Abstract: The invention provides a resection template for the resection of a bone. The resection template is equipped with a plate-shaped base part (1) having a front side (VS) and a rear side (RS), wherein the rear side (RS) has a bearing face (10) for bearing on the bone, wherein the front side (VS) has a fastening flange (2) which extends away from the front side (VS) and is arranged next to an end edge (K) of the base part (1) or a slot of the base part (1), a cutting guide attachment (20) which can be fitted onto the fastening flange (2) from a side (S2) of the fastening flange (2) opposite to the front side (VS), wherein the cutting guide attachment (20) has a saw slot (201) or a saw abutment for guiding a sawing tool, which slot or abutment is arranged along the end edge (K) of the base part (1) or along the slot of the base part (1) when the cutting guide attachment (20) is fitted on.

Abstract: A method for representing virtual information in a view of a real environment comprises providing a virtual object having a global position and orientation with respect to a geographic global coordinate system, with first pose data on the global position and orientation of the virtual object, in a database of a server, taking an image of a real environment by a mobile device and providing second pose data as to at which position and with which orientation with respect to the geographic global coordinate system the image was taken. The method further includes displaying the image on a display of the mobile device, accessing the virtual object in the database and positioning the virtual object in the image on the basis of the first and second pose data, manipulating the virtual object or adding a further virtual object, and providing the manipulated virtual object with modified first pose data or the further virtual object with third pose data in the database.

Abstract: The disclosure generally relates to compositions and methods for the production of nucleic acid molecules. In some aspects, the invention allows for the microscale generation of nucleic acid molecules, optionally followed by assembly of these nucleic acid molecules into larger molecules. In some aspects, the invention allows for efficient production of nucleic acid molecules (e.g., large nucleic acid molecules such as genomes).

Abstract: An aquarium or aquatic system such as a fish tank for the safe and clean containment of a plurality of aquatic specimens such as fish, segregated from one another by a series of divider panels aligned within that tank. The divider panels are spaced from the walls and floor of that tank so as to permit a “bottom current” flow of water under those divider panels to sweep away the debris accumulating in each of those chambers, and then into a collection unit such as a series of filters, filtration system or water processors which thus treats and cleans the water and preferably reintroduces that water back into the upstream end of that water flow.

Abstract: An aquarium or aquatic system such as a fish tank for the safe and clean containment of a plurality of aquatic specimens such as fish, segregated from one another by a series of divider panels aligned within that tank. The divider panels are spaced from the walls and floor of that tank so as to permit a “bottom current” flow of water under those divider panels to sweep away the debris accumulating in each of those chambers, and then into a collection unit such as a series of filters, filtration system or water processors which thus treats and cleans the water and preferably reintroduces that water back into the upstream end of that water flow.

Abstract: A radiation-emitting semiconductor chip, having a multilayer structure (100) containing a radiation-emitting active layer (10), and having a window layer (20), which is transmissive to a radiation emitted by the active layer (10) and is arranged downstream of the multilayer structure (100) in the direction of a main radiating direction of the semiconductor component. The window layer (20) has at least one peripheral side area (21), which, in the course from a first main area (22) facing the multilayer structure (100) in the direction toward a second main area (23) remote from the multilayer structure (100), firstly has a first side area region (24) which is beveled, curved or stepped in such a way that the window layer widens with respect to the size of the first main area (22). A peripheral side area (11) of the multilayer structure (100) and at least a part of the beveled, curved or stepped first side area region (24) are coated with a continuous electrically insulating layer (30).

Abstract: This invention describes a radiation-emitting semiconductor component with the a multilayered structure that contains a radiation-emitting active layer, and a window transparent to radiation that has a first principal face and a second principal face opposite the first principal face, and whose first principal face adjoins the multilayered structure. At least one recess is made in the window, which preferably has the form of an indentation of the second principal face or as an edge excavation. At least one lateral surface of the window or of the recess is provided at least partially with a contact surface. Alternatively or cumulatively, at least one contact surface of the component has a plurality of openings.

Abstract: This invention describes a radiation-emitting semiconductor component with the a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that has a first principal face (2) and a second principal face (3) opposite the first principal face (2), and whose first principal face (2) adjoins the multilayered structure (4). At least one recess (8) is made in the window (1), which preferably has the form of an indentation of the second principal face or as an edge excavation. At least one lateral surface of the window (1) or of the recess (8) is provided at least partially with a contact surface (11). Alternatively or cumulatively, at least one contact surface of the component has a plurality of openings (14).

Abstract: A semiconductor chip has a substrate that is in the form of a parallelepiped whose side surfaces are shaped as tilted parallelograms. Such a semiconductor chip has a high output efficiency and a homogeneous thermal load due to having at least two side surfaces that are provided with an acute angle and are in the form of parallelograms.

Abstract: The invention relates to a process for the production of ?-L-aspartyl-L-phenylalanine methyl ester (APM) powder wherein the upper limit of the particle size distribution (p.s.d.) of the powder, expressed as the d99, is controllable, wherein an APM starting material, comprising at least 5 wt % of APM particles larger than the d99 of the APM powder to be obtained, is subjected to treatment in at least one roller mill, each such roller mill comprising at least one roller pair, each roller pair consisting of two smooth rollers of which at least one is rotating such that the APM starting material, or APM intermediate powder for any second or further roller mill, is transported into the roller gap of said roller mill. The invention also relates to an APM powder with a d99 of <500 ?m produced by the process according to the invention and the use of said APM powder for the production of tablets by direct compression.

Abstract: A semiconductor chip has a substrate that is in the form of a parallelepiped whose side surfaces are shaped as tilted parallelograms. Such a semiconductor chip has a high output efficiency and a homogeneous thermal load due to having at least two side surfaces that are provided with an acute angle and are in the form of parallelograms.

Abstract: A semiconductor chip has a substrate that is in the form of a parallelepiped whose side surfaces are shaped as tilted parallelograms. Such a semiconductor chip has a high output efficiency and a homogeneous thermal load due to having at least two side surfaces that are provided with an acute angle and are in the form of parallelograms.

Abstract: A radiation-emitting semiconductor chip, having a multilayer structure (100) containing a radiation-emitting active layer (10), and having a window layer (20), which is transmissive to a radiation emitted by the active layer (10) and is arranged downstream of the multilayer structure (100) in the direction of a main radiating direction of the semiconductor component. The window layer (20) has at least one peripheral side area (21), which, in the course from a first main area (22) facing the multilayer structure (100) in the direction toward a second main area (23) remote from the multilayer structure (100), firstly has a first side area region (24) which is beveled, curved or stepped in such a way that the window layer widens with respect to the size of the first main area (22). A peripheral side area (11) of the multilayer structure (100) and at least a part of the beveled, curved or stepped first side area region (24) are coated with a continuous electrically insulating layer (30).

Abstract: In order to subdivide a wafer (1) into chips, recesses (7) are introduced from a rear side (6), said recesses weakening the wafer (1) at the breaking points. As a result, it is possible to produce chips whose length dimensions are less than twice the thickness of the chips.

Abstract: In order to subdivide a wafer (1) into chips, recesses (7) are introduced from a rear side (6), said recesses weakening the wafer (1) at the breaking points. As a result, it is possible to produce chips whose length dimensions are less than twice the thickness of the chips.

Abstract: This invention describes a radiation-emitting semiconductor component with the a multilayered structure (4) that contains a radiation-emitting active layer (5), and a window (1) transparent to radiation that has a first principal face (2) and a second principal face (3) opposite the first principal face (2), and whose first principal face (2) adjoins the multilayered structure (4).

Abstract: A semiconductor chip has a substrate that is in the form of a parallelepiped whose side surfaces are shaped as tilted parallelograms. Such a semiconductor chip has a high output efficiency and a homogeneous thermal load due to having at least two side surfaces that are provided with an acute angle and are in the form of parallelograms.

Abstract: The degradation of harmful substances in water by compounds, such as hydrogen peroxide, which form hydroxyl radicals under UV irradiation in continuous reactors is improved when the irradiation is carried out in a reactor with a specific reactor volume of at least 10 liters per kW of the UV radiator or radiators, and if the amount of water to be treated is 0.25 to 25 times the amount of the intrinsic volume of the reactor flows through the reactor per hour. It is particularly preferred that the water volume per hour to be treated is 0.25 to 10 times the intrinsic reactor volume.