure is uncovered by removing at least a part of the sacrificial material. The sacrificial material is at least one of a group consisting of nickel, silver, palladium, and gold.Type: GrantFiled: June 20, 2011Date of Patent: July 28, 2015Assignee: Heraeus Precious Metals GmbH & Co. KGInventors: Heiko Specht, Andreas Reisinger, Ulrich Hausch, Frank Krueger, Jens Troetzschel